Network Interfaces

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ATA6566-GBQW1-VAO	Microchip Technology	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		.9 mm	3 mm						3 mm
ATA663211-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
ATA6663-TAQY	Microchip Technology	SUPPORT CIRCUIT		GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						13.5 V		SMALL OUTLINE, LOW PROFILE			1.27 mm				DUAL		R-PDSO-G8		1.4 mm	3.8 mm	Not Qualified					4.9 mm
AW-CM276NF	Azurewave Technologies	WIRELESS LAN CIRCUIT		NO LEAD	130	TFLGA	RECTANGULAR	UNSPECIFIED	YES	1				1		3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH	LGA130,30X20,20		.5 mm	85 Cel	-30 Cel		BOTTOM	866.7 Mbps	R-XBGA-N130		1.85 mm	12 mm		OTHER DATA RATES ARE 400, 192.6, 300, 150, 54, 48, 36,24,18,12,6,11,5.5, 2,1 MBPS W.R.T DIFF WLAN				16 mm
BCM53115SKFBG	Broadcom	ETHERNET TRANSCEIVER
BCM89501BPBG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	176		SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	5											QUAD		S-PQFP-G176
CC3100R11MRGCR	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm			e4	30	260	9 mm
CC3120MODRNMMOBR	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	BUTT	63	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B63	3	2.45 mm	17.5 mm			e4	30	260	20.5 mm
DP83848MPHPREP	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Network Interfaces	.5 mm	125 Cel	-55 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQFP-G48	4	1.2 mm	7 mm			e4	30	260	7 mm
DP83TC814RRHATQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
DP83TC814SRHARQ1	Texas Instruments	ETHERNET TRANSCEIVER		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	95 mA	3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.24SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-PQCC-N36	3	1 mm	6 mm			e4		260	6 mm
DS33Z11	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169	3	1.5 mm	14 mm	Not Qualified					14 mm
DS33Z11+	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	BALL	169	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.8 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B169	3	1.5 mm	14 mm	Not Qualified		e1	30	260	14 mm
GD82559ER	Intel	ETHERNET TRANSCEIVER	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B196		1.75 mm	15 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	15 mm
GD82559ERSL3RB	Intel	ETHERNET TRANSCEIVER	OTHER	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY			1 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B196		1.75 mm	15 mm						15 mm
ICS1893CKLFT	Renesas Electronics	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified		e3	30	260	8 mm
KSZ8051MLLI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48	3	1.6 mm	7 mm			e3	30	260	7 mm
KSZ8091RNBCA-G3XX	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32		.9 mm	5 mm			e4			5 mm
KSZ8091RNBCA-G3XX-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949			3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		QUAD		S-XQCC-N32		.9 mm	5 mm						5 mm
KSZ8692PBI	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.33 mm	27 mm	Not Qualified		e1			27 mm
LAN8840/PSA	Microchip Technology	ETHERNET TRANSCEIVER
LAN8840T/PSA	Microchip Technology	ETHERNET TRANSCEIVER
LT3960JMSE#PBF	Analog Devices	INTERFACE CIRCUIT																										1						30	260
MAX14819ATM+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				24 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N48	1	.8 mm	7 mm			e3	30	260	7 mm
MAX33011EASA+	Analog Devices	CAN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	70 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	5 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm			e3	30	260	4.9 mm
MAX33053EASA+	Analog Devices	INTERFACE CIRCUIT																						Matte Tin (Sn) - annealed				1					e3	30	260
MAX33053EASA+T	Analog Devices	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e3	30	260	4.9 mm
MC33901SEF	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.065 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified		e3	40	260	4.9 mm
MC33FS4503CAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER											AEC-Q100															3						40	260
MC35FS6513CAER2	NXP Semiconductors	INTERFACE CIRCUIT											AEC-Q100															3						40	260
MCP2003BT-E/SNVAO	Microchip Technology	LIN TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
MCP2021A-330E/MD	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm
MCP2021A-330E/MDVAO	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel		DUAL		S-PDSO-N8		1 mm	4 mm						4 mm
MCP2022-330E/SL	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE	SOP14,.25		1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G14		1.75 mm	3.9 mm			e3			8.65 mm
MCZ33661EF	Freescale Semiconductor	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						13.5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm	Not Qualified		e3	40	260	4.9 mm
MCZ33889DEG	Freescale Semiconductor	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.018 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.125 Mbps	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e3	40	260	17.925 mm
MCZ33897AEF	Freescale Semiconductor	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified		e3	40	260	8.65 mm
MRF89XAM9AT-I/RM	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	UNSPECIFIED	12		RECTANGULAR	UNSPECIFIED	NO	1					.03 mA	3.3 V	2.5/3.3	MICROELECTRONIC ASSEMBLY	MODULE,12LEAD,.7	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDMA-X12			17.78 mm	Not Qualified		e3			27.94 mm
PCA82C250T/N,118	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
PEF21628EV1XSLL6S	Intel	INTERFACE CIRCUIT
PTCAN1046AVDMTRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	2	2		AEC-Q100	2		5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N14		1 mm	3 mm						4.5 mm
RN131G-I/RM481	Microchip Technology	WIRELESS LAN CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1		HYBRID				3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		QUAD		R-XQMA-N44		3.5 mm	20 mm						37 mm
SN55HVD251DRJR	Texas Instruments	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1	BICMOS		1	.065 mA	5 V	5	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32	Network Interfaces	.8 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	S-PDSO-N8	2	.8 mm	4 mm	Not Qualified		e4	NOT SPECIFIED	260	4 mm
SN65HVD1040HD	Texas Instruments	INTERFACE CIRCUIT	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			1	.07 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	175 Cel	-55 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	4	1.75 mm	3.91 mm	Not Qualified		e4	30	260	4.9 mm
TCAN1042DQ1	Texas Instruments	ETHERNET TRANSCEIVER	MILITARY	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	110 mA	5 V		SMALL OUTLINE			1.27 mm	125 Cel	-55 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	2 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm			e4	30	260	4.905 mm
TCAN1046AVDMTRQ1	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	2		AEC-Q100	2	260 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	150 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	8 Mbps	R-PDSO-N14	2	1 mm	3 mm			e4		260	4.4 mm
TCAN1046VDMTRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	2	2		AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL	8 Mbps	R-PDSO-N14	2	.9 mm	3 mm			e3	NOT SPECIFIED	260	4.5 mm
TLIN10283SDRQ1	Texas Instruments	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	80 mA	12 V		SMALL OUTLINE	SOP8,.23		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	.1 Mbps	R-PDSO-G8	1	1.75 mm	3.895 mm			e4	30	260	4.905 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.