BGA Other Function Telecom Interface ICs 257

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BCM1101

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B256

Not Qualified

BCM53202M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BOTTOM

Not Qualified

BCM5820

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

2.5 V

GRID ARRAY

BOTTOM

X-PBGA-B256

Not Qualified

BCM5321M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B400

Not Qualified

BCM1113R

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B256

Not Qualified

TMXF281553BAL-3C-DB

Broadcom

INDUSTRIAL

BALL

456

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3 V

3.3

GRID ARRAY

BGA456,26X26,50

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B456

Not Qualified

BCM2705

Broadcom

TELECOM CIRCUIT

BALL

281

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B281

Not Qualified

HDMP-1687

Broadcom

OTHER

BALL

208

BGA

SQUARE

PLASTIC/EPOXY

YES

BIPOLAR

3.3 V

3.3

GRID ARRAY

BGA208,17X17,50

Other Telecom ICs

1.27 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B208

Not Qualified

BCM5320M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B400

Not Qualified

BCM5704C

Broadcom

TELECOM CIRCUIT

BALL

300

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B300

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

BCM4325GKWLG

Broadcom

TELECOM CIRCUIT

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B

Not Qualified

BCM5382M

Broadcom

TELECOM CIRCUIT

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY

BOTTOM

S-PBGA-B324

Not Qualified

BCM5788

Broadcom

TELECOM CIRCUIT

BALL

196

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B196

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

BCM6411

Broadcom

TELECOM CIRCUIT

BALL

336

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B336

1

27 mm

Not Qualified

27 mm

BCM2133

Broadcom

TELECOM CIRCUIT

BALL

302

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

S-PBGA-B302

Not Qualified

BCM7041

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B256

Not Qualified

BCM5675

Broadcom

TELECOM CIRCUIT

BALL

600

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B600

Not Qualified

BCM5324M

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B400

Not Qualified

L-TTSI001161BL-2-DB

Broadcom

INDUSTRIAL

BALL

240

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA240,18X18,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B240

Not Qualified

BCM5825

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B400

1

Not Qualified

BCM5320MIPBG

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B400

NOT SPECIFIED

NOT SPECIFIED

STSI-48

Broadcom

INDUSTRIAL

BALL

384

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.5,3.3

GRID ARRAY

BGA384,26X26,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B384

Not Qualified

BCM2085

Broadcom

TELECOM CIRCUIT

BALL

49

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

S-PBGA-B49

Not Qualified

BCM5389IFB

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

S-PBGA-B256

L-TTSI002321BL-2-DB

Broadcom

INDUSTRIAL

BALL

240

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.5,3.3

GRID ARRAY

BGA240,18X18,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B240

Not Qualified

BCM2724

Broadcom

TELECOM CIRCUIT

BALL

281

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

R-PBGA-B281

Not Qualified

BCM5682

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

2.5 V

GRID ARRAY

BOTTOM

X-PBGA-B400

1

Not Qualified

TTSI001161BL-2-DB

Broadcom

INDUSTRIAL

BALL

240

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA240,18X18,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B240

Not Qualified

BCM5690

Broadcom

TELECOM CIRCUIT

BALL

480

BGA

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

X-PBGA-B480

1

Not Qualified

BCM4325HKWLG

Broadcom

TELECOM CIRCUIT

BALL

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B

Not Qualified

BCM2153

Broadcom

TELECOM CIRCUIT

BALL

428

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

S-PBGA-B428

Not Qualified

HDMP-2689

Broadcom

TELECOM CIRCUIT

OTHER

BALL

289

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

1.8,2.5

GRID ARRAY

BGA289,17X17,40

Other Telecom ICs

1 mm

85 Cel

0 Cel

BOTTOM

S-PBGA-B289

1.97 mm

19 mm

Not Qualified

19 mm

BCM5389

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B256

Not Qualified

AVSP-8801-002

Broadcom

TELECOM CIRCUIT

BALL

169

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

8

CMOS

1 V

GRID ARRAY

BGA169(UNSPEC)

125 Cel

0 Cel

BOTTOM

28000 Mbps

R-PBGA-B169

ALSO AVAILABLE WITH 2.5V NOMINAL SUPPLY

BCM5676

Broadcom

TELECOM CIRCUIT

BALL

600

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B600

1

Not Qualified

BCM5345M

Broadcom

TELECOM CIRCUIT

BALL

676

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B676

Not Qualified

BCM5705M

Broadcom

TELECOM CIRCUIT

BALL

196

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B196

1

Not Qualified

BCM5691

Broadcom

TELECOM CIRCUIT

BALL

480

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B480

1

Not Qualified

L-TTSI004321BL-2-DB

Broadcom

INDUSTRIAL

BALL

240

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.5,3.3

GRID ARRAY

BGA240,18X18,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B240

Not Qualified

BCM2141

Broadcom

TELECOM CIRCUIT

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.5 V

GRID ARRAY

BOTTOM

S-PBGA-B144

Not Qualified

BCM1112

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B256

1

Not Qualified

HDMP-0528

Broadcom

TELECOM CIRCUIT

BALL

289

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

1 mm

BOTTOM

S-PBGA-B289

19 mm

Not Qualified

19 mm

TTSI002321BL-2-DB

Broadcom

INDUSTRIAL

BALL

240

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.5,3.3

GRID ARRAY

BGA240,18X18,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B240

Not Qualified

BCM4325HKFBG

Broadcom

TELECOM CIRCUIT

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B196

Not Qualified

BCM5754

Broadcom

TELECOM CIRCUIT

BALL

100

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

X-PBGA-B100

TTSI004321BL-2-DB

Broadcom

INDUSTRIAL

BALL

240

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

1.5,3.3

GRID ARRAY

BGA240,18X18,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B240

Not Qualified

BCM5703

Broadcom

TELECOM CIRCUIT

BALL

400

BGA

PLASTIC/EPOXY

YES

1

CMOS

GRID ARRAY

BOTTOM

X-PBGA-B400

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

BCM1115R

Broadcom

TELECOM CIRCUIT

BALL

256

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

BOTTOM

X-PBGA-B256

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.