Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G48 |
1.6 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
||||||||||||||||
|
Micrel |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N24 |
2 |
.9 mm |
4 mm |
e4 |
40 |
260 |
4 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
1 |
58.3 mA |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
100 Mbps |
S-XQCC-N32 |
1 mm |
5 mm |
5 mm |
||||||||||||||||
|
Microchip Technology |
SUPPORT CIRCUIT |
COMMERCIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.3 V |
GRID ARRAY |
1.27 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B400 |
3 |
2.33 mm |
27 mm |
Not Qualified |
e1 |
27 mm |
|||||||||||||||
|
Microchip Technology |
SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63SQ,16 |
.4 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G128 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
|||||||||||
|
Microchip Technology |
SUPPORT CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP128,.63SQ,16 |
.4 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G128 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
14 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
FLATPACK, FINE PITCH |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
20 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
72 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
1.2,2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC72,.39SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N72 |
1 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
7 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e3 |
30 |
260 |
4.9 mm |
||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e3 |
30 |
260 |
4.9 mm |
||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e3 |
30 |
260 |
4.9 mm |
||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
e3 |
4.9 mm |
|||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e3 |
30 |
260 |
4.9 mm |
|||||||||||
|
Infineon Technologies |
CAN FD, LIN TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
2 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.28SQ,20 |
.5 mm |
150 Cel |
-40 Cel |
TIN |
QUAD |
5 Mbps |
S-PQCC-N48 |
3 |
.9 mm |
7 mm |
7 mm |
|||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.113 mA |
2.5 V |
2.5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1300 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
30 |
260 |
6 mm |
||||||
|
Microchip Technology |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
7500 mA |
1 V |
GRID ARRAY |
BGA672,26X26,40 |
1 mm |
110 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B672 |
2.71 mm |
27 mm |
e1 |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
8400 mA |
1 V |
GRID ARRAY |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B672 |
4 |
2.71 mm |
27 mm |
27 mm |
|||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
260 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
1.2 V |
GRID ARRAY, HEAT SINK/SLUG |
BGA260,18X18,40 |
1 mm |
100 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1000 Mbps |
S-PBGA-B260 |
4 |
2 mm |
19 mm |
e1 |
30 |
260 |
19 mm |
||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1130 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1130 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
NOT SPECIFIED |
NOT SPECIFIED |
17 mm |
|||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
GULL WING |
128 |
HFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
4 |
.0001 mA |
5 V |
5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP128,.7X.93,20 |
Network Interfaces |
.5 mm |
QUAD |
R-PQFP-G128 |
3.1 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
1600 Mbps |
S-PQFP-G64 |
1 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
|||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.8 V |
1.8,1.8/2.5 |
GRID ARRAY |
BGA289,17X17,40 |
Network Interfaces |
1 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1300 Mbps |
S-PBGA-B289 |
3 |
2 mm |
19 mm |
Not Qualified |
e1 |
30 |
260 |
19 mm |
|||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
12 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N12 |
2 |
1 mm |
3 mm |
e4 |
30 |
260 |
4 mm |
|||||||||||||
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
BALL |
161 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1.2 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
125 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B161 |
1.17 mm |
10.4 mm |
10.4 mm |
|||||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
330 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
1250 Mbps |
S-PQFP-G64 |
1.2 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1600 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-9 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J20 |
4.572 mm |
8.94 mm |
Not Qualified |
8.94 mm |
|||||||||||||||||||
Texas Instruments |
TOKEN RING TRANSCEIVER |
COMMERCIAL |
GULL WING |
52 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
5 V |
5 |
FLATPACK, THIN PROFILE |
TQFP52,.47SQ,25 |
Network Interfaces |
.65 mm |
70 Cel |
0 Cel |
QUAD |
16 Mbps |
S-PQFP-G52 |
1.2 mm |
10 mm |
Not Qualified |
10 mm |
|||||||||||||
Texas Instruments |
TOKEN RING TRANSCEIVER |
OTHER |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.23 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Network Interfaces |
1.27 mm |
100 Cel |
-55 Cel |
QUAD |
16 Mbps |
S-PQCC-J44 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||
Texas Instruments |
GULL WING |
128 |
HLFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
.1 mA |
5 V |
5 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP128,.7X.93,20 |
Network Interfaces |
.5 mm |
QUAD |
R-PQFP-G100 |
Not Qualified |
||||||||||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
330 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE |
TQFP64,.63SQ,32 |
Network Interfaces |
.8 mm |
70 Cel |
0 Cel |
QUAD |
1250 Mbps |
S-PQFP-G64 |
1.2 mm |
14 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
14 mm |
||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
1600 Mbps |
S-PQFP-G64 |
1 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
|||||||||
Texas Instruments |
TOKEN RING TRANSCEIVER |
COMMERCIAL |
GULL WING |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
.65 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G52 |
1.2 mm |
10 mm |
Not Qualified |
10 mm |
|||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.26 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP64,.63SQ,32 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1250 Mbps |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
10 mm |
||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.23 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1300 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
-9 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
19.2405 mm |
|||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.111 mA |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
1600 Mbps |
S-PQFP-G64 |
1 mm |
10 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
|||||||||
Texas Instruments |
TOKEN RING TRANSCEIVER |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
.2 mA |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Network Interfaces |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
16 Mbps |
S-PQCC-J44 |
4.57 mm |
16.5862 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
16.5862 mm |
|||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
-9 V |
CHIP CARRIER |
1.27 mm |
70 Cel |
0 Cel |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
11.5062 mm |
|||||||||||||||||||
|
Texas Instruments |
SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
48 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.2 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
4.4 mm |
||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.23 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1300 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
DUAL |
R-PDSO-G24 |
2.65 mm |
7.5 mm |
Not Qualified |
15.4 mm |
||||||||||||||||||
|
Texas Instruments |
SUPPORT CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
48 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
GRID ARRAY |
1 mm |
BOTTOM |
S-PBGA-B289 |
2 mm |
19 mm |
Not Qualified |
19 mm |
|||||||||||||||||||||
Texas Instruments |
SUPPORT CIRCUIT |
COMMERCIAL |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2.5 V |
1.5,2.5 |
GRID ARRAY |
BGA289,17X17,40 |
Other Telecom ICs |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B289 |
3 |
2 mm |
19 mm |
Not Qualified |
20 |
220 |
19 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.