Network Interfaces

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TJA1041T/N,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified		e0			8.65 mm
TJA1054AT/S900,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		e4			8.65 mm
TLE7250LEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	HTSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.15 mm	3 mm			e3			3 mm
TLE7250VLEXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	8	SON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE			.65 mm			TIN	DUAL		S-PDSO-N8	2A	1.1 mm	3 mm			e3			3 mm
TLK106LRHBT	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1				4		1.55 V		CHIP CARRIER				105 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	100 Mbps	S-XQCC-N32	2					e4	NOT SPECIFIED	260
TLK1211RCP	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.113 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified		e4	30	260	10 mm
TMC8462-BA	Analog Devices	INTERFACE CIRCUIT
UJA1018TK	NXP Semiconductors	LIN TRANSCEIVER		NO LEAD	16	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	4.5 mA	12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC16,.13,25		.65 mm	150 Cel	-40 Cel		DUAL		R-PDSO-N16		1 mm	5.5 mm						3.5 mm
UJA1069TW24/3V3,51	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	24	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	2	1.1 mm	4.4 mm	Not Qualified		e4			7.8 mm
UJA1069TW24/3V3:51	NXP Semiconductors	ETHERNET TRANSCEIVER	AUTOMOTIVE	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	2	1.1 mm	4.4 mm	Not Qualified		e4			7.8 mm
UJA1075ATW/3V3/WDJ	NXP Semiconductors	ETHERNET TRANSCEIVER																						NICKEL PALLADIUM GOLD SILVER				1					e4	30	260
UJA1168TK/VX/FDJ	NXP Semiconductors	CAN TRANSCEIVER		NO LEAD	14	SON	RECTANGULAR	PLASTIC/EPOXY	YES				AEC-Q100	1	67 mA		3/28	SMALL OUTLINE	SOLCC14,.12,25	Network Interfaces	.635 mm			NICKEL PALLADIUM GOLD SILVER	DUAL	1 Mbps	R-PDSO-N14	1			Not Qualified		e4	30	260
VSC8489YJU-13	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V		GRID ARRAY, LOW PROFILE			1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm						15 mm
VSC8552XKS-04	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1						1 V		GRID ARRAY			1 mm	125 Cel	-40 Cel		BOTTOM		S-PBGA-B256		1.8 mm	17 mm						17 mm
VSC8584XKS-14	Microchip Technology	ETHERNET TRANSCEIVER	AUTOMOTIVE	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4	1890 mA	2.5 V		GRID ARRAY	BGA256,16X16,40		1 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		1.8 mm	17 mm			e1			17 mm
WJLXT972ALC.A4SE000	Intel	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3			10 mm
1893CKILF	Renesas Electronics	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.16 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-PQCC-N56	3	1 mm	8 mm	Not Qualified		e3	30	260	8 mm
ATA6565-GCQW1	Microchip Technology	CAN TRANSCEIVER	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	2			AEC-Q100	2	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	85 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	4.5 mm
ATA6660	Atmel	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BCDMOS		1	.06 mA	5 V	5	SMALL OUTLINE, LOW PROFILE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN LEAD	DUAL	1 Mbps	R-PDSO-G8		1.65 mm	3.8 mm	Not Qualified		e0			4.925 mm
ATA6660-TAQ	Atmel		AUTOMOTIVE	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE, LOW PROFILE			1.27 mm	125 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.65 mm	3.8 mm			e0			4.925 mm
BCM53128IQLEG	Broadcom	ETHERNET TRANSCEIVER		GULL WING	256	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		8		1.2 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP256,1.2SQ,16		.4 mm	85 Cel	-45 Cel		QUAD	1000 Mbps	S-PQFP-G256	3	1.6 mm	28 mm		TMII MODE SUPPORTS 200 MBPS DATA RATE				28 mm
BCM5482A2KFB	Broadcom
BCM5482A2KFBG	Broadcom
EP82562G	Intel	INTERFACE CIRCUIT	OTHER	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	0 Cel		DUAL		R-PDSO-G48		2.74 mm	7.5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	15.85 mm
KSZ8081RNDCA-G3XX	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N24		.9 mm	4 mm			e3			4 mm
KSZ8081RNDCA-G3XX-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N24		.9 mm	4 mm			e3			4 mm
KSZ8091MLXCA-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	100 Mbps	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
KSZ8721B-TR	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		1		2.5 V		SMALL OUTLINE, SHRINK PITCH	TSSOP48,.40		.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	100 Mbps	R-PDSO-G48		2.794 mm	7.493 mm			e3			15.875 mm
LAN8810-AKZE	Microchip Technology	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V	1.2,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N72		1 mm	10 mm	Not Qualified		e3			10 mm
MAX13051ESA	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e0			4.9 mm
MAX13051ESA+	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		1	.072 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e3	30	260	4.9 mm
MC33FS6522LAER2	NXP Semiconductors	CAN FD/LIN TRANSCEIVER											AEC-Q100															3						40	260
MCP2021-330E/SN	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e3		260	4.9 mm
MCP2021-500E/SN	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm			e3		260	4.9 mm
MCP2561T-H/MF	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	1 mm	3 mm			e3	40	260	3 mm
NCV7342MW3R2G	Onsemi	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSSON	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100	1	.075 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	S-PDSO-N8	1	.9 mm	3 mm			e3	30	260	3 mm
PTCAN1044ADRBRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1		5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-N8
PTCAN1044ADRQ1	Texas Instruments	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1		5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel		DUAL	8 Mbps	R-PDSO-G8		1.71 mm	3.895 mm						4.905 mm
PTCAN3414DRBR	Texas Instruments	CAN FD TRANSCEIVER		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	1			1	60 mA	3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel		DUAL	8 Mbps	S-PDSO-N8		1 mm	3 mm						3 mm
PX1011BI-EL1/G,557	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B81	3	1.6 mm	9 mm	Not Qualified				260	9 mm
RN-131G	Microchip Technology	LAN SWITCHING CIRCUIT	OTHER	NO LEAD	44		RECTANGULAR	UNSPECIFIED	YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			2 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N44		3.5 mm	20 mm				NOT SPECIFIED	NOT SPECIFIED	37 mm
SI4468-A2A-IM	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
TJA1041T/N1,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified		e4			8.65 mm
TLE6251DSXUMA2/SAMPLE	Infineon Technologies	INTERFACE CIRCUIT
TLE7263EXUMA2	Infineon Technologies	LAN SWITCHING CIRCUIT		GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						13.5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm				DUAL		R-PDSO-G36		2.55 mm	7.6 mm				NOT SPECIFIED	NOT SPECIFIED	12.8 mm
TLE9251SJXUMA1	Infineon Technologies	CAN FD TRANSCEIVER		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	48 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	150 Cel	-40 Cel	NICKEL GOLD PALLADIUM	DUAL	5 Mbps	R-PDSO-G8	2A	1.73 mm	3.94 mm						4.93 mm
TLE92613BQXV33XUMA2	Infineon Technologies	CAN FD, LIN TRANSCEIVER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	6.5 mA	13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	150 Cel	-40 Cel		QUAD		S-PQCC-N48	3	.9 mm	7 mm						7 mm
TLIN10283DDARQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	300 mA	6.1 V		SMALL OUTLINE, HEAT SINK/SLUG	SOP8,.25		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	2	1.75 mm	3.9 mm			e4	30	260	4.9 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.