GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
XRT85L61IG-F	Exar	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	1	1.2 mm		4.4 mm	Not Qualified	e3			9.7 mm
ADF7012BRUZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified	e3	30	260	7.8 mm
LM2893M	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			18 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		2.642 mm		7.49 mm					12.8 mm
LM2893MX	National Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				79 mA	18 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		2.65 mm		7.5 mm	Not Qualified				12.8 mm
CLRC63201T/0FE,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel			DUAL		R-PDSO-G32	1	2.65 mm		7.5 mm				250	20.5 mm
UCC3750DWTRG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm		7.5 mm	Not Qualified	e4	30	260	17.9 mm
CY7B923-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		.085 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm		7.505 mm	Not Qualified	e4	20	260	17.905 mm
ISL32275EFVZ-T	Renesas Electronics	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G16	2	1.2 mm		4.4 mm		e3	30	260	5 mm
AS3933-BTST	Ams Ag	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G16	3	1.2 mm		4.4 mm				260	5 mm
MCP2140-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	TS 16949		3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G18	2	2.64 mm		7.49 mm	Not Qualified	e3			11.53 mm
SA602AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G8		1.75 mm		3.9 mm	Not Qualified				4.9 mm
TLK2711AIRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm		10 mm	Not Qualified	e4	30	260	10 mm
TLK2711AIRCPR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1					2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm		10 mm	Not Qualified	e4	30	260	10 mm
ADV7619KSVZ-P	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel	0 Cel		Matte Tin (Sn) - annealed	QUAD		S-PQFP-G128	3	1.2 mm		14 mm		e3		260	14 mm
TDA7200XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	-20 Cel		TIN	DUAL		R-PDSO-G28	3	1.2 mm		4.4 mm	Not Qualified	e3			9.7 mm
AP22804BW5-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G5		1.4 mm		1.6 mm		e3	30	260	3 mm
AD8314ARMZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified	e3		260	3 mm
SA616DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G20		1.5 mm		4.4 mm	Not Qualified				6.5 mm
UJA1023T/2R04/C,512	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel			DUAL		R-PDSO-G16		1.75 mm		3.9 mm					9.9 mm
MGC3030-I/SS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	2	2 mm		5.3 mm		e3	40	260	10.2 mm
AD73311ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	TIN LEAD	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified	e0		240	7.2 mm	YES
ATA8404C-6DQY-66	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	50 Cel	0 Cel		MATTE TIN	DUAL		S-PDSO-G10	2	1.1 mm		3 mm		e3	40	260	3 mm
MCP2140A-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	TS 16949		3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn)	DUAL		R-PDSO-G18	2	2.65 mm		7.5 mm	Not Qualified	e3	40	260	11.55 mm
SI4010-C2-GTR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE			.5 mm	85 Cel	-40 Cel			DUAL		S-PDSO-G10		1.1 mm		3 mm	Not Qualified				3 mm
AD73311ARSZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified	e3	40	260	7.2 mm	YES
AD8015ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified	e3	30	260	4.9 mm
ATA8403C-6AQY66	Microchip Technology	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES					11 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.635 mm	85 Cel	-55 Cel		MATTE TIN	DUAL		R-PDSO-G8					Not Qualified	e3
ATA8403C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		.65 mm	85 Cel	-55 Cel		Matte Tin (Sn)	DUAL		S-PDSO-G8		1.05 mm		3 mm		e3	NOT SPECIFIED	NOT SPECIFIED	3 mm
TDA7100HTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	-20 Cel		MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified	e3			3 mm
AP22811BW5-7	Diodes Incorporated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	5	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G5		1.4 mm		1.6 mm		e3	30	260	3 mm
ATA8402C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				.0116 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		S-PDSO-G8		1.05 mm		3 mm	Not Qualified	e3			3 mm
ATA8402C-6AQY66	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				11.6 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel			DUAL		S-PDSO-G8		1.05 mm		3 mm	Not Qualified				3 mm
OPA380AID	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1			.008 mA	5 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	2	1.75 mm		3.9 mm	Not Qualified	e4	30	260	4.9 mm
PCM3060PWRG4	Texas Instruments	TELECOM CIRCUIT	OTHER	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	2	CMOS			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G28	2	1.2 mm		4.4 mm	Not Qualified	e4	NOT SPECIFIED	260	9.7 mm
MAX7033EUI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		TIN LEAD	DUAL		R-PDSO-G28	1	1.1 mm		4.4 mm	Not Qualified	e0			9.7 mm
MAX7033EUI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm		4.4 mm	Not Qualified	e3	30	260	9.7 mm
ML7037-003TBZ03A	Lapis Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		FLATPACK, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel			QUAD		S-PQFP-G64		1.2 mm		10 mm					10 mm
SI4010-C2-GSR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G14		2 mm		3.9 mm	Not Qualified		40	260	8.65 mm
SA602AD-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR			6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G8		1.75 mm		3.9 mm					4.9 mm
RTL8139D-LF	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			2.5 V		FLATPACK			.65 mm	70 Cel	0 Cel			QUAD		R-PQFP-G100		3.3 mm		14 mm			NOT SPECIFIED	NOT SPECIFIED	20 mm
TLE8457ASJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS	AEC-Q100		8 V		SMALL OUTLINE			1.27 mm				TIN	DUAL		R-PDSO-G8	3	1.75 mm		4 mm		e3			5 mm
AD73311LARSZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified	e3		260	7.2 mm
ATA3741P2-TGSY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.0086 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1			7.4 mm	Not Qualified	e3		260	12.825 mm
CY7B923-SXCT	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BICMOS		.085 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28	3	2.67 mm		7.505 mm	Not Qualified	e4	30	260	17.905 mm
MC33660BEFR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		TIN	DUAL		R-PDSO-G8	3	1.75 mm		3.9 mm		e3	40	260	4.9 mm
NCV7428D13R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			AEC-Q100		12 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G8	2	1.72 mm		3.937 mm		e3	30	260	4.927 mm
XR2211ACD-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		BIPOLAR		.009 mA	12 V	12	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		MATTE TIN	DUAL		R-PDSO-G14	2	1.75 mm		3.9 mm	Not Qualified	e3			8.65 mm
AD73311ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2.65 mm		7.5 mm	Not Qualified	e3	30	260	12.8 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.