Maxim Integrated Other Function Telecom Interface ICs 494

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS2409P+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-C6	1	1.5 mm	3.81 mm	Not Qualified	e3	30	260	3.937 mm
DS2409P	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-C6	1	1.5 mm	3.76 mm	Not Qualified	e0			3.94 mm
MAX7044AKA-T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0257 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified	e0			2.9 mm
MAX7033EUI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified	e0			9.7 mm
MAX7060ATG+	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	24	VQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
DS2409P+T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-C6	1	1.5 mm	3.76 mm	Not Qualified	e3	30	260	3.94 mm
DS2409P/T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-C6	1	1.5 mm	3.76 mm	Not Qualified	e0			3.94 mm
MAX9152ESE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.07 mA	3.3 V	3.3	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			9.9 mm
MAX3658AETA-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1		.026 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
MAX3120EUA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX1472AKA-T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.0164 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.45 mm	1.625 mm	Not Qualified	e4		245	2.9 mm
MAX3120ESA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX9152EUE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.07 mA	3.3 V	3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX9152ESE-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified	e0			9.9 mm
MAX2510EEI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	25 mA	3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G28	1	1.75 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX7060ATG/V+	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
DS2174Q	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQCC-J44	3	4.57 mm	16.585 mm	Not Qualified	e0			16.585 mm
DS2174Q+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-J44	3	4.57 mm	16.585 mm	Not Qualified	e3		245	16.585 mm
PHY1097-03DS-BR	Maxim Integrated	TELECOM CIRCUIT																												NOT SPECIFIED	NOT SPECIFIED
PHY1070-01QH-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD		S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
MAX3774CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16		1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3968CEP	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.04 mA	3.3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	ATM/SONET/SDH ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G20	1	1.75 mm	3.9 mm	Not Qualified	e0			8.65 mm
MAX3269CUB-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.078 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0	20	240	3 mm
DS4000D0N/WBGA-W	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
DS21372T+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
DS4000A0N/WBGA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
DS21372TN	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
PHY1090-DS-BR	Maxim Integrated	TELECOM CIRCUIT																												NOT SPECIFIED	NOT SPECIFIED
MAX3964AETP	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.045 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N20	1	.8 mm	4 mm	Not Qualified	e0			4 mm
MAX3772CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3267C/D	Maxim Integrated	TELECOM CIRCUIT		NO LEAD	7	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP						TIN LEAD	UPPER		R-XUUC-N7	1			Not Qualified	e0
MAX3953UGK-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.45SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68		.9 mm	10 mm	Not Qualified	e0			10 mm
DS2172TN+T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3			7 mm
PHY1097-02DS-WR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	21	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP	DIE OR CHIP			95 Cel	-40 Cel		UPPER	2500 Mbps	R-XUUC-N21						NOT SPECIFIED	NOT SPECIFIED
PHY2078QS-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel		QUAD		S-XQCC-N32		.8 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
78P2241B-IGT	Maxim Integrated
MAX3670ETJ+T	Maxim Integrated		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES			72 mA		3.3/5	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32	1			Not Qualified	e3	30	260
DS2174QN/TR+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES			60 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-PQCC-J44				Not Qualified	e3
MAX3120CUA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
PHY1095-01DS+GR1	Maxim Integrated	TELECOM CIRCUIT																												NOT SPECIFIED	NOT SPECIFIED
MAX3770CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16		1.73 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.89 mm
MAX3765CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.09 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0	20	240	3 mm
MAX3265CUE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
78P7200-IH	Maxim Integrated
DS4000GW/WBGA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
DS4000CW/WBGA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
MAX3120EUA-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX3264CUE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.