Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
LIN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
4.5 mA |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
260 |
3 mm |
||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
4.9 mm |
||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
BALL |
117 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 V |
GRID ARRAY, LOW PROFILE |
1 mm |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B117 |
1.54 mm |
10 mm |
e1 |
14 mm |
|||||||||||||||||||
|
Onsemi |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
1 |
70 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
5 Mbps |
S-XDSO-N8 |
1 |
.9 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||||||||
|
Texas Instruments |
TOKEN RING TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
38 mA |
3.3 V |
FLATPACK |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G48 |
1 |
1.6 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
||||||||||||
|
Onsemi |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
5 Mbps |
R-PDSO-G8 |
2 |
1.75 mm |
4.9 mm |
e3 |
30 |
260 |
6 mm |
|||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
ESD Value for CANH, CANL wrt GND is 3B |
e4 |
260 |
4.905 mm |
|||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
SOP8,.24 |
1.27 mm |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
260 |
4.9 mm |
|||||||||||||||
|
Echelon |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
PIN/PEG |
9 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
5 |
MICROELECTRONIC ASSEMBLY |
MODULE(UNSPEC) |
Network Interfaces |
85 Cel |
-40 Cel |
MATTE TIN OVER NICKEL |
UNSPECIFIED |
R-PXMA-P9 |
Not Qualified |
e3 |
||||||||||||||||||
|
Analog Devices |
MIL-STD-1553 DATA BUS TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
75 mA |
5 V |
SMALL OUTLINE |
SOP8,.40 |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
2.65 mm |
5.85 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7.5 mm |
||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
12 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.16,32 |
.8 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 mm |
4 mm |
4 mm |
||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
|||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
2 |
.14 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
MATTE TIN |
DUAL |
1 Mbps |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
8.65 mm |
|||||||||
Microchip Technology |
WIRELESS LAN CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
HYBRID |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N49 |
3.175 mm |
17.78 mm |
26.67 mm |
||||||||||||||||||||
Microchip Technology |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N49 |
3.175 mm |
17.78 mm |
26.67 mm |
|||||||||||||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.11 |
.65 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-G8 |
1 |
1.1 mm |
1.6 mm |
ESD Value for CANH, CANL wrt GND is 3B |
e4 |
260 |
2.9 mm |
|||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
5 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
NOT SPECIFIED |
260 |
4.905 mm |
|||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
1 |
260 |
|||||||||||||||||||||||||||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
UNSPECIFIED |
UNSPECIFIED |
1 |
2.5 V |
SILVER |
3 |
e4 |
260 |
|||||||||||||||||||||||||||||
|
Onsemi |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
5 Mbps |
R-PDSO-G8 |
2 |
1.75 mm |
4.9 mm |
e3 |
30 |
260 |
6 mm |
|||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.11 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.1 mm |
1.6 mm |
2.9 mm |
|||||||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
INDUSTRIAL |
NO LEAD |
49 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
R-XQMA-N49 |
3.175 mm |
17.78 mm |
e3 |
26.67 mm |
|||||||||||||||||||
|
NXP Semiconductors |
LIN TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
4.5 mA |
3.3 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
|||||||||||
Holt Integrated Circuits |
MIL-STD-1553 DATA BUS TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
5 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
260 |
4.905 mm |
||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
1 |
65 mA |
5 V |
5 |
SMALL OUTLINE |
SOLCC8,.12,25 |
Network Interfaces |
.635 mm |
DUAL |
1 Mbps |
R-PDSO-N8 |
1 |
Not Qualified |
260 |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
NO LEAD |
138 |
HQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
4 |
605 mA |
1 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC135,.47SQ,25 |
.65 mm |
125 Cel |
0 Cel |
BOTTOM |
1000 Mbps |
S-PQCC-N138 |
.85 mm |
12 mm |
12 mm |
||||||||||||||||
|
NXP Semiconductors |
CAN FD/LIN TRANSCEIVER |
AEC-Q100 |
3 |
40 |
260 |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
.07 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
20 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC20,.14,20 |
.5 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
15 Mbps |
R-PDSO-N20 |
1 |
1 mm |
3.5 mm |
e4 |
30 |
260 |
5.5 mm |
||||||||||||
|
Marvell Technology |
ETHERNET TRANSCEIVER |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
1000 Mbps |
S-PBGA-B196 |
1.5 mm |
15 mm |
15 mm |
|||||||||||||||||
|
STMicroelectronics |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
30 |
260 |
4.905 mm |
||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
2 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
ESD on pins CANH and CANL ESD is 8kV |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
THROUGH-HOLE |
20 |
SIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
HYBRID |
-5 V |
1 |
285 mA |
5 V |
5 |
IN-LINE |
SIP20H,.8 |
Network Interfaces |
2.54 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
SINGLE |
2.5 Mbps |
R-PSIP-T20 |
10.16 mm |
Not Qualified |
e1 |
52.07 mm |
|||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
48 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
.5 mm |
125 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
e3 |
40 |
260 |
7 mm |
|||||||||||||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
1 |
5 V |
5 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
Not Qualified |
40 |
260 |
4.9 mm |
|||||||||||
|
Renesas Electronics |
INTERFACE CIRCUIT |
INDUSTRIAL |
NO LEAD |
56 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
.16 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC56,.31SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
100 Mbps |
S-PQCC-N56 |
3 |
1 mm |
8 mm |
Not Qualified |
e3 |
30 |
260 |
8 mm |
||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N48 |
1 mm |
7 mm |
7 mm |
|||||||||||||||||
Microchip Technology |
CAN FD TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
||||||||||||||||
|
STMicroelectronics |
SUPPORT CIRCUIT |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
.5 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
S-PBGA-B36 |
3 |
1.16 mm |
3.6 mm |
Not Qualified |
e2 |
260 |
3.6 mm |
||||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
180 mA |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
NOT SPECIFIED |
260 |
4.905 mm |
|||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
e4 |
30 |
260 |
4.9 mm |
||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
e4 |
NOT SPECIFIED |
260 |
5 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.