GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
AD73311ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G20		1	2.65 mm		7.5 mm	Not Qualified			e3	30	260	12.8 mm
AD73311LARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS	.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel		-40 Cel		Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G20		1	2 mm		5.3 mm	Not Qualified			e0	30	240	7.2 mm
AD73311LARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS	.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G20		1	2 mm		5.3 mm	Not Qualified			e3		260	7.2 mm
AD73311LARSZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS	.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G20		1	2 mm		5.3 mm	Not Qualified			e3	40	260	7.2 mm
AD8015ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				26 mA	5 V		SMALL OUTLINE				85 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G8						Not Qualified			e3
ATA8401C-6AQY66	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				11.6 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel		-40 Cel			DUAL	S-PDSO-G8			1.05 mm		3 mm	Not Qualified						3 mm
ATA8401C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				.0116 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel		-55 Cel		MATTE TIN	DUAL	S-PDSO-G8			1.05 mm		3 mm	Not Qualified			e3			3 mm
MAX9152ESE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS	.07 mA	3.3 V	3.3	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel		-40 Cel		TIN LEAD	DUAL	R-PDSO-G16		1	1.75 mm		3.9 mm	Not Qualified			e0			9.9 mm
MAX9152ESE+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3.3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16		1	1.75 mm		3.9 mm	Not Qualified			e3	30	260	9.9 mm
MLX90109EDC-AAA-000-TU	Melexis N V	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G8		1	1.72 mm		3.9 mm				e3		260	4.9 mm
SA5224D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.035 mA	5 V	5	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G16			1.75 mm		3.9 mm	Not Qualified						9.9 mm
TMS3705BDRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		3	1.75 mm		3.91 mm	Not Qualified			e4	30	260	9.9 mm
XR2211ACDTR-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR		12 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		MATTE TIN	DUAL	R-PDSO-G14		2	1.75 mm		3.9 mm	Not Qualified			e3			8.65 mm
AD73311ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel		-40 Cel	1 dB	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G20		1	2 mm	16-BIT	5.3 mm	Not Qualified			e0	30	240	7.2 mm	YES
ADF7012BRUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G24		1	1.2 mm		4.4 mm	Not Qualified			e3		260	7.8 mm
ATA5744N-TKQY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.0087 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	105 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G20		1			4.4 mm	Not Qualified			e3		260	6.625 mm
OPA380AIDR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		1		.008 mA	5 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	125 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8		2	1.75 mm		3.9 mm	Not Qualified			e4	30	260	4.9 mm
AD9832BRUZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS	5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G16		1	1.1 mm		4.4 mm	Not Qualified			e3	30	260	5 mm
ATA5743P3-TKQY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.0091 mA	5 V	5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	105 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G20		1	1.35 mm		4.4 mm	Not Qualified			e3			6.75 mm
ATA5743P6-TGQY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.0091 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G20		1			7.4 mm	Not Qualified			e3		260	12.825 mm
MAX3120EUA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		TIN LEAD	DUAL	S-PDSO-G8		1	1.1 mm		3 mm	Not Qualified			e0			3 mm
MAX3120EUA+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8		1	1.1 mm		3 mm	Not Qualified			e3	30	260	3 mm
SA612AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					6 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G8			1.75 mm		3.9 mm	Not Qualified						4.9 mm
SA639DH/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		1	1.1 mm		4.4 mm	Not Qualified			e4		260	7.8 mm
OPA381AIDGKR	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		1			5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8		2	1.1 mm		3 mm	Not Qualified			e4	30	260	3 mm
SA606DK,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G20			1.5 mm		4.4 mm	Not Qualified						6.5 mm
SA639DH/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		1	1.1 mm		4.4 mm				e4	30	260	7.8 mm
TM1062TXHUA	Pulse Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	16		RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		MICROELECTRONIC ASSEMBLY				125 Cel		-55 Cel			DUAL	R-PDMA-G16		3				Not Qualified
SA639DH,512	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR	.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G24			1.1 mm		4.4 mm	Not Qualified				40	260	7.8 mm
SA639DH,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G24			1.1 mm		4.4 mm	Not Qualified						7.8 mm
AD73322AR-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3 V	3/5	SMALL OUTLINE	SOP28,.4	Codecs	1.27 mm	85 Cel		-40 Cel	1.2 dB	TIN LEAD	DUAL	R-PDSO-G28		3	2.65 mm	16-BIT	7.5 mm	Not Qualified			e0		240	17.9 mm	YES
AD8314ARMZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		MATTE TIN	DUAL	S-PDSO-G8		1	1.1 mm		3 mm	Not Qualified			e3	30	260	3 mm
CY7C924ADX-AXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS	.25 mA	5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel		MATTE TIN	QUAD	S-PQFP-G100		3	1.6 mm		14 mm	Not Qualified			e3	30	260	14 mm
MLX90109EDC	Melexis N V		INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					2 mA		3.3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel		-40 Cel		Matte Tin (Sn)	DUAL	R-PDSO-G8						Not Qualified			e3
RTL8139DL-LF	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel			QUAD	S-PQFP-G100			1.7 mm		14 mm					NOT SPECIFIED	NOT SPECIFIED	14 mm
SA639DH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR	.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel			DUAL	R-PDSO-G24			1.1 mm		4.4 mm	Not Qualified				40	260	7.8 mm
IDT82V3010PVG8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G56		1	2.794 mm		7.493 mm	Not Qualified			e3	30	260	18.415 mm
MLX90109CDC-AAA-000-TU	Melexis N V	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		MATTE TIN	DUAL	R-PDSO-G8		1	1.72 mm		3.9 mm				e3		260	4.9 mm
RTL8139DL	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel			QUAD	S-PQFP-G100			1.7 mm		14 mm					NOT SPECIFIED	NOT SPECIFIED	14 mm
RTL8139DL-GR	Realtek Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		2.5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel			QUAD	S-PQFP-G100			1.7 mm		14 mm					NOT SPECIFIED	NOT SPECIFIED	14 mm
SI4010-C2-GS	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3.3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G14		3	2 mm		3.9 mm	Not Qualified			e3	40	260	8.65 mm
AD73311AR-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3 V	3/5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel		-40 Cel	1 dB	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G20		1	2.65 mm	16-BIT	7.5 mm	Not Qualified			e0	30	240	12.8 mm	YES
AFE4300PNR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BINARY/TWOS COMP	2		.00097 mA	3.3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel		NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80	VOLTAGE	3	1.6 mm		12 mm	Not Qualified	DIFFERENTIAL	3.4 V	e4	30	260	12 mm
MLX90109CDC-AAA-000-RE	Melexis N V	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel		MATTE TIN	DUAL	R-PDSO-G8		1	1.72 mm		3.9 mm				e3		260	4.9 mm
ST7570	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS	.03 mA	13 V	13	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-PQFP-G48		3	1 mm		7 mm	Not Qualified			e3	40	260	7 mm
ST7570TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS	.03 mA	13 V	13	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD	S-PQFP-G48		3	1 mm		7 mm	Not Qualified			e3	40	260	7 mm
SY88403BLEY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel		-40 Cel		MATTE TIN	DUAL	R-PDSO-G10			1.1 mm		3 mm	Not Qualified			e3			3 mm
AD73322AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3 V	3/5	SMALL OUTLINE	SOP28,.4	Codecs	1.27 mm	85 Cel		-40 Cel	1.2 dB	TIN LEAD	DUAL	R-PDSO-G28		3	2.65 mm	16-BIT	7.5 mm	Not Qualified			e0		240	17.9 mm	YES

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.