VFBGA Other Function Telecom Interface ICs 304

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TCP-3012H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.639 mm	.722 mm						.879 mm
FIN210ACGFX	Onsemi	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	70 Cel	-30 Cel		BOTTOM		R-PBGA-B42		1 mm	3.5 mm						4.5 mm
TCP-3027H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.611 mm	.722 mm						.879 mm
TCP-3047H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm						1.179 mm
TCP-4139UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm			e4		260	.862 mm
TCP-5118UA-DT	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm			e1	5	260	.993 mm
TCP-3082H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm						1.179 mm
FSA9480UCX	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B25		.625 mm	2.1 mm						2.1 mm
TCP-3039N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B10		.611 mm	.722 mm						1.029 mm
TCP-3033N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B10		.611 mm	.722 mm						1.029 mm
TCP-5156UA-DT	Onsemi	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	3	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA3(UNSPEC)		.55 mm	85 Cel	-30 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM		R-PBGA-B3		.375 mm	.772 mm			e1	5	260	.993 mm
TCP-4147UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm			e4		260	.964 mm
TCP-3027N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B8		.611 mm	.722 mm						.879 mm
TCP-4168UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm			e4		260	1.009 mm
TCP-4112UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm			e4		260	.626 mm
NL3HS644BFCTAG	Onsemi	TELECOM CIRCUIT		BALL	36	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm				BOTTOM		S-PBGA-B36		.54 mm	2.34 mm				NOT SPECIFIED	NOT SPECIFIED	2.34 mm
TCP-3039H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	10	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B10		.611 mm	.722 mm						1.029 mm
TCP-3056H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm						1.179 mm
LC898212XD-SH	Onsemi	TELECOM CIRCUIT		BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm			TIN SILVER COPPER	BOTTOM		R-PBGA-B12	1	.69 mm	1.37 mm			e1	30	260	1.77 mm
TCP-3056N-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm						1.179 mm
TCP-3068H-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					GRID ARRAY, VERY THIN PROFILE, FINE PITCH				85 Cel	-30 Cel		BOTTOM		R-PBGA-B12		.611 mm	.722 mm						1.179 mm
NCH-RSL10-101WC51-ABG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BALL	51	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.25 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA51,11X11,10		.252 mm	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2 Mbps	R-PBGA-B51	1	.381 mm	2.325 mm			e2	30	260	2.364 mm
STHVDAC-253MTGF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B16		.64 mm	1.7 mm				NOT SPECIFIED	NOT SPECIFIED	1.7 mm
STHVDAC-256MTGF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B20		.64 mm	1.94 mm				NOT SPECIFIED	NOT SPECIFIED	2.23 mm
STHVDAC-253MF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B16		.655 mm	1.6 mm				NOT SPECIFIED	NOT SPECIFIED	1.7 mm
STLC2690WTR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	61	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V	1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA61,8X8,16	Other Telecom ICs	.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B61		.6 mm	3.315 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3.56 mm
STHVDAC-253C7	STMicroelectronics	TELECOM CIRCUIT		BALL	12	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA12,3X4,14		.35 mm	85 Cel	-30 Cel		BOTTOM		R-XBGA-B12		.64 mm	1.1 mm				NOT SPECIFIED	NOT SPECIFIED	1.45 mm
STPAC01F1	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	SQUARE	UNSPECIFIED	YES	1			2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-XBGA-B8		.715 mm	1.57 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	1.57 mm
STPAC01F2	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	8	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B8		.715 mm	1.57 mm	Not Qualified					1.57 mm
ST60A2G0C1C7GYO	STMicroelectronics	TELECOM CIRCUIT		BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.45 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		.4 mm	105 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B25		.9 mm	2.2 mm		also operates with 1.8v supply		NOT SPECIFIED	NOT SPECIFIED	2.2 mm
BLUENRGCSP	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B34		.5 mm	2.56 mm				NOT SPECIFIED	NOT SPECIFIED	2.66 mm
PN7150B0UK/C11003	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.75 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16		.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B42		.58 mm	2.8 mm						2.88 mm
QN9083DUK	NXP Semiconductors	TELECOM CIRCUIT		BALL	47	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA47,6X7,16		.4 mm	85 Cel	-40 Cel		BOTTOM	2 Mbps	R-XBGA-B47		.395 mm	3.2 mm						3.28 mm
BGU8006	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.32 mm	.44 mm						.65 mm
QN9083CUK	NXP Semiconductors	TELECOM CIRCUIT		BALL	47	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA47,6X7,16		.4 mm	85 Cel	-40 Cel		BOTTOM	2 Mbps	R-XBGA-B47		.395 mm	3.2 mm						3.28 mm
PN7120A0EV/C1XXXX	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B49		1 mm	4 mm						4.3 mm
BGU8004X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6	1	.32 mm	.44 mm					260	.65 mm
BGU8004	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.32 mm	.44 mm						.65 mm
BGU8004Z	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6	1	.32 mm	.44 mm					260	.65 mm
BGT60E6327	Infineon Technologies	TELECOM CIRCUIT		BALL	119	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm				BOTTOM		S-PBGA-B119		.8 mm	6 mm						6 mm
BGT60E6327XTMA1	Infineon Technologies	TELECOM CIRCUIT		BALL	119	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm				BOTTOM		S-PBGA-B119		.8 mm	6 mm						6 mm
PMB8753	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	65	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B65		.8 mm	5 mm	Not Qualified		e1			5 mm
BCM20713A1KUFBXG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	50	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B50	3	.6 mm	4 mm			e1		260	4.5 mm
BCM20715A1KUBXG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.22 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B42		.6 mm	2.509 mm						3.019 mm
BCM4330XKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B144		1 mm	6.5 mm						6.5 mm
BCM43455HKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B140		.6 mm	4.47 mm						5.27 mm
BCM4334XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	109	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B109		.55 mm	4.08 mm						4.48 mm
BCM4329GKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	182	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B182		.55 mm	5.62 mm						6.57 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.