GULL WING Other Function Telecom Interface ICs 2,043

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
OPA2381AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1							.0011 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8		2	1.1 mm		3 mm	Not Qualified			e4	30	260	3 mm
OPA381AIDGKT	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		1						5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel		NICKEL PALLADIUM GOLD SILVER	DUAL		S-PDSO-G8		2	1.1 mm		3 mm	Not Qualified			e4	30	260	3 mm
PSB21150FV1.4	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS					3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel			QUAD		S-PQFP-G64		3	1.6 mm		10 mm						260	10 mm
SA606D/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		1	1.5 mm		4.4 mm	Not Qualified			e4			6.5 mm
SI4010-C2-GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS					3.3 V		SMALL OUTLINE			.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G10		2	1.1 mm		3 mm	Not Qualified			e4	40	260	3 mm
U2741B-NFBG3Y	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							.0125 mA	3 V	2.2/5.5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	85 Cel		-40 Cel		MATTE TIN	DUAL		R-PDSO-G16		1	1.7 mm			Not Qualified			e3		260	4.9 mm
XR-2211ACD	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR				9 mA	12 V	12	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G14		1	1.75 mm		3.9 mm	Not Qualified			e0	30	215	8.65 mm
AD73322LARUZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS				.031 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Codecs	.65 mm	85 Cel		-40 Cel	.75 dB	Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28		1	1.2 mm	16-BIT	4.4 mm	Not Qualified			e3	40	260	9.7 mm	YES
AD73360ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS					3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		MATTE TIN	DUAL		R-PDSO-G28		3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
AFE4300PN	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BINARY/TWOS COMP	2					.00097 mA	3.3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	VOLTAGE	3	1.6 mm		12 mm	Not Qualified	DIFFERENTIAL	3.4 V	e4	30	260	12 mm
LTC4400-1ES6#TRMPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel		MATTE TIN	DUAL		R-PDSO-G6		1	1 mm		1.6 mm	Not Qualified			e3			2.9 mm
OPA381AIDGKTG4	Texas Instruments	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1							.0011 mA	5 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	125 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8		2	1.1 mm		3 mm	Not Qualified			e4	30	260	3 mm
PEF7072HLV16	Intel	TELECOM CIRCUIT		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1										FLATPACK									QUAD		R-PQFP-G64
SA606DK	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel			DUAL		R-PDSO-G20			1.5 mm		4.4 mm	Not Qualified				40	260	6.5 mm
SA606DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel			DUAL		R-PDSO-G20			1.5 mm		4.4 mm	Not Qualified				40	260	6.5 mm
TSC2200IPWR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28		1	1.2 mm		4.4 mm	Not Qualified	SINGLE-ENDED		e4	30	260	9.7 mm
UCC2750DWTRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS					5 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel			DUAL		R-PDSO-G28			2.65 mm		7.5 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	17.9 mm
ATA5749C-6DQY	Atmel	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1								3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel		-40 Cel			DUAL		S-PDSO-G10			1.1 mm		3 mm							3 mm
ATA5749C-6DQY-64	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1								3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	125 Cel		-40 Cel		MATTE TIN	DUAL	.04 Mbps	S-PDSO-G10		2	1.1 mm		3 mm				e3	40	260	3 mm
GP2015/IG/FP1Q	Zarlink Semiconductor	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS					3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		TIN LEAD	QUAD		S-PQFP-G48		3	1.6 mm		7 mm	Not Qualified			e0		260	7 mm
ISL32275EIBZ-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS					3.3 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		MATTE TIN	DUAL		R-PDSO-G16		3	1.75 mm		3.9 mm				e3	30	260	9.9 mm
TLK2501IRCP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1						1		2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel		-40 Cel		NICKEL PALLADIUM GOLD	QUAD	2500 Mbps	S-PQFP-G64		3	1 mm		10 mm	Not Qualified			e4	30	260	10 mm
CY7B933-SXC	Infineon Technologies	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS				.155 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel		0 Cel		NICKEL PALLADIUM GOLD	DUAL	400 Mbps	R-PDSO-G28		3	2.67 mm		7.505 mm	Not Qualified			e4	20	260	17.905 mm
AD974BRSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS					5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		MATTE TIN	DUAL		R-PDSO-G28		3	2 mm		5.3 mm	Not Qualified			e3		260	10.2 mm
AD9856ASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS					3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD		S-PQFP-G48		3	1.6 mm		7 mm	Not Qualified			e3	30	260	7 mm
