Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | Data Rate | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
140 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
MILITARY |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) |
DUAL |
2 Mbps |
R-PDSO-N14 |
2 |
1 mm |
3 mm |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
4.5 mm |
|||||||||
|
NXP Semiconductors |
CAN FD TRANSCEIVER |
NO LEAD |
20 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
67 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC20,.14,20 |
.5 mm |
NICKEL PALLADIUM GOLD SILVER |
DUAL |
15 Mbps |
R-PDSO-N20 |
1 |
1 mm |
3.5 mm |
e4 |
30 |
260 |
5.5 mm |
||||||||||||
|
Microchip Technology |
LAN SWITCHING CIRCUIT |
COMMERCIAL |
BALL |
100 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
2 |
3.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA100,10X10,32 |
.8 mm |
70 Cel |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
100 Mbps |
S-PBGA-B100 |
1.38 mm |
9 mm |
Not Qualified |
e1 |
9 mm |
||||||||||||
|
Intel |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
32 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
FLATPACK, LOW PROFILE |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G32 |
1.6 mm |
7 mm |
Not Qualified |
e3 |
7 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
.9 mm |
5 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
|||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
128 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
1.2 V |
FLATPACK, FINE PITCH |
QFP128,.68X.91,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
1000 Mbps |
R-PQFP-G128 |
3 |
3.4 mm |
14 mm |
Not Qualified |
e3 |
20 mm |
||||||||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
NO LEAD |
8 |
SON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
12 V |
SMALL OUTLINE |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.02 Mbps |
S-PDSO-N8 |
2 |
e4 |
30 |
260 |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.8 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
.5 mm |
125 Cel |
-40 Cel |
QUAD |
10 Mbps |
S-PQCC-N24 |
.9 mm |
4 mm |
4 mm |
|||||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
AEC-Q100 |
1 |
.08 mA |
5 V |
5 |
SMALL OUTLINE |
SOP14,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
DUAL |
1 Mbps |
R-PDSO-G14 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
30 |
260 |
8.65 mm |
|||||||
|
Texas Instruments |
INTERFACE CIRCUIT |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
AEC-Q100 |
1 |
.017 mA |
3.3 V |
3.3 |
SMALL OUTLINE |
SOP8,.25 |
Network Interfaces |
1.27 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
4.9 mm |
|||||
|
NXP Semiconductors |
INTERFACE CIRCUIT |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
3 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
8.65 mm |
||||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.95 mA |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
Matte Tin (Sn) |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
e3 |
3 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G48 |
1.6 mm |
7 mm |
e3 |
7 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
2.5 V |
SMALL OUTLINE, SHRINK PITCH |
TSSOP48,.40 |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
100 Mbps |
R-PDSO-G48 |
2.794 mm |
7.493 mm |
e3 |
15.875 mm |
|||||||||||||
Maxim Integrated |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e0 |
4.9 mm |
|||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
e4 |
260 |
10.3 mm |
|||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-XQCC-N32 |
2 |
1 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
1.2 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
1 mm |
5 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||
|
Analog Devices |
CAN TRANSCEIVER |
INDUSTRIAL |
GULL WING |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BICMOS |
1 |
70 mA |
3.3 V |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.1 |
Network Interfaces |
.635 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1 Mbps |
R-PDSO-G8 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||
|
Silicon Labs |
MANCHESTER ENCODER/DECODER |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N20 |
1 |
.9 mm |
4 mm |
40 |
260 |
4 mm |
||||||||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE |
SOP8,.24 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-G8 |
1 |
1.75 mm |
3.895 mm |
e4 |
260 |
4.905 mm |
||||||||||
|
Infineon Technologies |
CAN FD TRANSCEIVER |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
6.5 mA |
13.5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
150 Cel |
-40 Cel |
QUAD |
5 Mbps |
S-PQCC-N48 |
.9 mm |
7 mm |
7 mm |
||||||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
.4 mm |
125 Cel |
0 Cel |
QUAD |
1000 Mbps |
S-PQCC-N68 |
.9 mm |
