GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Companding Law	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
AD9832BRUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified		e3	30	260	5 mm
OPA2380AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2	2			.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	2	1.1 mm		3 mm	Not Qualified		e4	30	260	3 mm
AP22814AW5-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G5		1.4 mm		1.6 mm			e3	30	260	3 mm
TDA7116FHTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3			3 mm
ATECC508A-SSHDA-B	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	TS 16949		3.6 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	3	1.75 mm		3.9 mm			e4		260	4.9 mm
OPA2380AIDGKRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	2				.016 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	2	1.1 mm		3 mm	Not Qualified		e4	30	260	3 mm
PEF7072HLV16SLLHN	Intel	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1							FLATPACK								QUAD	R-PQFP-G64
SA612AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G8		1.75 mm		3.9 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
SA602AD/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	R-PDSO-G8	1	1.75 mm		3.9 mm			e4	30	260	4.9 mm
TDK5101FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3			3 mm
MFRC53001T/0FE,112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel			DUAL	R-PDSO-G32	1	2.65 mm		7.5 mm					250	20.5 mm
OPA380AIDGKRG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				.008 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	2	1.1 mm		3 mm	Not Qualified		e4	30	260	3 mm
PCM3060PWR	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	2	1.2 mm		4.4 mm	Not Qualified		e4	30	260	9.7 mm
TDK5110FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3			3 mm
TLV320AIC22CPTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	2					3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	4	1.6 mm	16-BIT	7 mm	Not Qualified	A/MU-LAW	e4	30	260	7 mm	YES
TMS3705A1DRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	3	1.75 mm		3.9 mm	Not Qualified		e4	30	260	9.9 mm
TM266DVA1	Pulse Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		HYBRID			5 V	5	SMALL OUTLINE, SHRINK PITCH	SOP28,.5	ATM/SONET/SDH ICs	.65 mm	125 Cel	-55 Cel			DUAL	R-PDSO-G28	1	5.588 mm			Not Qualified
TLV320AIC22CPT	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	4	1.6 mm	16-BIT	7 mm	Not Qualified	A/MU-LAW	e4	30	260	7 mm	YES
AD73311ARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified		e3		260	7.2 mm	YES
TMS3705EDRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	3	1.75 mm		3.9 mm			e4	30	260	9.9 mm
ADF7012BRUZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified		e3	30	260	7.8 mm
TDA5201XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		TIN	DUAL	R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified		e3			9.7 mm
TDK5100FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel	-40 Cel		MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3			3 mm
TDA5150	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V	2/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			DUAL	S-PDSO-G10	1	1.05 mm		3 mm	Not Qualified				260	3 mm
SA616DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4		260	6.5 mm
AD8015AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e0		240	4.9 mm
ATA8405C-6DQY-66	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	50 Cel	0 Cel		MATTE TIN	DUAL	S-PDSO-G10	2	1.1 mm		3 mm			e3	40	260	3 mm
MLX90109EDC-AAA-000-RE	Melexis N V	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G8	1	1.72 mm		3.9 mm			e3		260	4.9 mm
PCM3060PW	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	2	1.2 mm		4.4 mm	Not Qualified		e4	30	260	9.7 mm
AD608ARZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	9.9 mm
HMC244AG16	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE			.76 mm	85 Cel	-40 Cel		GOLD OVER NICKEL	QUAD	S-PQFP-G16	1	1.65 mm		5.84 mm			e4	30	250	5.84 mm
SA636DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm		4.4 mm	Not Qualified		e4	30	260	6.5 mm
TDA5211XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel	-40 Cel		TIN	DUAL	R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified		e3			9.7 mm
TLE8457BSJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100		8 V		SMALL OUTLINE			1.27 mm				TIN	DUAL	R-PDSO-G8	3	1.75 mm		4 mm			e3			5 mm
ATPL250A-AKU-R	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G80		1.6 mm		12 mm			e3			12 mm
SA602AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL	R-PDSO-G8		1.75 mm		3.9 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
TDA7110FHTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified		e3			3 mm
UCC3750DW	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	2	2.65 mm		7.5 mm	Not Qualified		e4	30	260	17.9 mm
UCC3750DWTR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	2	2.65 mm		7.5 mm	Not Qualified		e4	30	260	17.9 mm
HT12D(20SOP)	Holtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS				2.4/12	SMALL OUTLINE	SOP20(UNSPEC)	Other Telecom ICs		70 Cel	-20 Cel			DUAL	R-PDSO-G20					Not Qualified
AD8015ARZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				26 mA	5 V		SMALL OUTLINE				85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G8	1				Not Qualified		e3	30	260
SA606DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20	1	1.5 mm		4.4 mm			e4	30	260	6.5 mm
TLK2711IRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1 mm		10 mm	Not Qualified		e4	30	260	10 mm
TLK2711IRCPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G64	3	1 mm		10 mm	Not Qualified		e4	30	260	10 mm
MAX7044AKA-T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.0257 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G8	1	1.45 mm		1.625 mm	Not Qualified		e0			2.9 mm
MAX7044AKA+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.0257 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		NICKEL GOLD PALLADIUM	DUAL	R-PDSO-G8	1	1.45 mm		1.625 mm	Not Qualified			30	260	2.9 mm
TM1062DVA1	Pulse Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		HYBRID			5 V	5	SMALL OUTLINE, SHRINK PITCH	SOP28,.5	ATM/SONET/SDH ICs	.65 mm	125 Cel	-55 Cel			DUAL	R-PDSO-G28	1	5.588 mm			Not Qualified
TMS3705DDRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16	3	1.75 mm		3.9 mm			e4	30	260	9.9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.