Network Interfaces

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
88E6083-B0-LGR1C000	Marvell Technology	ETHERNET TRANSCEIVER					UNSPECIFIED	UNSPECIFIED		1		CMOS																						NOT SPECIFIED	NOT SPECIFIED
AC101TF	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G80		1.2 mm	12 mm	Not Qualified					12 mm
ATA6624-PGQW	Atmel	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		1 mm	5 mm	Not Qualified					5 mm
B10011S-MFPG1Y	Atmel	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		5 V	5,7/32	SMALL OUTLINE	SOP16,.25	Network Interfaces	1.27 mm	105 Cel	-40 Cel	MATTE TIN	DUAL	.25 Mbps	R-PDSO-G16	1	1.75 mm	3.8 mm	Not Qualified		e3		260	9.9 mm
BCM5308EKTB	Broadcom	ETHERNET TRANSCEIVER		BALL	352	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		8		3.3 V		GRID ARRAY							BOTTOM		R-PBGA-B352
BCM53134MKFBG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm						11 mm
BCM54182B0KQLEG	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	NO LEAD	128	QCCN	RECTANGULAR	UNSPECIFIED	YES	1		CMOS		8				CHIP CARRIER				70 Cel	0 Cel		QUAD		R-XQCC-N128
BCM54185B0IFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	400	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		8				GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-PBGA-B400
BCM54216EB1IMLG	Broadcom	ETHERNET TRANSCEIVER		NO LEAD	68	QCCN	RECTANGULAR	UNSPECIFIED	YES	1		CMOS		1				CHIP CARRIER							QUAD		R-XQCC-N68
BCM5482SA1KFB	Broadcom
BCM5482SA2KFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	121	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		2				GRID ARRAY						TIN SILVER COPPER	BOTTOM	1000 Mbps	R-PBGA-B121	3					e1		260
BCM56450B1IFSBG	Broadcom	SUPPORT CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1		CMOS													UNSPECIFIED	102500 Mbps	X-XXSS-X	4							245
BCM8705LBIFB	Broadcom	ETHERNET TRANSCEIVER		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1				GRID ARRAY	BGA256(UNSPEC)						BOTTOM	10518.8 Mbps	S-PBGA-B256
BCM89610A2BMLG	Broadcom	ETHERNET TRANSCEIVER		BALL	48	BGA		PLASTIC/EPOXY	YES	1		CMOS	AEC-Q100					GRID ARRAY							BOTTOM									NOT SPECIFIED	NOT SPECIFIED
BCM957416A4160C	Broadcom	ETHERNET TRANSCEIVER
BD41000AFJ-CE2	ROHM	INTERFACE CIRCUIT																																NOT SPECIFIED	NOT SPECIFIED
BD41020FJ-CE2	ROHM	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						12 V		SMALL OUTLINE, LOW PROFILE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.65 mm	3.9 mm				NOT SPECIFIED	NOT SPECIFIED	4.9 mm
BD41044FJ-CE2	ROHM	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	LSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100			5 V		SMALL OUTLINE, LOW PROFILE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G8		1.65 mm	3.9 mm				NOT SPECIFIED	NOT SPECIFIED	4.9 mm
CYP15G0201DXB-BBXI	Infineon Technologies	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		2	.71 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Network Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified		e1		260	15 mm
CYP15G0401DXB-BGI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4		3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e0			27 mm
CYV15G0101DXB-BBXC	Infineon Technologies	INTERFACE CIRCUIT	COMMERCIAL	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		1	.5 mA	3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA100,10X10,40	Network Interfaces	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B100	3	1.4 mm	11 mm	Not Qualified		e1	20	260	11 mm
ELLXT971ABE.A4	Intel	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	64	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B64		1.26 mm	7 mm	Not Qualified			40	260	7 mm
HIP7010P	Intersil	INTERFACE CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		CMOS				5 V		IN-LINE			2.54 mm	125 Cel	-40 Cel	TIN LEAD	DUAL		R-PDIP-T14		5.33 mm	7.62 mm	Not Qualified		e0			19.17 mm
