BUTT Other Function Telecom Interface ICs 147

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AMMP-6532-TR2G	Broadcom	TELECOM CIRCUIT		BUTT	8	BCC	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER						NICKEL GOLD	BOTTOM		S-XBCC-B8	3	2.25 mm	5.215 mm	Not Qualified	e4	20	260	5.215 mm
BGM111E256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	31		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B31		2.15 mm	12.9 mm					15 mm
EMMY-W161-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	46		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-B46			13.8 mm			40	245	19.8 mm
BGS14GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	GOLD NICKEL	QUAD		S-XQMA-B14	1	.65 mm	2 mm		e4			2 mm
SARA-U270-03S	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	96		RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B96	4	3.25 mm	16 mm					26 mm
BGS15GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	14		SQUARE	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-30 Cel	GOLD NICKEL	QUAD		S-XQMA-B14	1	.65 mm	2 mm		e4			2 mm
RF6504SQ	Qorvo	TELECOM CIRCUIT	INDUSTRIAL	BUTT	28	LFLGA	RECTANGULAR	UNSPECIFIED	YES	1				3.6 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.676 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-B28		1.25 mm	5 mm					5.5 mm
SARA-U201-03B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	96		RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B96	4	3.25 mm	16 mm					26 mm
BGM111E256V2R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	31		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B31		2.15 mm	12.9 mm					15 mm
BGS13GA14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	14	BCC	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel	GOLD NICKEL	BOTTOM		S-XBCC-B14	1	.65 mm	2 mm		e4			2 mm
EMMY-W163-00B	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	46		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-B46			13.8 mm			40	245	19.8 mm
SARA-U260-00S	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	96		RECTANGULAR	UNSPECIFIED	YES	1				3.8 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B96	4	3 mm	16 mm					26 mm
ZOE-M8G-0-10	U-blox Ag	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	XMA	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		1.8 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XXMA-B51	3	1.165 mm	4.5 mm					4.5 mm
BGS110MN20E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	BCC	SQUARE	UNSPECIFIED	YES	1				3.5 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		S-XBCC-B20	1	.77 mm	2.3 mm					2.3 mm
SE2593A20-R	Skyworks Solutions	TELECOM CIRCUIT	OTHER	BUTT	30	TFLGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.625 mm	85 Cel	0 Cel		BOTTOM		R-PBGA-B30		1.1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
SE5516A-R	Skyworks Solutions	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B24		1.15 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
BCM20736E	Cypress Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	BUTT	48	TFLGA	SQUARE	UNSPECIFIED	YES	1						GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B48		1.18 mm	6.5 mm					6.5 mm
SE2547A-R	Skyworks Solutions	TELECOM CIRCUIT	OTHER	BUTT	32	TFLGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B32		1.1 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
SI32170-C-FM1	Silicon Labs	TELECOM CIRCUIT	COMMERCIAL	BUTT	42	HVBCC	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel		BOTTOM		R-XBCC-B42		.9 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
ADRF5045BCCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-B24	3	.96 mm	4 mm		e4	30	260	4 mm
ADRF5045BCCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-B24	3	.96 mm	4 mm		e4	30	260	4 mm
XCC2564MODNCMOER	Texas Instruments	TELECOM CIRCUIT	OTHER	BUTT	33	BCC	SQUARE	UNSPECIFIED	YES	1				3.6 V		CHIP CARRIER				70 Cel	-20 Cel		BOTTOM		S-XBCC-B33		1.4 mm	7 mm					7 mm
TRF5001GQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	80	VFLGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	65 Cel	0 Cel		BOTTOM		S-PBGA-B80		1 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
WL1805MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel	-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100	3	2 mm	13.3 mm	Not Qualified	e4	30	260	13.4 mm
