BUTT Other Function Telecom Interface ICs 147

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
WL1801MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
LBEE5KL1DX-883	Murata Manufacturing	TELECOM CIRCUIT	OTHER	BUTT	46		RECTANGULAR	UNSPECIFIED	YES	1				3.6 V		MICROELECTRONIC ASSEMBLY				70 Cel	-30 Cel		UNSPECIFIED		R-XXMA-B46	3	1.1 mm	5.15 mm					6.95 mm
ZED-F9P-02B	U-blox Ag	GNSS Module	INDUSTRIAL	BUTT	54	LGA	RECTANGULAR		YES	1		TS 16949		3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-B54						NOT SPECIFIED	NOT SPECIFIED
ZED-F9P-01B	U-blox Ag	GNSS Module	INDUSTRIAL	BUTT	54	LGA	RECTANGULAR		YES	1		TS 16949		3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-B54
BGS12SN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.6 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel	TIN	BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm		e3			1.1 mm
WL1837MODGIMOCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
WL1831MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
WL1837MODGIMOCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
BGT24LTR11N16E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	16	VBCC	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-PBCC-B16	1	.77 mm	2.4 mm		e3			2.4 mm
ZOE-M8Q-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	TFLGA	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B51	3	1.165 mm	4.5 mm			NOT SPECIFIED	NOT SPECIFIED	4.5 mm
WL1831MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
NCH-RSL10-101S51-ACG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, LOW PROFILE, FINE PITCH	MODULE,51LEAD(UNSPEC)		.7 mm	85 Cel	-40 Cel		UNSPECIFIED	4 Mbps	R-PBGA-B51	3	1.56 mm	6 mm			NOT SPECIFIED	260	8 mm
CC3235MODSF12MOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	63	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel	NICKEL GOLD	QUAD		R-XQMA-B63	3	2.4 mm	17.5 mm		e4	30	260	20.5 mm
ADAR1000ACCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1			-5 V	3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B88	3	.8 mm	7 mm				260	7 mm
ADAR1000ACCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1			-5 V	3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B88		.8 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
CC3235MODSM2MOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	63	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel	NICKEL GOLD	QUAD		R-XQMA-B63	3	2.4 mm	17.5 mm		e4	30	260	20.5 mm
ZED-F9T-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	54	LGA	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100		3 V		GRID ARRAY			1.1 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-B54	4	2.6 mm	17 mm					22 mm
WSM-BL241-ADA-008	Murata Manufacturing	TELECOM CIRCUIT	INDUSTRIAL	BUTT		LGA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		R-XBGA-B
WL1835MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
EVA-M8M-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	43		SQUARE	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		S-XXMA-B43	3	1.16 mm	7 mm					7 mm
WL1801MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
WL1835MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
BLUENRG-MSCSP	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	BUTT	34	VFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B34	1	.5 mm	2.56 mm					2.66 mm
BGSA14GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm
ADRF5044BCCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-B24	3	.96 mm	4 mm		e4	30	260	4 mm
SL3S1002FTB1,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					CHIP CARRIER	LCC3(UNSPEC)	Other Telecom ICs	.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm
ADRF5044BCCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-B24	3	.96 mm	4 mm		e4	30	260	4 mm
LE910C1-EU	Telit Communications Plc	TELECOM CIRCUIT	INDUSTRIAL	BUTT	181	LGA	SQUARE	UNSPECIFIED	YES	1				3.8 V		GRID ARRAY				85 Cel	-40 Cel		BOTTOM		S-XBGA-B181		2.2 mm	28.2 mm					28.2 mm
WL1805MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
BGSF18DM20E6327XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.5 V		GRID ARRAY, HEAT SINK/SLUG			.4 mm	85 Cel	-30 Cel	GOLD NICKEL	BOTTOM		R-XBGA-B20	3	.98 mm	2.8 mm		e4			3.2 mm
WL1807MODGIMOCT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
ZOE-M8G-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	TFLGA	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		1.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B51	3	1.165 mm	4.5 mm			NOT SPECIFIED	NOT SPECIFIED	4.5 mm
BGS12AL74E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER			.55 mm	85 Cel	-30 Cel	GOLD	BOTTOM		R-XBCC-B6	1	.5 mm	1.5 mm		e4			2.3 mm
BGM15LA12E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	12	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		R-XBCC-B12	1	.65 mm	1.1 mm		e4			1.9 mm
BGS18GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel		QUAD		S-XQMA-B14	1	.65 mm	2 mm					2 mm
CC3135MODRNMMOBR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	63	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel	NICKEL GOLD	QUAD		R-XQMA-B63	3	2.4 mm	17.5 mm		e4	30	260	20.5 mm
WL1807MODGIMOCR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
ZOE-M8B-0	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	TFLGA	SQUARE	UNSPECIFIED	YES	1				1.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B51	3	1.165 mm	4.5 mm					4.5 mm
BGS13SN8E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	8	BCC	SQUARE	UNSPECIFIED	YES	1	MOS					CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		S-XBCC-B8	1	.4 mm	1.1 mm		e3			1.1 mm
BGSA12GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm
BGA5H1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
SI32170-C-GM1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	42	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B42		.9 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
BGA5M1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
NINA-W102-00B-00	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	1		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B1	4	4.2 mm	10 mm					14 mm
BGS13PN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			2.85 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm		e3			1.5 mm
XCC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	BUTT	33	BCC	SQUARE	UNSPECIFIED	YES	1				3.6 V		CHIP CARRIER				70 Cel	-20 Cel		BOTTOM		S-XBCC-B33		1.4 mm	7 mm					7 mm
ADMP510ACEZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	TLGA	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		GRID ARRAY, THIN PROFILE			1.22 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-B3		1.08 mm	2.5 mm			NOT SPECIFIED	NOT SPECIFIED	3.35 mm
BGSA11GN10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.4 mm	1.1 mm					1.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.