IP1001LF	Ic Plus
MC33889BDW	Freescale Semiconductor	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.018 mA	13.5 V	5.5/18	SMALL OUTLINE	SOP28,.4	Network Interfaces	1.27 mm	125 Cel	-40 Cel	TIN LEAD	DUAL	.125 Mbps	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified		e0	30	240	17.925 mm
SI4468-A2A-IMR	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e3	40	260	4 mm
SKY85330-11	Skyworks Solutions	WIRELESS LAN CIRCUIT		NO LEAD	16		SQUARE	UNSPECIFIED	YES	1								MICROELECTRONIC ASSEMBLY							QUAD		S-XQMA-N16							NOT SPECIFIED	NOT SPECIFIED
SKY85743-31	Skyworks Solutions	WIRELESS LAN CIRCUIT		UNSPECIFIED	24		RECTANGULAR	UNSPECIFIED	NO	1								MICROELECTRONIC ASSEMBLY							UNSPECIFIED		R-XXMA-X24							NOT SPECIFIED	NOT SPECIFIED
WBLXT9785HED0	Intel	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	208	HFQFP	SQUARE	PLASTIC/EPOXY	YES	1						2.5 V		FLATPACK, HEAT SINK/SLUG, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G208		4.1 mm	28 mm	Not Qualified					28 mm
WF200SD	Silicon Labs																							MATTE TIN				2					e3	40	260
WG82567LMSLAVV	Intel	ETHERNET TRANSCEIVER	OTHER	NO LEAD	56	QCCN	SQUARE	PLASTIC/EPOXY	YES					1			1.05,1.8,3.3	CHIP CARRIER	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N56	1			Not Qualified		e3
WG82567V/SLAW7	Intel	ETHERNET TRANSCEIVER	OTHER	NO LEAD	56	QCCN	SQUARE	PLASTIC/EPOXY	YES					1			1.05,1.8,3.3	CHIP CARRIER	LCC56,.31SQ,20	Network Interfaces	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N56	1			Not Qualified		e3
WGI219VSLKJ5	Intel	ETHERNET TRANSCEIVER
ATA6570-GNQW1	Microchip Technology	CAN FD TRANSCEIVER	AUTOMOTIVE	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	1.5 mA	13 V		SMALL OUTLINE	SOP14,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	R-PDSO-G14		1.75 mm	3.9 mm		Also Operates as CAN Transceiver with data rate up to 1000kbps	e3			8.65 mm
ATA6624C-PGQW-1	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	53 mA			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.2SQ,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20		.9 mm	5 mm			e3			5 mm
KSZ8051MNLV-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm			e3			5 mm
KSZ8051RNLUB-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm			e4			5 mm
VSC8664XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	90 Cel	0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm
VSC8664XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				4		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm			e1			17 mm
ATA6562-GBQW1	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100; TS 16949	1	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	125 Cel	-40 Cel		DUAL	5 Mbps	S-PDSO-N8		1 mm	3 mm				NOT SPECIFIED	NOT SPECIFIED	3 mm
ATA6564-GAQW0	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	85 mA	5 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm						4.9 mm
ATA663255-GBQW	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.95 mA	13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	3 mm			e3			3 mm
CC3120RNMARGKR	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm			e4	30	260	9 mm
CC3120RNMARGKT	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm			e4	30	260	9 mm
HI-25850LBT	Holt Integrated Circuits	MIL-STD-1553 DATA BUS TRANSCEIVER																																NOT SPECIFIED	NOT SPECIFIED
HVDA540QDRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1		5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
HVDA541QDRQ1	Texas Instruments	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1		5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
KS8001LI	Micrel	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		1.8 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	100 Mbps	S-PQFP-G48	3	1.6 mm	7 mm	Not Qualified		e0	30	240	7 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.