BUTT Other Function Telecom Interface ICs 147

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGA123L4

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

4

BCC

SQUARE

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-B4

.32 mm

.7 mm

NOT SPECIFIED

NOT SPECIFIED

.7 mm

BGS13GA14E6327

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

14

BCC

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

GOLD NICKEL

BOTTOM

S-XBCC-B14

.65 mm

2 mm

e4

2 mm

BGS17GA14E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

GOLD NICKEL

QUAD

S-XQMA-B14

1

.65 mm

2 mm

e4

2 mm

BGS12SN6

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.6 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

Tin (Sn)

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

e3

NOT SPECIFIED

NOT SPECIFIED

1.1 mm

BGS12SL6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

.32 mm

.7 mm

NOT SPECIFIED

NOT SPECIFIED

1.1 mm

BGS14AN16

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

16

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBCC-B16

1

.77 mm

2.3 mm

2.3 mm

BGS12S3N6

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

MOS

2.6 V

CHIP CARRIER

.35 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

.65 mm

.98 mm

BGS18GA14

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

BGS17GA14E6327

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

.65 mm

2 mm

2 mm

BGS14AN16E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

16

HVBCC

SQUARE

PLASTIC/EPOXY

YES

1

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

TIN

BOTTOM

S-PBCC-B16

1

.77 mm

2.3 mm

e3

2.3 mm

BGS15GA14

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

BGS13S2N9

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

9

VFLGA

SQUARE

UNSPECIFIED

YES

1

MOS

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B9

1

.4 mm

1.1 mm

1.1 mm

BGS13PN10

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

1.5 mm

BGS14GA14

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

BGS12AL7-6

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.48 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

1.4 mm

1.26 mm

BGS16GA14

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

S-XBCC-B14

1

.65 mm

2 mm

2 mm

BGM15LA12E6327

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

12

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B12

.65 mm

1.1 mm

1.9 mm

BGS13GA14

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

14

BCC

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-B14

1

.65 mm

2 mm

2 mm

BGS15M2A12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

12

BCC

RECTANGULAR

UNSPECIFIED

YES

1

MOS

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B12

1

.65 mm

1.1 mm

1.9 mm

BGS13SL9

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

9

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

S-XBCC-B9

.32 mm

1.15 mm

1.15 mm

BGS15M2A12

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

12

BCC

RECTANGULAR

UNSPECIFIED

YES

1

MOS

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B12

1

.65 mm

1.1 mm

1.9 mm

BGS13SL9E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

9

BCC

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

S-XBCC-B9

.32 mm

1.15 mm

1.15 mm

BGS12S3N6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

MOS

2.6 V

CHIP CARRIER

.35 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-XBCC-B6

1

.4 mm

.65 mm

e3

.98 mm

BGM15LA12

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

12

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

GOLD NICKEL

BOTTOM

R-XBCC-B12

1

.65 mm

1.1 mm

e4

1.9 mm

BGS17GA14

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

14

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

QUAD

S-XQMA-B14

1

.65 mm

2 mm

2 mm

BGS12AL76E6327XTMA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.48 mm

85 Cel

-30 Cel

GOLD

BOTTOM

R-XBCC-B6

1

.4 mm

1.4 mm

e4

1.26 mm

BGS12AL7-4

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.55 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B6

