TFBGA Other Function Telecom Interface ICs 54

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADRV9002BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.19 mm	12 mm				30	260	12 mm
ADRV9002BBCZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.19 mm	12 mm				30	260	12 mm
ATA8352-7MQW	Microchip Technology	TELECOM CIRCUIT		BALL	33	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA33,6X6,25		.65 mm	105 Cel	-40 Cel		BOTTOM	1 Mbps	S-PBGA-B33		1.1 mm	4.5 mm						4.5 mm
CYW20706UA2KFFB4G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B49	3	1.05 mm	4 mm			e1			4.5 mm
CYW20734UA1KFFB3G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	90	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		R-PBGA-B90		1.2 mm	8.5 mm						8.5 mm
STA8090FGB	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B99		1.2 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
BCM43570KFFBG	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	BALL	242	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA242,23X23,16		.4 mm	60 Cel	0 Cel		BOTTOM	867 Mbps	S-PBGA-B242		1.05 mm	10 mm		Also has 1.2 V core supply				10 mm
XA2243PBGABL	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	161	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA161		.65 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B161	3	1.17 mm	10.4 mm			e1	30	260	10.4 mm
LMV243BL	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	8	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B8		1.095 mm	1.514 mm						1.514 mm
LM96511CCSM/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	376	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		R-PBGA-B376	4	1.2 mm	10 mm			e0	30	260	17 mm
LMV243BLX	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	8	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B8		1.095 mm	1.514 mm						1.514 mm
TCA5013ZAHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	48	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B48	3	1.2 mm	5 mm			e1	30	260	5 mm
STLC2500ATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B84		1.2 mm	6 mm	Not Qualified					6 mm
STLC2500	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B84		1.2 mm	6 mm	Not Qualified		e1		260	6 mm
STLC2410B	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V	1.8,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B132		1.2 mm	8 mm	Not Qualified		e1			8 mm
STA8090FGTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B99		1.2 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
STA8090EXGAJDTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
STLC2500A	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	84	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.75 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B84		1.2 mm	6 mm	Not Qualified					6 mm
STA8090EXGAD	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
STA8090EXGAJD	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
STA8090FG	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B99		1.2 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
STLC2411	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	132	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.8 V	1.8,3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA132,14X14,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B132		1.2 mm	8 mm	Not Qualified		e0			8 mm
STA8090EXGAJTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
STA8090EXGAJ	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
STA8090EXGATR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
STA8090EXGADTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B169		1.2 mm	9 mm				NOT SPECIFIED	NOT SPECIFIED	9 mm
STA8090FGBTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	99	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B99		1.2 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	6 mm
STA8090EXGA	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	169	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM		S-PBGA-B169	3	1.2 mm	9 mm			e3		260	9 mm
PCF26100ET	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	BALL	48	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3 V	3/3.3	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA48,8X8,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B48		1.12 mm	5 mm	Not Qualified					5 mm
MC33MR2001VVK	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	90	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B90	3	1.02 mm	6 mm			e1	40	260	6 mm
MC33MR2001RVK	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	85	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B85	3	1.02 mm	6 mm			e1	40	260	6 mm
MC33MR2001TVK	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	89	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B89	3	1.02 mm	6 mm			e1	40	260	6 mm
MC33MR2001TVKR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	89	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B89	3	1.02 mm	6 mm			e1	40	260	6 mm
MC33MR2001RVKR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	85	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B85	3	1.02 mm	6 mm			e1	40	260	6 mm
MC33MR2001VVKR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	BALL	90	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	125 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		S-PBGA-B90	3	1.02 mm	6 mm			e1	40	260	6 mm
PN5180A0ET/C1,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B64	1	1.15 mm	5.5 mm			e1	30	260	5.5 mm
PN5180A0ET/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B64	1	1.15 mm	5.5 mm			e1	30	260	5.5 mm
PN5120A0ET/C2	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64		1.15 mm	5.5 mm						5.5 mm
PN5120A0ET/C2,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64		1.15 mm	5.5 mm						5.5 mm
BCM43241FKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B208		1.05 mm	7 mm						9 mm
BCM43241XKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B208		1.05 mm	7 mm						9 mm
BCM43241DKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B208		1.05 mm	7 mm						9 mm
BCM43241ZKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B208		1.05 mm	7 mm						9 mm
BCM20733A3KFB2G	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	BALL	121	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.8 mm	70 Cel	0 Cel		BOTTOM		S-PBGA-B121		1.1 mm	9 mm						9 mm
BCM4325GKFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B196		1.05 mm	7.5 mm						7.5 mm
BCM4325FKFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B196		1.05 mm	7.5 mm						7.5 mm
BCM43241GKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	208	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B208		1.05 mm	7 mm						9 mm
CYW20707UA2KFFB4G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.2 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B49		1.05 mm	4 mm						4.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.