4 Other Function Telecom Interface ICs 56

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SL2S2102FUD,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N4

NOT SPECIFIED

NOT SPECIFIED

HMC7447

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-55 Cel

UPPER

R-XUUC-N4

.871 mm

NOT APPLICABLE

NOT APPLICABLE

1.221 mm

HMC757

Analog Devices

TELECOM CIRCUIT

OTHER

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

7 V

UNCASED CHIP

85 Cel

-55 Cel

UPPER

R-XUUC-N4

Not Qualified

HMC7891

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

4

RECTANGULAR

UNSPECIFIED

NO

1

8 V

FLANGE MOUNT

85 Cel

-40 Cel

UNSPECIFIED

R-XXFM-X4

1

MAX2694EWS+T

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

2.85 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

S-PBGA-B4

1

.69 mm

.84 mm

e2

30

260

.84 mm

TCP-4133UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

.626 mm

TCP-4118UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

.626 mm

TCP-4133UA-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

.862 mm

TCP-4156UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

1.009 mm

LV0111CF

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B4

.68 mm

1.08 mm

1.08 mm

TCP-4127UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

.626 mm

TCP-4182UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

1.009 mm

TCP-4127UA-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

.862 mm

TCP-4139UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

.862 mm

TCP-4147UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

.964 mm

TCP-4168UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

1.009 mm

TCP-4112UB-DT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

4

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.42 mm

85 Cel

-30 Cel

NICKEL GOLD

BOTTOM

R-PBGA-B4

1

.345 mm

.609 mm

e4

260

.626 mm

SL3S1203FUF,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

.265 mA

1.8 V

1.8

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

SL3S1213FUF/G,005

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

.265 mA

1.8 V

1.8

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

SL3S1213FUF,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

.265 mA

1.8 V

1.8

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

SL3S1213FUD/BG

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

1.8 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

SL3S1203FUD/BG

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

1.8 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

SL3S1213FUF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

1.8 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

SL3S1013FUD/BG

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

1.8 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

NT2H1311F0DTL,125

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

4

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

70 Cel

-25 Cel

DUAL

R-PDSO-N4

.5 mm

1.5 mm

2 mm

SL3ICS3001FW/V1

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N

Not Qualified

NT2H1311F0DTL

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

4

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

-25 Cel

DUAL

R-PDSO-N4

.5 mm

1.5 mm

2 mm

NT2H1611F0DTL,125

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

4

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

70 Cel

-25 Cel

DUAL

R-PDSO-N4

.5 mm

1.5 mm

2 mm

NT2H1611F0DTL

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

4

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

-25 Cel

DUAL

R-PDSO-N4

.5 mm

1.5 mm

2 mm

SL3S1203FUF/G,005

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

.265 mA

1.8 V

1.8

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

SL3S1213FUF/G,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

.265 mA

1.8 V

1.8

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

SL3S1003FUD/BG

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

1.8 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

SL3S1203FUF/G,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

1.8 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

SL3S1203FUF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

1.8 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

MF0MOA4U10/D

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

4

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

70 Cel

-25 Cel

DUAL

R-XDMA-N4

Not Qualified

SL2S5402FUD

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

SL2S5002FUD,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N4

NOT SPECIFIED

NOT SPECIFIED

SL2S2102FUD

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N4

Not Qualified

SL2S2002FUD

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N4

Not Qualified

SL2S2002FUD,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N4

NOT SPECIFIED

NOT SPECIFIED

SL2S5102FUD

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N4

Not Qualified

SL2S5102FUD,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N4

NOT SPECIFIED

NOT SPECIFIED

SL2S5302FUD,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

NOT SPECIFIED

NOT SPECIFIED

SL2S5402FUD,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

NOT SPECIFIED

NOT SPECIFIED

SL2S5002FUD

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N4

Not Qualified

SL2S5302FUD

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

BGA123L4E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

VQCCN

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-N4

1

.32 mm

.7 mm

.7 mm

BGA123L4

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

4

BCC

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-B4

.32 mm

.7 mm

NOT SPECIFIED

NOT SPECIFIED

.7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.