BCC Other Function Telecom Interface ICs 50

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NRF52833-QIAA-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	73	BCC	SQUARE	UNSPECIFIED	YES	1			CHIP CARRIER				105 Cel	-40 Cel		QUAD	2 Mbps	S-XBCC-N73
BGS12SN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.6 V	CHIP CARRIER			.4 mm	85 Cel	-30 Cel	TIN	BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm		e3			1.1 mm
BGSA14GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.85 V	CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm
SL3S1002FTB1,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		CHIP CARRIER	LCC3(UNSPEC)	Other Telecom ICs	.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm
BGS12AL74E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER			.55 mm	85 Cel	-30 Cel	GOLD	BOTTOM		R-XBCC-B6	1	.5 mm	1.5 mm		e4			2.3 mm
BGM15LA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-XBCC-B12	1	.65 mm	1.1 mm		e4			1.9 mm
BGS13SN8E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	8	BCC	SQUARE	UNSPECIFIED	YES	1	MOS		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-XBCC-B8	1	.4 mm	1.1 mm		e3			1.1 mm
BGSA12GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.85 V	CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm
BGA5H1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGA5M1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGS13PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	2.85 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm		e3			1.5 mm
XCC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	BUTT	33	BCC	SQUARE	UNSPECIFIED	YES	1		3.6 V	CHIP CARRIER				70 Cel	-20 Cel		BOTTOM		S-XBCC-B33		1.4 mm	7 mm					7 mm
BGSA11GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.85 V	CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm
AMMP-6532-TR2G	Broadcom	TELECOM CIRCUIT		BUTT	8	BCC	SQUARE	UNSPECIFIED	YES	1		3 V	CHIP CARRIER						NICKEL GOLD	BOTTOM		S-XBCC-B8	3	2.25 mm	5.215 mm	Not Qualified	e4	20	260	5.215 mm
BGS13GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	14	BCC	SQUARE	UNSPECIFIED	YES	1	CMOS	3 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		S-XBCC-B14	1	.65 mm	2 mm		e4			2 mm
BGS110MN20E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	BCC	SQUARE	UNSPECIFIED	YES	1		3.5 V	CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		S-XBCC-B20	1	.77 mm	2.3 mm					2.3 mm
XCC2564MODNCMOER	Texas Instruments	TELECOM CIRCUIT	OTHER	BUTT	33	BCC	SQUARE	UNSPECIFIED	YES	1		3.6 V	CHIP CARRIER				70 Cel	-20 Cel		BOTTOM		S-XBCC-B33		1.4 mm	7 mm					7 mm
NCH-RSL10-01S51-ACG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.25 V	CHIP CARRIER			.7 mm	85 Cel	-40 Cel		BOTTOM	4 Mbps	R-PBCC-B51		1.56 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
SL3S1202FTB1,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		CHIP CARRIER	LCC3(UNSPEC)	Other Telecom ICs	.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm
SL3S1002FTB1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		CHIP CARRIER			.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3			1.45 mm
SL3S1202FTB1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		CHIP CARRIER			.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3			1.45 mm
BGA8U1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGSX44MA12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	12	BCC	SQUARE	UNSPECIFIED	YES	1	CMOS	1.8 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		S-XBCC-B12	1	.65 mm	1.6 mm					1.6 mm
BGA5L1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGA729N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGAU1A10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.65 mm	1.1 mm					1.5 mm
BGA123L4	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	4	BCC	SQUARE	UNSPECIFIED	YES	1		1.8 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		S-XBCC-B4		.32 mm	.7 mm			NOT SPECIFIED	NOT SPECIFIED	.7 mm
BGS13GA14E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	14	BCC	SQUARE	UNSPECIFIED	YES	1	CMOS	3 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		S-XBCC-B14		.65 mm	2 mm		e4			2 mm
BGS12SN6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.6 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel	Tin (Sn)	BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm		e3	NOT SPECIFIED	NOT SPECIFIED	1.1 mm
BGS12SL6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6		.32 mm	.7 mm			NOT SPECIFIED	NOT SPECIFIED	1.1 mm
BGS12S3N6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1	MOS	2.6 V	CHIP CARRIER			.35 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.65 mm					.98 mm
BGS13PN10	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	2.85 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm
BGS12AL7-6	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER			.48 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	1.4 mm					1.26 mm
BGS16GA14	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14	BCC	SQUARE	UNSPECIFIED	YES	1		3 V	CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		S-XBCC-B14	1	.65 mm	2 mm					2 mm
BGM15LA12E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B12		.65 mm	1.1 mm					1.9 mm
BGS13GA14	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	14	BCC	SQUARE	UNSPECIFIED	YES	1	CMOS	3 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		S-XBCC-B14	1	.65 mm	2 mm					2 mm
BGS15M2A12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1	MOS		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B12	1	.65 mm	1.1 mm					1.9 mm
BGS13SL9	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	9	BCC	SQUARE	UNSPECIFIED	YES	1		3 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		S-XBCC-B9		.32 mm	1.15 mm					1.15 mm
BGS15M2A12	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1	MOS		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B12	1	.65 mm	1.1 mm					1.9 mm
BGS13SL9E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	9	BCC	SQUARE	UNSPECIFIED	YES	1		3 V	CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		S-XBCC-B9		.32 mm	1.15 mm					1.15 mm
BGS12S3N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1	MOS	2.6 V	CHIP CARRIER			.35 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-XBCC-B6	1	.4 mm	.65 mm		e3			.98 mm
BGM15LA12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-XBCC-B12	1	.65 mm	1.1 mm		e4			1.9 mm
BGS12AL76E6327XTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER			.48 mm	85 Cel	-30 Cel	GOLD	BOTTOM		R-XBCC-B6	1	.4 mm	1.4 mm		e4			1.26 mm
BGS12AL7-4	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		2.8 V	CHIP CARRIER			.55 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B6	1	.5 mm	1.5 mm					2.3 mm
BGS12SL6	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1		3 V	CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6		.32 mm	.7 mm					1.1 mm
ACPM-5017-TR1	Broadcom	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	3.4 V	CHIP CARRIER			.6 mm	90 Cel	-20 Cel		BOTTOM		S-XBCC-B10	3	1 mm	3 mm				260	3 mm
ACPM-5017-BLK	Broadcom	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	3.4 V	CHIP CARRIER			.6 mm	90 Cel	-20 Cel		BOTTOM		S-XBCC-B10	3	1 mm	3 mm				260	3 mm
AMMP-6532-BLKG	Broadcom	TELECOM CIRCUIT		BUTT	8	BCC	SQUARE	UNSPECIFIED	YES	1		3 V	CHIP CARRIER						NICKEL GOLD	BOTTOM		S-XBCC-B8	3	2.25 mm	5.215 mm	Not Qualified	e4	20	260	5.215 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.