BGA Other Function Telecom Interface ICs 257

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

QHX220ICT7

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B9

1 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

1 mm

F6501AVGK

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

62

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

GRID ARRAY

95 Cel

-40 Cel

TIN

BOTTOM

R-PBGA-B62

3

e3

260

MX0141VA0AVG

Renesas Electronics

TELECOM CIRCUIT

OTHER

BALL

98

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY

85 Cel

0 Cel

TIN

BOTTOM

R-PBGA-B98

3

e3

260

F6501AVGK8

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

62

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

GRID ARRAY

95 Cel

-40 Cel

TIN

BOTTOM

R-PBGA-B62

3

e3

260

MX0141VA0AVG8

Renesas Electronics

TELECOM CIRCUIT

OTHER

BALL

98

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY

85 Cel

0 Cel

TIN

BOTTOM

R-PBGA-B98

3

e3

260

QHX220ICSR

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

9

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B9

1 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

1 mm

82V3288BC

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

208

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B208

3

Not Qualified

e0

30

225

BBT3420-SN

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

289

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

1.8,2.5

GRID ARRAY

BGA289,17X17,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B289

3

2 mm

19 mm

Not Qualified

e0

19 mm

82V3288BCG

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

208

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B208

3

Not Qualified

e1

40

260

82P2816A16BBG

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

416

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B416

80HCPS1432HMH

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B576

2.83 mm

25 mm

e0

25 mm

80HCPS1616RMI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

2.83 mm

21 mm

Not Qualified

e1

245

21 mm

80HCPS1848BR

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B784

3.44 mm

29 mm

29 mm

80HCPS1616CRM

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

2.83 mm

21 mm

Not Qualified

e1

30

245

21 mm

80HCPS1616HRI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B400

3.34 mm

21 mm

21 mm

80HCPS1616CHRI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

3.34 mm

21 mm

Not Qualified

e1

245

21 mm

80HCPS1848BLG

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

BGA784,28X28,40

1 mm

70 Cel

0 Cel

BOTTOM

240000 Mbps

S-PBGA-B784

3.44 mm

29 mm

29 mm

80HCPS1848BLGI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

BGA784,28X28,40

1 mm

85 Cel

-40 Cel

BOTTOM

240000 Mbps

S-PBGA-B784

3.44 mm

29 mm

29 mm

80HCPS1848HMI

Renesas Electronics

TELECOM CIRCUIT

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

1 mm

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B784

4

2.83 mm

29 mm

e0

NOT SPECIFIED

225

29 mm

80HCPS1616CRMI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

2.83 mm

21 mm

Not Qualified

e1

30

245

21 mm

80HCPS1432CHMHI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B576

4

2.83 mm

25 mm

e0

NOT SPECIFIED

225

25 mm

80HCPS1432HMG

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B576

2.83 mm

25 mm

25 mm

80HCPS1432CHMH

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B576

4

2.83 mm

25 mm

NOT SPECIFIED

225

25 mm

80HCPS1432HMGI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B576

2.83 mm

25 mm

25 mm

80HCPS1432HMHI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B576

2.83 mm

25 mm

e0

25 mm

80HCPS1616HR

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B400

3.34 mm

21 mm

21 mm

80HCPS1848BRI

Renesas Electronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

784

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B784

3.44 mm

29 mm

29 mm

80HCPS1616RM

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

2.83 mm

21 mm

Not Qualified

e1

245

21 mm

80HCPS1432CHMG

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

576

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

1 mm

70 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B576

4

2.83 mm

25 mm

e1

NOT SPECIFIED

245

25 mm

80HCPS1616CHR

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

4730 mA

1 V

1,2.5/3.3

GRID ARRAY

BGA400,20X20,40

Other Telecom ICs

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

4

3.34 mm

21 mm

Not Qualified

e1

245

21 mm

BCM5700

Broadcom

TELECOM CIRCUIT

BALL

388

BGA

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B388

1

Not Qualified

BCM2040

Broadcom

TELECOM CIRCUIT

BALL

64

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B64

BCM5322M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B400

Not Qualified

BCM53212M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BOTTOM

Not Qualified

BCM8750

Broadcom

TELECOM CIRCUIT

BALL

121

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY

BOTTOM

S-PBGA-B121

Not Qualified

BCM8421

Broadcom

TELECOM CIRCUIT

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

4250 Mbps

S-PBGA-B

BCM3212

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

BALL

841

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

X-PBGA-B841

Not Qualified

BCM5384

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B400

1

Not Qualified

BCM2121

Broadcom

TELECOM CIRCUIT

BALL

200

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

S-PBGA-B200

1

Not Qualified

BCM5758

Broadcom

TELECOM CIRCUIT

COMMERCIAL

BALL

121

BGA

PLASTIC/EPOXY

YES

1

GRID ARRAY

70 Cel

0 Cel

BOTTOM

X-PBGA-B121

Not Qualified

BCM5788M

Broadcom

TELECOM CIRCUIT

BALL

196

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B196

1

Not Qualified

BCM5702

Broadcom

TELECOM CIRCUIT

BALL

196

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B196

1

Not Qualified

BCM5709S

Broadcom

TELECOM CIRCUIT

BALL

656

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

S-PBGA-B656

Not Qualified

BCM5706

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

S-PBGA-B400

1

Not Qualified

BCM2702

Broadcom

TELECOM CIRCUIT

BALL

281

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B281

Not Qualified

BCM5770

Broadcom

TELECOM CIRCUIT

BALL

324

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B324

1

Not Qualified

BCM5345

Broadcom

TELECOM CIRCUIT

BALL

676

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B676

1

Not Qualified

BCM5709C

Broadcom

TELECOM CIRCUIT

BALL

676

BGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

BOTTOM

S-PBGA-B676

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.