VFBGA Other Function Telecom Interface ICs 304

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Battery Supply (V)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NRF51822-CEAA-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		R-PBGA-B62		.55 mm	3.5 mm			NOT SPECIFIED	NOT SPECIFIED	3.83 mm
NRF52840-CKAA-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	BALL	93	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA93,10X10,14		.35 mm	85 Cel		-40 Cel		BOTTOM	2 Mbps	R-PBGA-B93	1	.514 mm	3.544 mm					3.607 mm
NRF51822-CFAC-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		S-PBGA-B62		.55 mm	3.83 mm			NOT SPECIFIED	NOT SPECIFIED	3.83 mm
NRF52840-QIAA	Nordic Semiconductor Asa	TELECOM CIRCUIT	INDUSTRIAL	BALL	73	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B73	2	.85 mm	7 mm					7 mm
SN65DSI84ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 Mbps	S-PBGA-B64	3	1 mm	5 mm		e1	30	260	5 mm
BQ51013BYFPR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1		5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-XBGA-B28	1	.5 mm	1.88 mm		e1	30	260	3 mm
SN65DSI83ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 Mbps	S-PBGA-B64	3	1 mm	5 mm		e1	30	260	5 mm
BLUENRG-134	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	105 Cel		-40 Cel		BOTTOM		R-PBGA-B34		.5 mm	2.56 mm			NOT SPECIFIED	NOT SPECIFIED	2.66 mm
CC2640R2FYFVT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B34	1	.575 mm	2.684 mm		e1	30	260	2.684 mm
BQ51013BYFPT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1		5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-XBGA-B28	1	.5 mm	1.88 mm		e1	30	260	3 mm
BQ51003YFPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm		e1	30	260	3 mm
SN65DSI83ZQET	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm					5 mm
NRF51822-CDAB-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		R-PBGA-B56	1	.55 mm	3.33 mm					3.5 mm
CC2640R2FYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	34	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B34	1	.575 mm	2.684 mm		e1	30	260	2.684 mm
NRF51822-CFAC-R7	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		S-PBGA-B62		.55 mm	3.83 mm			NOT SPECIFIED	NOT SPECIFIED	3.83 mm
CC2564BYFVR-XI	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1		3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1	.575 mm	2.93 mm		e1	30	260	3.26 mm
PM-8916-0-176NSP-TR-02-1-01	Qualcomm	TELECOM CIRCUIT		BALL	176	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	HVCMOS	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm					BOTTOM		S-PBGA-B176	3	.86 mm	6.2 mm					6.2 mm
CC2564BYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	54	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1		3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	4 Mbps	R-XBGA-B54	1	.575 mm	2.93 mm		e1	30	260	3.26 mm
SN65DSI86ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	5400 Mbps	S-PBGA-B64	3	1 mm	5 mm		e1	30	260	5 mm
BQ51013AYFPT	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.002 Mbps	R-PBGA-B28	1	.5 mm	1.88 mm		e1	30	260	3 mm
SX8651ICSTRT	Semtech	TELECOM CIRCUIT	INDUSTRIAL	BALL	12	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		R-PBGA-B12	1	.625 mm	1.5 mm		e4		260	2 mm
TLK2711AJRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80	3	1 mm	5 mm	Not Qualified	e1	30	260	5 mm
ADV7533BCBZ-RL	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	SQUARE	UNSPECIFIED	YES	1	CMOS	1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-10 Cel	TIN SILVER COPPER	BOTTOM		S-XBGA-B49	1	.66 mm	3.46 mm	Not Qualified	e1	30	260	3.46 mm
BQ51003YFPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	28	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	5	-40 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B28	1	.5 mm	1.88 mm		e1	30	260	3 mm
SN65DSI85ZQER	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1 Mbps	S-PBGA-B64	3	1 mm	5 mm		e1	30	260	5 mm
AD6676BCBZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.1 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B80	1	.66 mm	5.04 mm		e1	30	260	4.29 mm
EFR32BG1P332F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B43	1	.54 mm	3.143 mm		e1	40	260	3.295 mm
AD8312ACBZ-P7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.675 mm	.95 mm	Not Qualified	e1	40	260	1.45 mm
NRF51822-CEAA-R	Nordic Semiconductor Asa	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BALL	62	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	75 Cel		-25 Cel		BOTTOM		R-PBGA-B62		.55 mm	3.5 mm			NOT SPECIFIED	NOT SPECIFIED	3.83 mm
EFR32BG1V132F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B43		.54 mm	3.143 mm					3.295 mm
BGS13S2N9E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED	YES	1	MOS	3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel	TIN	BOTTOM		S-XBGA-B9	1	.4 mm	1.1 mm		e3			1.1 mm
AD8312ACBZ-P2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.675 mm	.95 mm	Not Qualified	e1	40	260	1.45 mm
TLK2711JRGQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel		BOTTOM		S-PBGA-B80		1 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
TLK2711JRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80	3	1 mm	5 mm	Not Qualified	e1	30	260	5 mm
LM3290TME/NOPB	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	30	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-30 Cel	TIN SILVER COPPER	BOTTOM		R-XBGA-B30	1	.675 mm			e1	30	260
SN65DSI85ZQE	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	64	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		S-PBGA-B64		1 mm	5 mm					5 mm
CYW43438KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel		-30 Cel		BOTTOM		R-PBGA-B63	1	.55 mm	2.87 mm					4.87 mm
CYW43364KUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel		-30 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B74	1	.55 mm	2.87 mm		e1			4.87 mm
WL1801GYFVR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	130	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA130,11X12,16		.4 mm	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B130	1	.575 mm	4.64 mm		e1	30	260	4.93 mm
EFR32BG1B232F256GJ43-C0	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BALL	43	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B43		.54 mm	3.143 mm					3.295 mm
ADL5506ACBZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.56 mm	.79 mm		e1	30	260	1.19 mm
CYW43455XKUBGT	Infineon Technologies	TELECOM CIRCUIT		BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA140,11X13,16		.4 mm	85 Cel		-30 Cel		BOTTOM	433.3 Mbps	R-PBGA-B140	1	.6 mm	4.47 mm					5.27 mm
HMC6301BG46	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	75	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.35 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		BOTTOM		R-PBGA-B75	1	.815 mm	4 mm			30	260	6 mm
CYW20706UA1KFFB1G	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-30 Cel		BOTTOM		R-PBGA-B49		1 mm	4 mm					4.5 mm
CYW4343WKUBGT	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	74	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel		-30 Cel		BOTTOM		R-PBGA-B74	1	.55 mm	2.87 mm					4.87 mm
BCM4330FKFFBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	144	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel		-30 Cel		BOTTOM		S-PBGA-B144		1 mm	6.5 mm					6.5 mm
BCM43438KUBGT	Cypress Semiconductor	TELECOM CIRCUIT	OTHER	BALL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	70 Cel		-30 Cel		BOTTOM		R-PBGA-B63		.55 mm	2.87 mm					4.87 mm
BCM43455XKUBG	Infineon Technologies	TELECOM CIRCUIT	OTHER	BALL	140	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		1.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel		-30 Cel		BOTTOM		R-PBGA-B140		.6 mm	4.47 mm					5.27 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.