Network Interfaces

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TLIN10285DDARQ1	Texas Instruments	LIN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1		AEC-Q100	1	300 mA	6.1 V		SMALL OUTLINE, HEAT SINK/SLUG	SOP8,.25		1.27 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	.02 Mbps	R-PDSO-G8	2	1.75 mm	3.9 mm			e4	30	260	4.9 mm
TUSB1210BRHBTQ1	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N32	2	1 mm	5 mm			e4	NOT SPECIFIED	260	5 mm
VSC8489YJU-02	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				2	150 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm						15 mm
VSC8662XIC	Microchip Technology	ETHERNET TRANSCEIVER	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	90 Cel	0 Cel		BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm						17 mm
AT86RF230-ZU	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		1		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	.25 Mbps	S-XQCC-N32		1 mm	5 mm						5 mm
MCP2021A-500E/SN	Microchip Technology	CAN TRANSCEIVER	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE	SOP8,.25		1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G8		1.75 mm	3.9 mm			e3			4.9 mm
MCP2025T-500E/MD	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1			TS 16949	1		12 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16,32		.8 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm
TJA1022T/10,118	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100					SMALL OUTLINE			1.27 mm				DUAL		R-PDSO-G14		1.75 mm	3.9 mm						8.65 mm
TJA1041T/N1,518	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE			1.27 mm			NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	3	1.75 mm	3.9 mm	Not Qualified		e4			8.65 mm
TLE7263E	Infineon Technologies	LAN SWITCHING CIRCUIT		GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						13.5 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.65 mm				DUAL		R-PDSO-G36	3	2.55 mm	7.6 mm	Not Qualified				260	12.8 mm
88E1121RA0-TFE1C000	Marvell Technology	ETHERNET TRANSCEIVER		GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1.2 V		FLATPACK							QUAD		S-PQFP-G100							NOT SPECIFIED	NOT SPECIFIED
DP83955AV	National Semiconductor	ETHERNET TRANSCEIVER	COMMERCIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			250 mA	5 V	5	CHIP CARRIER	LDCC84,1.2SQ	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J84				Not Qualified		e0
88E1111-B2-BAB-I000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	117	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		1		1 V		GRID ARRAY, LOW PROFILE	BGA117,9X13,40		1 mm				BOTTOM	1000 Mbps	R-PBGA-B117		1.54 mm	10 mm	Not Qualified	IT ALSO REQUIRES 2.5V DIGITAL SUPPLY				14 mm
MC33FS6502LAE	NXP Semiconductors	CAN FD/LIN TRANSCEIVER											AEC-Q100															3						40	260
BCM5482SHEA2IFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	121	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS						GRID ARRAY							BOTTOM		R-PBGA-B121							NOT SPECIFIED	NOT SPECIFIED
MCP2025-330E/P	Microchip Technology	LIN TRANSCEIVER	AUTOMOTIVE	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			TS 16949	1		12 V		IN-LINE	DIP8,.3		2.54 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T8		5.334 mm	7.62 mm			e3			9.271 mm
SKY85333-11	Skyworks Solutions	WIRELESS LAN CIRCUIT		NO LEAD	24		RECTANGULAR	UNSPECIFIED	YES	1								CHIP CARRIER							BOTTOM		R-XBGA-N24	3							260
88E6185-A2-LKJ1I000	Marvell Technology	ETHERNET TRANSCEIVER		GULL WING	128	LFQFP	RECTANGULAR	UNSPECIFIED	YES	1		CMOS						FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20		.5 mm			TIN	QUAD	1000 Mbps	R-PQFP-G128		1.6 mm	14 mm			e3			20 mm
BCM5461A1KPFG	Broadcom
PEF22628EV1XSLL79	Intel	INTERFACE CIRCUIT		BALL	324	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1				GRID ARRAY	BGA324(UNSPEC)						BOTTOM		R-PBGA-B324
88E1145-E1-BBM1C000	Marvell Technology	ETHERNET TRANSCEIVER		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1																1000 Mbps
88E6095-A3-TAH1C000	Marvell Technology	ETHERNET TRANSCEIVER		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1		CMOS														1000 Mbps