ADAR1000	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, HEAT SINK/SLUG	LGA88,13X13,20		.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B88		.8 mm	7 mm					7 mm
ADMP510ACEZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	TLGA	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		GRID ARRAY, THIN PROFILE			1.22 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-B3		1.08 mm	2.5 mm			NOT SPECIFIED	NOT SPECIFIED	3.35 mm
LV72715PLG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	68	VFLGA	SQUARE	UNSPECIFIED	YES	1	CMOS			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B68		.85 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
NCH-RSL10-01S51-ACG	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	BUTT	51	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.25 V		CHIP CARRIER			.7 mm	85 Cel	-40 Cel		BOTTOM	4 Mbps	R-PBCC-B51		1.56 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	8 mm
SL3S1202FTB1,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					CHIP CARRIER	LCC3(UNSPEC)	Other Telecom ICs	.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm
SL3S1002FTB1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					CHIP CARRIER			.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3			1.45 mm
SL3S1202FTB1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					CHIP CARRIER			.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3			1.45 mm
HTMS8301FTK/AF	NXP Semiconductors	TELECOM CIRCUIT		BUTT	2		RECTANGULAR	PLASTIC/EPOXY	YES							CHIP CARRIER							BOTTOM		R-PBCC-B2				Not Qualified
HTMS8301FTB/AF	NXP Semiconductors	TELECOM CIRCUIT		BUTT	3		RECTANGULAR	PLASTIC/EPOXY	YES							CHIP CARRIER							BOTTOM		R-PBCC-B3				Not Qualified
MC12311	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	60	VFLGA	SQUARE	UNSPECIFIED	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B60		.98 mm	8 mm					8 mm
HTMS1301FTK/AF	NXP Semiconductors	TELECOM CIRCUIT		BUTT	2		RECTANGULAR	PLASTIC/EPOXY	YES							CHIP CARRIER							BOTTOM		R-PBCC-B2				Not Qualified
HTMS1301FTB/AF	NXP Semiconductors	TELECOM CIRCUIT		BUTT	3		RECTANGULAR	PLASTIC/EPOXY	YES							CHIP CARRIER							BOTTOM		R-PBCC-B3				Not Qualified
BGA8U1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGSF18DM20	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.5 V		GRID ARRAY, HEAT SINK/SLUG			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBGA-B20	3	.98 mm	2.8 mm					3.2 mm
PBA31305	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL EXTENDED	BUTT	36	LLGA	SQUARE	UNSPECIFIED	YES	1	CMOS			2.6 V		GRID ARRAY, LOW PROFILE			1.27 mm	75 Cel	-20 Cel		BOTTOM		S-XBGA-B36		1.6 mm	8.8 mm	Not Qualified				8.8 mm
BGSX44MA12	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	12	BCC	SQUARE	UNSPECIFIED	YES	1	CMOS			1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		S-XBCC-B12	1	.65 mm	1.6 mm					1.6 mm
BGT24LTR11N16	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	16	HVBCC	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBCC-B16	1	.77 mm	2.4 mm					2.4 mm
BGSF18DM20E6727XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	20	HLGA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			3.5 V		GRID ARRAY, HEAT SINK/SLUG			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBGA-B20	3	.98 mm	2.8 mm					3.2 mm
PBM99080/32LG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	78	VFLGA	SQUARE	UNSPECIFIED	YES	1				2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.75 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B78		1 mm	8 mm	Not Qualified				8 mm
BGA5L1BN6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
BGA729N6E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	6	BCC	RECTANGULAR	UNSPECIFIED	YES	1				2.8 V		CHIP CARRIER			.4 mm	85 Cel	-40 Cel		BOTTOM		R-XBCC-B6	1	.4 mm	.7 mm					1.1 mm
PBM99080/22LG	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	78	VFLGA	SQUARE	UNSPECIFIED	YES	1				2.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.75 mm	85 Cel	-40 Cel		BOTTOM		S-XBGA-B78		1 mm	8 mm	Not Qualified				8 mm
BGAU1A10E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	10	BCC	RECTANGULAR	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		R-XBCC-B10	1	.65 mm	1.1 mm					1.5 mm
BGT24LTR11N16E6327	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	BUTT	16	VBCC	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBCC-B16		.77 mm	2.4 mm					2.4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.