Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Cypress Semiconductor |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
4 |
1.32 mA |
3.3 V |
3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA256,20X20,50 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
1500 Mbps |
S-PBGA-B256 |
3 |
1.745 mm |
27 mm |
Not Qualified |
e1 |
20 |
260 |
27 mm |
||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
||||||
Maxim Integrated |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
.8 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||||||||
|
Analog Devices |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N32 |
1 |
.8 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
||||||||||||
|
Diodes Incorporated |
LAN SWITCHING CIRCUIT |
NO LEAD |
42 |
QCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER |
QUAD |
R-XQCC-N42 |
||||||||||||||||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
4 mm |
|||||||||||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
e3 |
4 mm |
||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.045 mA |
13 V |
12 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
.1 Mbps |
R-PDSO-G8 |
2 |
1.75 mm |
3.9 mm |
Not Qualified |
30 |
260 |
4.9 mm |
||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.1 mA |
5 V |
3.3/5 |
CHIP CARRIER |
LDCC28,.5SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
10 Mbps |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e3 |
40 |
260 |
11.5062 mm |
|||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
FLATPACK |
125 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-PQFP-G48 |
3 |
40 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
CAN FD/LIN TRANSCEIVER |
AEC-Q100 |
3 |
40 |
260 |
|||||||||||||||||||||||||||||||||
Intel |
INTERFACE CIRCUIT |
BALL |
324 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BOTTOM |
R-PBGA-B324 |
||||||||||||||||||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
UNSPECIFIED |
16 |
SQUARE |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
UNSPECIFIED |
S-XXMA-X16 |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
85 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-XQCC-N48 |
.9 mm |
6 mm |
6 mm |
|||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
BUTT |
96 |
BCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 |
1 V |
1,2.5 |
CHIP CARRIER |
SLGA96,15X15,24 |
Network Interfaces |
.6 mm |
BOTTOM |
1000 Mbps |
S-XBCC-B96 |
.8 mm |
9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
|||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
BALL |
224 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B224 |
||||||||||||||||||||||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1 |
CMOS |
|||||||||||||||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1 |
CMOS |
TIN |
e3 |
||||||||||||||||||||||||||||||
|
Broadcom |
TELECOM CIRCUIT |
BALL |
1152 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.85 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA1152,34X34,40 |
1 mm |
105 Cel |
0 Cel |
BOTTOM |
12500 Mbps |
S-PBGA-B1152 |
3.21 mm |
35 mm |
35 mm |
||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
1 |
2.5 V |
||||||||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
132 |
PLASTIC/EPOXY |
YES |
CMOS |
.2036 mA |
1.2,2.5,3.3 |
SLGA132,18X18,20 |
Network Interfaces |
70 Cel |
0 Cel |
Not Qualified |
|||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
3 |
||||||||||||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
311 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.65 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B311 |
3 |
1.337 mm |
13 mm |
e1 |
13 mm |
||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
3 |
||||||||||||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
1 |
8 |
1000 Mbps |
|||||||||||||||||||||||||||||||||||
Broadcom |
ETHERNET TRANSCEIVER |
1 |
8 |
1000 Mbps |
|||||||||||||||||||||||||||||||||||
Broadcom |
|||||||||||||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B484 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1 V |
BOTTOM |
10000 Mbps |
S-PBGA-B |
3 |
260 |
||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
1365 |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BGA1365(UNSPEC) |
BOTTOM |
S-PBGA-B1365 |
4 |
245 |
||||||||||||||||||||||||||
Broadcom |
SUPPORT CIRCUIT |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
1 |
UNSPECIFIED |
900000 Mbps |
X-XXSS-X |
|||||||||||||||||||||||||||||||
Cypress Semiconductor |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
4 |
1.32 mA |
3.3 V |
3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA256,20X20,50 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
1500 Mbps |
S-PBGA-B256 |
3 |
1.745 mm |
27 mm |
Not Qualified |
e0 |
27 mm |
|||||||||
Intel |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
Intel |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.1 mA |
5 V |
3.3/5 |
FLATPACK, LOW PROFILE |
QFP32,.35SQ,32 |
Network Interfaces |
.8 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
10 Mbps |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
||||||||||
|
Silicon Labs |
WIRELESS LAN CIRCUIT |
NO LEAD |
58 |
QMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
.85 mm |
85 Cel |
-40 Cel |
QUAD |
65 Mbps |
R-XQMA-N58 |
13.7 mm |
12.9 mm |
|||||||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
BALL |
24 |
BGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
GRID ARRAY |
BOTTOM |
R-XBGA-B24 |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||
|
Skyworks Solutions |
WIRELESS LAN CIRCUIT |
3 |
260 |
|||||||||||||||||||||||||||||||||||
|
Silicon Labs |
MATTE TIN |
2 |
e3 |
40 |
260 |
|||||||||||||||||||||||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
.4 mm |
85 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-XQCC-N48 |
.9 mm |
6 mm |
6 mm |
|||||||||||||||||
Marvell Technology |
ETHERNET TRANSCEIVER |
BUTT |
96 |
BCC |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 V |
CHIP CARRIER |
.6 mm |
BOTTOM |
S-XBCC-B96 |
.8 mm |
9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CHIP CARRIER |
Tin (Sn) |
QUAD |
S-XQCC-N48 |
e3 |
|||||||||||||||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N64 |
1 mm |
9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.