8 mm |
8 mm |
||||||||||||||||||
|
Infineon Technologies |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
BALL |
256 |
HBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
4 |
1.1 mA |
3.3 V |
3.3 |
GRID ARRAY, HEAT SINK/SLUG |
BGA256,20X20,50 |
Network Interfaces |
1.27 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1500 Mbps |
S-PBGA-B256 |
3 |
1.745 mm |
27 mm |
Not Qualified |
e1 |
20 |
260 |
27 mm |
||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
2.794 mm |
7.493 mm |
Not Qualified |
e3 |
15.875 mm |
||||||||||||||
Texas Instruments |
ETHERNET TRANSCEIVER |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
110 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
R-PDSO-N14 |
2 |
1 mm |
3 mm |
e4 |
30 |
260 |
4.5 mm |
||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
8 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
AEC-Q100 |
1 |
70 mA |
5 V |
5 |
SMALL OUTLINE |
SOLCC8,.12,25 |
Network Interfaces |
.635 mm |
DUAL |
1 Mbps |
R-PDSO-N8 |
Not Qualified |
||||||||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TS 16949 |
1 |
40 mA |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
100 Mbps |
S-PQFP-G64 |
1.6 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
|||||||||||
Microchip Technology |
CAN FD TRANSCEIVER |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; TS 16949 |
1 |
70 mA |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.75 mm |
3.9 mm |
4.9 mm |
||||||||||||||||
|
Texas Instruments |
CAN FD TRANSCEIVER |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
130 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
8 Mbps |
S-PDSO-N8 |
2 |
1 mm |
3 mm |
ESD Value for CANH, CANL wrt GND is 3B |
e4 |
260 |
3 mm |
|||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
3 |
.8 mm |
5 mm |
30 |
260 |
5 mm |
||||||||||||||||
|
Analog Devices |
INTERFACE CIRCUIT |
MILITARY |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
SMALL OUTLINE |
1.27 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
2.65 mm |
7.5 mm |
e4 |
260 |
10.3 mm |
|||||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
.95 mA |
13.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N8 |
1 mm |
3 mm |
e3 |
3 mm |
|||||||||||||
|
Microchip Technology |
ETHERNET TRANSCEIVER |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
8 |
2.1 V |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G208 |
3.8 mm |
28 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
28 mm |
||||||||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-G8 |
1.71 mm |
3.895 mm |
4.905 mm |
|||||||||||||||
|
Infineon Technologies |
INTERFACE CIRCUIT |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
5 V |
SMALL OUTLINE |
1.27 mm |
NICKEL GOLD PALLADIUM |
DUAL |
R-PDSO-G8 |
2A |
1.75 mm |
4 mm |
5 mm |
|||||||||||||||||||
|
Texas Instruments |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
1.55,3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
28 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N14 |
1 |
1 mm |
3 mm |
260 |
4.5 mm |
|||||||||||||
Microchip Technology |
ETHERNET TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
1 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.32SQ,16 |
.4 mm |
125 Cel |
-40 Cel |
QUAD |
1000 Mbps |
S-PQCC-N68 |
.9 mm |
8 mm |
8 mm |
||||||||||||||||||
Texas Instruments |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
AEC-Q100 |
1 |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
150 Cel |
-40 Cel |
DUAL |
8 Mbps |
R-PDSO-N8 |
||||||||||||||||||||
|
NXP Semiconductors |
CAN TRANSCEIVER |
NO LEAD |
14 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1 |
28 mA |
13 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC14,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
DUAL |
5 Mbps |
R-PDSO-N14 |
1 |
1 mm |
3 mm |
260 |
4.5 mm |
|||||||||||||
|
Microchip Technology |
LIN TRANSCEIVER |
AUTOMOTIVE |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1 |
53 mA |
13.5 V |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
150 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G8 |
1.8 mm |
3.9 mm |
e4 |
4.9 mm |
||||||||||||||
|
Analog Devices |
ETHERNET TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
2.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N48 |
1 |
.8 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
|||||||||||||
|
Microchip Technology |
CAN FD TRANSCEIVER |
AUTOMOTIVE |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
140 mA |
5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,25 |
.65 mm |
150 Cel |
-40 Cel |
MATTE TIN |
DUAL |
8 Mbps |
S-PDSO-N8 |
1 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.
Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.
Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.
In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.