SI4012-C1001GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				.0198 mA	3.3 V	2/3.3	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel			DUAL		S-PDSO-G10			1.1 mm		3 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	3 mm
BA4116FV-E2	ROHM	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-30 Cel		TIN/TIN COPPER	DUAL		R-PDSO-G16			1.2 mm		4.4 mm	Not Qualified			e3/e2	10	260	5 mm
T5761-TGS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel		-40 Cel		TIN LEAD	DUAL		R-PDSO-G20			2.6 mm		7.4 mm	Not Qualified			e0			12.825 mm
ACPL-C799-000E	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								5 V		SMALL OUTLINE			1.27 mm	105 Cel		-40 Cel		TIN	DUAL		R-PDSO-G8		1	3.607 mm		5.85 mm				e3		260	6.807 mm
ACPL-C799-500E	Broadcom	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								5 V		SMALL OUTLINE			1.27 mm	105 Cel		-40 Cel		TIN	DUAL		R-PDSO-G8		1	3.607 mm		5.85 mm				e3		260	6.807 mm
IA3222B-F-FTR	Silicon Labs	TELECOM CIRCUIT	OTHER	GULL WING	10	VSSOP	SQUARE	PLASTIC/EPOXY	YES	1								3.3 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.508 mm	85 Cel		-25 Cel			DUAL		S-PDSO-G10			.9652 mm		3.048 mm					NOT SPECIFIED	NOT SPECIFIED	3.048 mm
MC13155DR2	Motorola	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR		-5 V					SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel			DUAL		R-PDSO-G16			1.75 mm		3.9 mm	Not Qualified						9.9 mm
SI4010-C2-ATR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS					3.3 V		SMALL OUTLINE			.5 mm	85 Cel		-40 Cel			DUAL		S-PDSO-G10			1.1 mm		3 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4012-C1001GTR	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				.0198 mA	3.3 V	2/3.3	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel			DUAL		S-PDSO-G10			1.1 mm		3 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4737-C40-GU	Silicon Labs	TELECOM CIRCUIT	OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS					3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-20 Cel		MATTE TIN	DUAL		R-PDSO-G24		3	2 mm		3.9 mm				e3	40	260	8.65 mm
T5761-TGQ	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1								5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel		-40 Cel		MATTE TIN	DUAL		R-PDSO-G20		2	2.6 mm		7.4 mm	Not Qualified			e3			12.825 mm
T5761N-TGS	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							.0099 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel		-40 Cel		TIN LEAD	DUAL		R-PDSO-G20		1			7.4 mm	Not Qualified			e0			12.825 mm
HSP50214BVIZ	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	120	QFP	SQUARE	PLASTIC/EPOXY	YES	1								5 V		FLATPACK			.8 mm	85 Cel		-40 Cel		MATTE TIN	QUAD		S-PQFP-G120		3	4.07 mm		28 mm	Not Qualified			e3			28 mm
PSB21150FSLLHQ	Intel	TELECOM CIRCUIT		GULL WING	64		RECTANGULAR	PLASTIC/EPOXY	YES	1																			QUAD		R-PQFP-G64										NOT SPECIFIED	NOT SPECIFIED
AD974ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS					5 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel		MATTE TIN	DUAL		R-PDSO-G28		3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
ADV7619KSVZ	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS					1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel		0 Cel		Matte Tin (Sn) - annealed	QUAD		S-PQFP-G128		3	1.2 mm		14 mm				e3	20	260	14 mm
KSZ8695X	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1								1.8 V		FLATPACK, FINE PITCH			.5 mm	70 Cel		0 Cel			QUAD		S-PQFP-G208			4.1 mm		28 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	28 mm
MCP2150-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS	TS 16949				3.3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel		-40 Cel		Matte Tin (Sn)	DUAL		R-PDSO-G18		2	2.64 mm		7.49 mm	Not Qualified			e3	40	260	17.87 mm
TM1062TX3DUA	Pulse Electronics	TELECOM CIRCUIT	MILITARY	GULL WING	28		RECTANGULAR	PLASTIC/EPOXY	YES	1								3.3 V		MICROELECTRONIC ASSEMBLY				125 Cel		-55 Cel			DUAL		R-PDMA-G28						Not Qualified				30	225
ZL30100QDG1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1								1.8 V		FLATPACK, THIN PROFILE, FINE PITCH	PQFP64,.40SQ,20		.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD		S-PQFP-G64		1	1.2 mm		10 mm				e3		260	10 mm
ZL30102QDG1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1								1.8 V		FLATPACK, THIN PROFILE, FINE PITCH	PQFP64,.40SQ,20		.5 mm	85 Cel		-40 Cel		MATTE TIN	QUAD		S-PQFP-G64			1.2 mm		10 mm				e3			10 mm
TRF8011PWP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS				350 mA	4.8 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel			DUAL		R-PDSO-G20			1.2 mm		4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	6.5 mm
TLC320AD535PM	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1								3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel		0 Cel			QUAD		S-PQFP-G64			1.6 mm		10 mm	Not Qualified						10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.