BGA Other Function Telecom Interface ICs 257

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC2564YFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.6 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1				e1	30	260
CC2564YFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.6 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1				e1	30	260
CC2564NYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.6 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-PBGA-B54	1					30	260
CC2564NYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.6 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B54	1				e1	30	260
LMX9820ASMX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	116	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B116		2 mm	9.95 mm					14 mm
ADSP-21MOD980-000	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.75 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B352		2.62 mm	35 mm	Not Qualified	e0			35 mm
AD99988BBPZ-4D4AC	Analog Devices	TELECOM CIRCUIT		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	120 Cel	-40 Cel		BOTTOM		S-PBGA-B324		1.72 mm	15 mm					15 mm
DS3131+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.34 mm	27 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	27 mm
ADSP-21MOD980N-000	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.9 V	1.9,3.3	GRID ARRAY	BGA352,26X26,50	Modems	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B352		2.62 mm	35 mm	Not Qualified	e0			35 mm
AD6652BBC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B256	3		17 mm	Not Qualified	e0		240	17 mm
AD6426XB	Analog Devices		OTHER	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		2.4/3.3	GRID ARRAY	BGA144,12X12,40	Other Telecom ICs	1 mm	85 Cel	-25 Cel	Tin/Lead (Sn/Pb)	BOTTOM		S-PBGA-B144				Not Qualified	e0
AD6652XBC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B256	3		17 mm	Not Qualified	e0			17 mm
AD9988BBPZRL-4D4AC	Analog Devices	TELECOM CIRCUIT		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	120 Cel	-40 Cel		BOTTOM		S-PBGA-B324		1.72 mm	15 mm					15 mm
ADSP-21MOD980-000X	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.75 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B352		2.62 mm	35 mm	Not Qualified	e0			35 mm
M7010R-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
STI5300AUA	STMicroelectronics	TELECOM CIRCUIT		BALL	336	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY							BOTTOM		S-PBGA-B336				Not Qualified
STLC61265	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-PBGA-B676				Not Qualified
M7040N-100ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.65 V	1.65,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
STLC60844	STMicroelectronics	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	8	BICMOS	3.3 V		GRID ARRAY							BOTTOM		S-PBGA-B196				Not Qualified
M7040N-100ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.65 V	1.65,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
M7010R-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
M7020R-050ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
M7040N-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
STD8010AWB	STMicroelectronics	TELECOM CIRCUIT		BALL		BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY							BOTTOM		S-PBGA-B				Not Qualified
E-STLC60454	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B144				Not Qualified	e1
STA240	STMicroelectronics		INDUSTRIAL	BALL	288	BGA	SQUARE	PLASTIC/EPOXY	YES		CMOS		1.2,3.3	GRID ARRAY	BGA288,18X18,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B288				Not Qualified
M7020R-083ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
M7020R-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
STLC60454	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-PBGA-B144				Not Qualified
M7040N-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
E-STLC61266	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B676	3			Not Qualified	e1
M7020R-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
E-STLC61265	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V		GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B676	3			Not Qualified	e1
M7010R-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
M7010R-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
STLC61266	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.2 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-PBGA-B676				Not Qualified
M7020R-050ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
M7040N-083ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
STI5300ZUA	STMicroelectronics	TELECOM CIRCUIT		BALL	336	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY							BOTTOM		S-PBGA-B336				Not Qualified
STLC60845	STMicroelectronics	TELECOM CIRCUIT		BALL	292	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	1.8 V		GRID ARRAY							BOTTOM		S-PBGA-B292				Not Qualified
M7020R-066ZA1	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V	1.8,2.5/3.3	GRID ARRAY	BGA272,20X20,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B272		2.6 mm	27 mm	Not Qualified				27 mm
M7040N-066ZA1T	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.5 V	1.5,2.5/3.3	GRID ARRAY	BGA388,26X26,50	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B388		2.46 mm	35 mm	Not Qualified	e0			35 mm
BLUENRG-345VT	STMicroelectronics	TELECOM CIRCUIT		BALL	49	BGA	SQUARE	UNSPECIFIED	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	105 Cel	-40 Cel		BOTTOM	2 Mbps	S-XBGA-B49		.42 mm	3.14 mm					3.14 mm
BLUENRG-355VC	STMicroelectronics	TELECOM CIRCUIT		BALL	49	BGA	SQUARE	UNSPECIFIED	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	2 Mbps	S-XBGA-B49		.42 mm	3.14 mm					3.14 mm
BLUENRG-355VT	STMicroelectronics	TELECOM CIRCUIT		BALL	49	BGA	SQUARE	UNSPECIFIED	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	105 Cel	-40 Cel		BOTTOM	2 Mbps	S-XBGA-B49		.42 mm	3.14 mm					3.14 mm
PN5441A2ET/C20501	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	BGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY				85 Cel	-25 Cel		BOTTOM		S-PBGA-B64
PEF22624E	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-PBGA-B324
PEF21624E	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-PBGA-B324

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.