88X2222-B0-BKP2C000	Marvell Technology	ETHERNET TRANSCEIVER		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1		1 V		GRID ARRAY	BGA324,18X18,40		1 mm	70 Cel	0 Cel		BOTTOM	10300 Mbps	S-PBGA-B324		2.82 mm	19 mm						19 mm
BCM53125MIMMLG	Broadcom	ETHERNET TRANSCEIVER		BALL	186		SQUARE	PLASTIC/EPOXY	YES	1				1					BGA186(UNSPEC)						BOTTOM		S-PBGA-B186	3
VSC8254YMR-01	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B256		2.7 mm	17 mm			e1			17 mm
WF200D	Silicon Labs																							MATTE TIN				2					e3	40	260
88E6083-B0-LGR1-I000	Marvell Technology	ETHERNET TRANSCEIVER		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1		CMOS												TIN									e3
BCM54210SB0KMLG	Broadcom	ETHERNET TRANSCEIVER								1		CMOS		1												1000 Mbps		3							260
CYP15G0403DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
MAX2829ETN	Maxim Integrated	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.7 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.8 mm	8 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	8 mm
MAX2829ETN+	Analog Devices	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS				2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-XQCC-N56	3	.8 mm	8 mm	Not Qualified		e3	30	260	8 mm
NCV7340D13R2G	Onsemi	INTERFACE CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100	1	.075 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	1 Mbps	R-PDSO-G8	2	1.7272 mm	3.937 mm	Not Qualified		e3	30	260	4.9276 mm
TJA1041T	NXP Semiconductors	INTERFACE CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	.08 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Network Interfaces	1.27 mm			NICKEL PALLADIUM GOLD	DUAL	1 Mbps	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		e4			8.65 mm
WF200DR	Silicon Labs																							MATTE TIN				2					e3	40	260
BCM54220SB0KFBG	Broadcom	ETHERNET TRANSCEIVER		BALL	144		RECTANGULAR	PLASTIC/EPOXY	YES	1				2		1 V		GRID ARRAY							BOTTOM	1000 Mbps	R-PBGA-B144	3							260
BCM82793AKFSBG	Broadcom	SUPPORT CIRCUIT					SQUARE					CMOS														25000 Mbps
BCM88370CB0KFSBG	Broadcom	SUPPORT CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1															UNSPECIFIED	800000 Mbps	X-XXSS-X	4							245
CYP15G0401DXB-BGXC	Infineon Technologies	ETHERNET TRANSCEIVER	COMMERCIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.1 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified		e1	20	260	27 mm
EZX557AT2SLKVX	Intel	SUPPORT CIRCUIT	COMMERCIAL	BALL		BGA	SQUARE	PLASTIC/EPOXY	YES	1								GRID ARRAY				55 Cel	0 Cel		BOTTOM	10000 Mbps	S-PBGA-B							NOT SPECIFIED	NOT SPECIFIED
HFBR-5803T	Broadcom	ETHERNET TRANSCEIVER	COMMERCIAL	UNSPECIFIED	9		RECTANGULAR	UNSPECIFIED	NO	1						3.3 V		FIBER OPTIC				70 Cel	0 Cel		UNSPECIFIED		R-XXFO-X9				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
MAX33014EATB+	Analog Devices	CAN TRANSCEIVER		NO LEAD	10	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1	70 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC10,.12,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	5 Mbps	R-PDSO-N10	1	.8 mm	3 mm			e4	30	260	4 mm
NCV7357MW0R2G	Onsemi	CAN FD TRANSCEIVER	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1	105 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25		.65 mm	150 Cel	-40 Cel	MATTE TIN	DUAL	5 Mbps	S-XDSO-N8	1	.9 mm	3 mm			e3	30	260	3 mm
SI4464-B1B-FM	Silicon Labs	MANCHESTER ENCODER/DECODER	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm			e3			4 mm
SI4467-A2A-IMR	Silicon Labs	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		QUAD		S-XQCC-N20		.9 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
SKY85334-11	Skyworks Solutions	WIRELESS LAN CIRCUIT		BALL	16	BGA	SQUARE	UNSPECIFIED	YES	1								GRID ARRAY							BOTTOM		S-XBGA-B16							NOT SPECIFIED	NOT SPECIFIED
TLE9271QXXUMA1	Infineon Technologies	INTERFACE CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			AEC-Q100			13.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			TIN	QUAD		S-PQCC-N48	3	.9 mm	7 mm			e3			7 mm
BCM54991LB0IFEBG	Broadcom	ETHERNET TRANSCEIVER		BALL			SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		.8 V									BOTTOM	5000 Mbps	S-PBGA-B
BCM957414A4142CC	Broadcom	ETHERNET TRANSCEIVER

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.