1

.5 mm

1.5 mm

2.3 mm

BGS12SL6

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

3 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

.32 mm

.7 mm

1.1 mm

CYW20736S

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

48

SQUARE

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

TIN SILVER COPPER

UNSPECIFIED

S-XXMA-B48

3

1.18 mm

6.5 mm

e1

6.5 mm

CYW20732YB3ISLGH

Infineon Technologies

TELECOM CIRCUIT

MILITARY

BUTT

27

RECTANGULAR

UNSPECIFIED

YES

1

1.2 V

MICROELECTRONIC ASSEMBLY

125 Cel

-55 Cel

UNSPECIFIED

R-XXMA-B27

.96 mm

3.2 mm

3.5 mm

CYW20736E

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

48

TFLGA

SQUARE

UNSPECIFIED

YES

1

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B48

3

1.18 mm

6.5 mm

e1

6.5 mm

CYW20732YB3ISLGHT

Infineon Technologies

TELECOM CIRCUIT

MILITARY

BUTT

27

RECTANGULAR

UNSPECIFIED

YES

1

1.2 V

MICROELECTRONIC ASSEMBLY

125 Cel

-55 Cel

UNSPECIFIED

R-XXMA-B27

.96 mm

3.2 mm

3.5 mm

TC7765WBG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BUTT

28

VFLGA

SQUARE

UNSPECIFIED

YES

1

7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B28

.5 mm

2.4 mm

NOT SPECIFIED

NOT SPECIFIED

3.67 mm

TC7761WBG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BUTT

28

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CDMOS

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B28

.5 mm

2.4 mm

3.67 mm

TC7763WBG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BUTT

28

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CDMOS

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B28

.5 mm

2.4 mm

3.67 mm

TC7764WBG

Toshiba

TELECOM CIRCUIT

INDUSTRIAL

BUTT

28

VFLGA

SQUARE

UNSPECIFIED

YES

1

7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B28

.5 mm

2.4 mm

3.67 mm

RY7011A0000DZ00#002

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BUTT

42

LLGA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

GRID ARRAY, LOW PROFILE

.85 mm

75 Cel

-25 Cel

BOTTOM

R-XBGA-B42

3

1.7 mm

8.95 mm

13.35 mm

RY7011A0000DZ00#001

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BUTT

42

LLGA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

GRID ARRAY, LOW PROFILE

.85 mm

75 Cel

-25 Cel

BOTTOM

R-XBGA-B42

3

1.7 mm

8.95 mm

13.35 mm

HA12190MA

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BUTT

44

QFI

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

FLATPACK

.762 mm

70 Cel

-20 Cel

QUAD

R-PQFP-B44

2.4 mm

10 mm

Not Qualified

10.8 mm

HA12089MP

Renesas Electronics

TELECOM CIRCUIT

COMMERCIAL

BUTT

44

QFI

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

FLATPACK

1.016 mm

65 Cel

-20 Cel

QUAD

R-PQFP-B44

2.92 mm

11.88 mm

Not Qualified

14.42 mm

AFEM-S106-BLKG

Broadcom

TELECOM CIRCUIT

OTHER

BUTT

14

HBCC

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

85 Cel

-30 Cel

BOTTOM

S-XBCC-B14

3

3.2 mm

260

3.2 mm

ACPM-5017-TR1

Broadcom

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.4 V

CHIP CARRIER

.6 mm

90 Cel

-20 Cel

BOTTOM

S-XBCC-B10

3

1 mm

3 mm

260

3 mm

AFEM-S106-TR1G

Broadcom

TELECOM CIRCUIT

OTHER

BUTT

14

HBCC

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

85 Cel

-30 Cel

BOTTOM

S-XBCC-B14

3

3.2 mm

260

3.2 mm

MGA-43040-BLKG

Broadcom

TELECOM CIRCUIT

BUTT

28

HVBCC

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

BOTTOM

S-XBCC-B28

.91 mm

5 mm

5 mm

MGA-43013-TR1G

Broadcom

TELECOM CIRCUIT

BUTT

28

HVBCC

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

BOTTOM

S-XBCC-B28

3

1 mm

5 mm

260

5 mm

ACPM-5017-BLK

Broadcom

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

SQUARE

UNSPECIFIED

YES

1

BIPOLAR

3.4 V

CHIP CARRIER

.6 mm

90 Cel

-20 Cel

BOTTOM

S-XBCC-B10

3

1 mm

3 mm

260

3 mm

MGA-43040-TR1G

Broadcom

TELECOM CIRCUIT

BUTT

28

HVBCC

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

BOTTOM

S-XBCC-B28

.91 mm

5 mm

5 mm

MGA-43013-BLKG

Broadcom

TELECOM CIRCUIT

BUTT

28

HVBCC

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

BOTTOM

S-XBCC-B28

3

1 mm

5 mm

260

5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.