VFBGA Other Function Telecom Interface ICs 304

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

LM3291TMX/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B12

1

.675 mm

e1

30

260

LMV1099TLX/NOPB

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B25

1

.675 mm

2.64 mm

e1

30

260

2.764 mm

TPS657201YFFR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B25

1

.625 mm

2.086 mm

e1

30

260

2.086 mm

LM3290TMX/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

TPS65720YFFR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B25

1

.625 mm

2.3 mm

Not Qualified

e1

NOT SPECIFIED

260

2.3 mm

TPS657202YFFR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B25

1

.625 mm

2.086 mm

e1

30

260

2.086 mm

TPS657052YZHR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B16

1

.625 mm

2.3 mm

Not Qualified

e1

NOT SPECIFIED

260

2.3 mm

HPA01195YFPR

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

TPS657201YFFT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B25

1

.625 mm

2.086 mm

e1

30

260

2.086 mm

TPS657052YZHT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B16

1

.625 mm

2.3 mm

Not Qualified

e1

NOT SPECIFIED

260

2.3 mm

WL1831GYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

130

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA130,11X12,16

.4 mm

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B130

1

.575 mm

4.64 mm

e1

30

260

4.93 mm

TCA5013ENG

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B48

.94 mm

5 mm

5 mm

TPS65720YFFT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B25

1

.625 mm

2.3 mm

Not Qualified

e1

NOT SPECIFIED

260

2.3 mm

TPS657202YFFT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B25

1

.625 mm

2.086 mm

e1

30

260

2.086 mm

LM3291TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B12

1

.675 mm

e1

30

260

LMV1099TLX

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B25

.675 mm

2.644 mm

Not Qualified

2.771 mm

SN74AVC6T622ZXYR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

.015 mA

1.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

3.6 V

BOTTOM

50 Mbps

R-PBGA-B20

1

.61 mm

2.5 mm

Not Qualified

e1

30

260

3 mm

TPS657051YZHT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B16

1

.625 mm

2.3 mm

Not Qualified

e1

30

260

2.3 mm

LMV1099TL

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B25

.675 mm

2.644 mm

Not Qualified

2.771 mm

TPS657051YZHR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B16

1

.625 mm

2.3 mm

Not Qualified

e1

30

260

2.3 mm

LMV1099TL/NOPB

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B25

1

.675 mm

2.64 mm

e1

30

260

2.764 mm

CC2560BYFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

.575 mm

2.925 mm

e1

30

260

3.265 mm

SN65DSI86ZQET

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1 mm

5 mm

5 mm

BQ51010BYFPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

SN65DSI96ZQER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1 mm

5 mm

5 mm

TSC2005IYZLT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.625 mm

2.75 mm

Not Qualified

e1

30

260

3.25 mm

BQ51014YFPR

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

BQ51010BYFPT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

SN65DSI84ZQET

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1 mm

5 mm

5 mm

BQ51013YFFT

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.625 mm

1.56 mm

Not Qualified

e1

30

260

2.76 mm

SN65DSI96ZQET

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1 mm

5 mm

5 mm

BQ51020YFPR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

8.8

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

CC2560BYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

.575 mm

2.925 mm

e1

30

260

3.265 mm

CC2564BYFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 Mbps

R-XBGA-B54

1

e1

30

260

BQ51013YFFR

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.625 mm

1.56 mm

Not Qualified

e1

30

260

2.76 mm

BQ51010YFFT

Texas Instruments

TELECOM CIRCUIT

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

BOTTOM

R-XBGA-B28

.625 mm

1.56 mm

Not Qualified

2.76 mm

BQ51021YFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

BQ51011YFFR

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.625 mm

1.56 mm

Not Qualified

e1

30

260

2.76 mm

TLK2711GQE

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

BOTTOM

S-PBGA-B80

1 mm

5 mm

Not Qualified

5 mm

BQ51010YFFR

Texas Instruments

TELECOM CIRCUIT

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

BOTTOM

R-XBGA-B28

.625 mm

1.56 mm

Not Qualified

2.76 mm

SN65DSI85ZQET

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1 mm

5 mm

5 mm

BQ51013AYFPR

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.002 Mbps

R-PBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

BQ51020YFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

8.8

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

BQ51011YFFT

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.625 mm

1.56 mm

Not Qualified

e1

30

260

2.76 mm

BQ51025YFPR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

BQ51021YFPR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

BQ51025YFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

TSC2005IYZLR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.625 mm

2.75 mm

Not Qualified

e1

30

260

3.25 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.