Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
.9 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
TS 16949 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
S-XQCC-N56 |
1 mm |
8 mm |
e3 |
8 mm |
|||||||||||||
|
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
3 |
20 |
260 |
||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
2 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N56 |
1 mm |
8 mm |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CAN FD/LIN TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.32SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
S-PQCC-N48 |
3 |
1.6 mm |
7 mm |
40 |
260 |
7 mm |
|||||||||||||||
|
M/a-com Technology Solutions |
MANCHESTER ENCODER |
COMMERCIAL |
BALL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B144 |
3 |
1.68 mm |
13 mm |
e1 |
260 |
13 mm |
|||||||||||||||
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
200 mA |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.7 mm |
7 mm |
7 mm |
||||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
DUAL |
R-PDSO-N14 |
1 |
1 mm |
3 mm |
Not Qualified |
30 |
260 |
4.5 mm |
||||||||||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
5 Mbps |
S-PQCC-N48 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||
Marvell Technology |
SUPPORT CIRCUIT |
1 |
1 |
1000 Mbps |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
5 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
S-PDSO-N8 |
2 |
1 mm |
3 mm |
ESD Value for CANH, CANL wrt GND is 3B |
e4 |
260 |
3 mm |
|||||||||
|
Renesas Electronics |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
3 |
1.27 mm |
12 mm |
30 |
260 |
12 mm |
||||||||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
20 mm |
|||||||||||||||
|
Microchip Technology |
INTERFACE CIRCUIT |
MATTE TIN |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
140 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-N8 |
.8 mm |
2 mm |
e4 |
30 |
260 |
3 mm |
|||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N40 |
3 |
1 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
S-PDSO-N8 |
2 |
1 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
.9 mm |
4 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4 mm |
|||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
755 mA |
2.5 V |
GRID ARRAY |
BGA256,16X16,40 |
1 mm |
125 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B256 |
1.8 mm |
17 mm |
17 mm |
|||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
NO LEAD |
QCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
2.5 V |
CHIP CARRIER |
QUAD |
R-XQCC-N |
||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
3 |
||||||||||||||||||||||||||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
3.3,5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
TS 16949 |
2 |
70 mA |
5 V |
SMALL OUTLINE |
SOP14,.25 |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDSO-G14 |
1.75 mm |
3.9 mm |
e3 |
8.65 mm |
||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
e3 |
4.9 mm |
||||||||||||
|
Realtek Semiconductor |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
Not Qualified |
7 mm |
||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
1 |
1 |
.065 mA |
5 V |
5 |
IN-LINE |
DIP8,.3 |
Network Interfaces |
2.54 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1 Mbps |
R-PDIP-T8 |
5.08 mm |
7.62 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
NOT SPECIFIED |
9.59 mm |
|||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
3 mm |
|||||||||||||||
|
Texas Instruments |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5 mA |
14 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.02 Mbps |
S-PDSO-N8 |
2 |
1 mm |
3 mm |
e4 |
30 |
260 |
3 mm |
||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
.02 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
|||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
65 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC56,.35SQ,20 |
Network Interfaces |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100000 Mbps |
S-PQCC-N56 |
3 |
.8 mm |
9 mm |
Not Qualified |
e3 |
30 |
260 |
9 mm |
|||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
1 |
58.3 mA |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
1.1 mm |
4.4 mm |
Not Qualified |
e4 |
5 mm |
|||||||||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.13,20 |
.5 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-G14 |
1.1 mm |
2 mm |
4.2 mm |
|||||||||||||||
|
Texas Instruments |
SUPPORT CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 mA |
24 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
R-PQCC-N20 |
2 |
1 mm |
3.5 mm |
e4 |
NOT SPECIFIED |
260 |
4 mm |
|||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
NOT SPECIFIED |
260 |
4.905 mm |
|||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
1.1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-XQCC-N40 |
3 |
.8 mm |
6 mm |
ESD FOR TXN, TXP, RXN, RXP Pins is 3B |
30 |
260 |
6 mm |
||||||||||||
|
Onsemi |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
.065 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G8 |
2 |
1.7272 mm |
3.937 mm |
Not Qualified |
e3 |
30 |
260 |
4.9276 mm |
|||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
36 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
4 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
100000 Mbps |
S-PQCC-N36 |
3 |
.9 mm |
6 mm |
e4 |
30 |
260 |
6 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.