Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
95 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
10518.75 Mbps |
S-PBGA-B256 |
3.22 mm |
17 mm |
e1 |
17 mm |
||||||||||||||
Intel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
160 |
HQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, HEAT SINK/SLUG |
.65 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G160 |
4.07 mm |
28 mm |
Not Qualified |
28 mm |
|||||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
OTHER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
Network Interfaces |
.4 mm |
85 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-XQCC-N48 |
.9 mm |
6 mm |
Not Qualified |
6 mm |
|||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.1 mA |
5 V |
3.3/5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Network Interfaces |
.8 mm |
70 Cel |
0 Cel |
QUAD |
10 Mbps |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||
Exar |
INTERFACE CIRCUIT |
||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-XQCC-N40 |
3 |
.8 mm |
6 mm |
ESD FOR TXN, TXP, RXN, RXP Pins is 3B |
260 |
6 mm |
||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
16 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1.15 mA |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-N16 |
.9 mm |
3 mm |
e3 |
5.5 mm |
||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2 mA |
13.5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.8 mm |
3.9 mm |
e4 |
4.9 mm |
||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
144 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1 V |
BOTTOM |
S-PBGA-B144 |
3 |
also operates with 3.3v nom supply |
260 |
|||||||||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
BALL |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
55 Cel |
0 Cel |
BOTTOM |
S-PBGA-B |
|||||||||||||||||||||||||||
|
Micrel |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQCC-N32 |
.9 mm |
5 mm |
Not Qualified |
5 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
1 mm |
5 mm |
e4 |
40 |
260 |
5 mm |
||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
128 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1.2 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.4 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G128 |
1.2 mm |
14 mm |
14 mm |
|||||||||||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G128 |
1.6 mm |
14 mm |
e3 |
14 mm |
|||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.2 mA |
5 V |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e0 |
10 mm |
||||||||||
Intel |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.11 mA |
3.3 V |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
10 mm |
||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
40 |
260 |
7 mm |
|||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.16,32 |
.8 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 mm |
4 mm |
e3 |
4 mm |
||||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
AUTOMOTIVE |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
1 |
78 mA |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Network Interfaces |
2.54 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T8 |
4.2 mm |
7.62 mm |
Not Qualified |
e4 |
9.5 mm |
|||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
AEC-Q100 |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.11 |
.65 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-G8 |
1 |
1.1 mm |
1.6 mm |
e4 |
260 |
2.9 mm |
||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
8.65 mm |
||||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
65 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
30 |
260 |
4.9 mm |
|||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
TIN |
DUAL |
R-PDSO-G14 |
3 |
1.75 mm |
4 mm |
e3 |
8.75 mm |
||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.02 Mbps |
S-PDSO-N8 |
2 |
1 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
|||||||||||
|
Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
144 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
700 mA |
1 V |
GRID ARRAY |
BGA144,12X12,40 |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
10312.5 Mbps |
S-PBGA-B144 |
4 |
3.25 mm |
13 mm |
Not Qualified |
e1 |
30 |
260 |
13 mm |
||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N48 |
.9 mm |
6 mm |
6 mm |
|||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
800 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
980 mA |
1 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
1890 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1 |
CMOS |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
3 |
30 |
260 |
||||||||||||||||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
104 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
108 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B104 |
1.57 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11 mm |
||||||||||||||||
|
Atmel |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.06 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
3.8 mm |
Not Qualified |
e3 |
40 |
260 |
4.925 mm |
||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK |
.65 mm |
85 Cel |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.4 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
|||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
100000 Mbps |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
e4 |
30 |
260 |
7 mm |
||||||||||||
|
Cortina Systems |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
2.5,2.5/3.3 |
FLATPACK |
QFP100,.7X.9 |
Network Interfaces |
.635 mm |
85 Cel |
-40 Cel |
QUAD |
100 Mbps |
R-PQFP-G100 |
Not Qualified |
||||||||||||||||||
Maxlinear |
ETHERNET TRANSCEIVER |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.28SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N56 |
.9 mm |
7 mm |
ALSO REQUIRE 1.8V,3.3V SUPPLY |
7 mm |
|||||||||||||||||
|
Renesas Electronics |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
|||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
NICKEL PALLADIUM GOLD SILVER |
1 |
e4 |
30 |
260 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1.2 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
.9 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
2 |
.9 mm |
4 mm |
e3 |
30 |
260 |
4 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
|||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N48 |
1 mm |
7 mm |
7 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
|||||||||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
e3 |
3 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.