Network Interfaces

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BCM53101MIMLG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL		132			PLASTIC/EPOXY	YES			CMOS				.2036 mA		1.2,2.5,3.3		SLGA132,18X18,20	Network Interfaces		70 Cel	0 Cel								Not Qualified
HI-1573PSM	Holt Integrated Circuits	MIL-STD-1553 DATA BUS TRANSCEIVER
LTC4257CS8#PBF	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1									SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.752 mm	3.9 mm	Not Qualified		e3	30	260	4.9025 mm
NQ83C92A	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		-9 V	1	130 mA		-9	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28		4.57 mm	11.505 mm	Not Qualified		e0			11.505 mm
PQ83C92A	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS		-9 V	1	130 mA		-9	IN-LINE	DIP16,.3	Network Interfaces	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T16		5.08 mm	7.62 mm	Not Qualified		e0			19.175 mm
RTL8201CP-LF	Realtek Semiconductor	MANCHESTER ENCODER/DECODER	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G48		1.7 mm	7 mm						7 mm
TJA1054AT	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					1	.027 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			NICKEL PALLADIUM GOLD	DUAL	.125 Mbps	R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified		e4			8.65 mm
TJA1054AT,512	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE			1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		e4			8.65 mm
TJA1054AT/M,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm						8.65 mm
TJA1054AT/VM,518	NXP Semiconductors	CAN TRANSCEIVER		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	.027 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			MATTE TIN	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified		e3			8.65 mm
TJA1057T	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G8		1.75 mm	3.9 mm				NOT SPECIFIED	NOT SPECIFIED	4.9 mm
TLE9271QXV33XUMA1	Infineon Technologies	CAN FD TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	10 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel	TIN	QUAD	5 Mbps	S-PQCC-N48	3	.9 mm	7 mm			e3			7 mm
88E1112-NNC	Marvell Technology
CYP15G0101DXB-BBI	Cypress Semiconductor	INTERFACE CIRCUIT	INDUSTRIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS			1		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B100	3	1.4 mm	11 mm	Not Qualified		e0			11 mm
FT3150-P20	Renesas Electronics	MANCHESTER ENCODER/DECODER	OTHER	GULL WING	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	1							5 V		FLATPACK, LOW PROFILE			.8 mm	85 Cel	-25 Cel		QUAD		S-PQFP-G64		1.6 mm	14 mm					235	14 mm
LAN8831/Q2A	Microchip Technology	ETHERNET TRANSCEIVER
MAX17841BGUE+	Analog Devices	INTERFACE CIRCUIT																							Matte Tin (Sn) - annealed				1					e3	30	260
MAX17841BGUE/V+	Analog Devices	INTERFACE CIRCUIT																							Matte Tin (Sn) - annealed				1					e3	30	260
MAX17841BGUE/V+CP	Analog Devices	INTERFACE CIRCUIT																							Matte Tin (Sn) - annealed				1					e3	30	260
MCP2557FDT-H/MNY	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20		.5 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-N8		.8 mm	2 mm			e4			3 mm
NQ83C92C	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES			CMOS		-9 V	1	120 mA		-9	CHIP CARRIER	LDCC28,.5SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-J28				Not Qualified		e0
RTL8201N-GR	Realtek Semiconductor
TLIN2027DRQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100		1	5 mA	14 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	1	1.75 mm	4.905 mm			e4	30	260	3.895 mm
UJA1162ATK/0Z	NXP Semiconductors	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	67 mA	13 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14	1	1 mm	3 mm		ESD FOR BAT, WAKE IS 3A AND CANH,CANL IS 3B			260	4.5 mm
VSC8504XKS-01	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1							1 V		GRID ARRAY			1 mm	125 Cel	0 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8575XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1					4	1890 mA	1 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm						17 mm
88E1112-XX-NNC1C000	Marvell Technology	ETHERNET TRANSCEIVER		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS					2.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-XQCC-N64		1 mm	9 mm						9 mm
AQR108-B0-IG-Y	Marvell Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	104	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	108 Cel	-40 Cel		BOTTOM		R-PBGA-B104		1.57 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	11 mm
ATA663231-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100		1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
DP83849IVS	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G80	3	1.2 mm	12 mm			e3			12 mm
IL41050TE	Nve	CAN TRANSCEIVER	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE			1.25 mm				DUAL		R-PDSO-G16		2.67 mm	7.455 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	10.3 mm
L9615D	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			1		5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	110 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified		e4			4.9 mm
LTC4257CDD#PBF	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1									SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4257CDD#TRPBF	Analog Devices	SUPPORT CIRCUIT	COMMERCIAL	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1									SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm	3 mm	Not Qualified		e3	30	260	3 mm
LTC4257IS8#PBF	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1									SMALL OUTLINE	SOP8,.24		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	1	1.752 mm	3.9 mm	Not Qualified		e3	30	260	4.9025 mm
MAX13051ASA	Maxim Integrated	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN LEAD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
MAX13051ASA+	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e3	30	260	4.9 mm
MAX13054ESA	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			1		5 V	3.3,5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
MAX13054ESA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			1		5 V	3.3,5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e3	30	260	4.9 mm
MCP2557FDT-H/SN	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949		1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	8 Mbps	R-PDSO-G8		1.75 mm	3.9 mm			e3			4.9 mm
MCZ33897EF	Freescale Semiconductor	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1									SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified		e3	40	260	8.65 mm
PTCAN1044DRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.895 mm						4.905 mm
RTL8201E-VB-GR	Realtek Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-PQCC-N32		1 mm	5 mm						5 mm
SN65HVD101RGBR	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 mA	24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		R-PQCC-N20	2	1 mm	3.5 mm			e4	NOT SPECIFIED	260	4 mm
TJA1022T/20,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100						SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm						8.65 mm
TJA1041T/VM,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified					8.65 mm
TJA1059TK	NXP Semiconductors	INTERFACE CIRCUIT		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100				5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm				DUAL		R-PDSO-N14	1	1 mm	3 mm						4.5 mm
TJA1081BTS,118	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		1	60 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.3	Network Interfaces	.65 mm	125 Cel	-40 Cel		DUAL	10 Mbps	R-PDSO-G16	1	2 mm	5.3 mm	Not Qualified			30	260	6.2 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.