BGA Other Function Telecom Interface ICs 257

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

PEF24624E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

PBM99090

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

96

BGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B96

Not Qualified

PBM99080/32MG

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

78

BGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B78

Not Qualified

PEF24624EV2.2-G

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B324

PBA31301/2S

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

34

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

2.8 V

GRID ARRAY

75 Cel

-10 Cel

BOTTOM

R-PBGA-B34

Not Qualified

ROK104001

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

87

BGA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

3.3 V

GRID ARRAY

75 Cel

0 Cel

BOTTOM

R-XBGA-B87

Not Qualified

PEF2256EV2.2-G

Infineon Technologies

INDUSTRIAL

BALL

81

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

145 mA

1.8,3.3

GRID ARRAY

BGA81,9X9,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

T-1(DS1)

CEPT PCM-30/E-1

Not Qualified

PEF2256EV2.2

Infineon Technologies

INDUSTRIAL

BALL

81

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

145 mA

1.8,3.3

GRID ARRAY

BGA81,9X9,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

3

T-1(DS1)

CEPT PCM-30/E-1

Not Qualified

220

CYV15G0204TRB-BGXC

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.745 mm

27 mm

Not Qualified

e1

20

260

27 mm

CYV15G0104TRB-BGXC

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.745 mm

27 mm

Not Qualified

e1

20

260

27 mm

CYV15G0203TB-BGXC

Infineon Technologies

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B256

3

1.745 mm

27 mm

Not Qualified

e1

20

260

27 mm

DS4000D0N/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000A0N/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GW/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000CW/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000G0/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GFN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GFN/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS31256+

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

MATTE TIN

BOTTOM

S-PBGA-B256

3

2.54 mm

27 mm

Not Qualified

e3

27 mm

DS4000G0/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000D0/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000ECN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000EC/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS31256

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

3

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS4000KIN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000KI/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GF/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000CW/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000A0/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS31404GN+

Maxim Integrated

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY

BGA256,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B256

3

Not Qualified

30

260

DS4000ECN/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GWN/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000G0N/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000D0N/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000KIN/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000N

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000CWN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000EC/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000G0N/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS3104GN-W

Maxim Integrated

INDUSTRIAL

BALL

81

BGA

SQUARE

PLASTIC/EPOXY

YES

192 mA

1.8,3.3

GRID ARRAY

BGA81,9X9,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

3

Not Qualified

20

240

DS31256B

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

2.54 mm

27 mm

Not Qualified

e0

27 mm

DS4000KI/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000A0/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GF/WBGA

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

20

240

11 mm

DS3131

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

2.34 mm

27 mm

Not Qualified

e0

27 mm

DS4000A0N/WBGA-W

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

DS4000GWN/WBGA

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B24

3.31 mm

9 mm

Not Qualified

e0

11 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.