Maxim Integrated Other Function Telecom Interface ICs 494

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3265EUE+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3751CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.078 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3775CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3657ETC	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.034 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC12,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N12	1	.8 mm	3 mm	Not Qualified	e0		245	3 mm
MAX3269CUB+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.078 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3265EUE-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3775CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
DS1360N	Maxim Integrated	TELECOM CIRCUIT		THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V		IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T20		4.572 mm	7.62 mm	Not Qualified	e0			26.16 mm
MAX3963C/D	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	7	DIE	SQUARE	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER	S-XUUC-N7	1			Not Qualified	e0
MAX3768CUB+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
PHY1097-03DS+GR1	Maxim Integrated	TELECOM CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
MAX3773CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3910U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	33	DIE	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		5 V		UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER	S-XUUC-N33	3			Not Qualified	e0
MAX3965CEP+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	1.73 mm	3.9 mm	Not Qualified	e3			8.65 mm
MAX3724E/D	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.041 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	UPPER	R-XUUC-N10				Not Qualified	e0
MAX3265CUE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
DS1852B-000/T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	100 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B25	3	1.5 mm	5 mm	Not Qualified	e0			5 mm
MAX3963CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.02 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3804ETE#G16	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		30	260	3 mm
MAX3267CSA+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e3	30	260	4.9 mm
DS2172TN+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX3971UGP-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-N20		1 mm	4 mm	Not Qualified	e0			4 mm
PHY1076-01QA-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel		QUAD	S-XQCC-N36		1 mm	6 mm					6 mm
MAX3266CSA-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
DS3104GN-W	Maxim Integrated		INDUSTRIAL	BALL	81	BGA	SQUARE	PLASTIC/EPOXY	YES			192 mA		1.8,3.3	GRID ARRAY	BGA81,9X9,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B81	3			Not Qualified		20	240
MAX3765CUB+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3971AUGP	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.085 mA	3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	4 mm	Not Qualified	e0			4 mm
MAX3532EAX-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		90 mA	5 V		SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G36	1	2.64 mm	7.495 mm	Not Qualified	e0			15.415 mm
MAX3271E/W	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	9	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.035 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	UPPER	R-XUUC-N9				Not Qualified	e0
DS31256B	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm	27 mm	Not Qualified	e0			27 mm
MAX3507EGI+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N28		1 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX3267CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.05 mA	3.3 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3775CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel		DUAL	R-PDSO-G16		1.65 mm	3.9 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4.89 mm
DS21372T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS2174QN/T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm	16.585 mm	Not Qualified	e0			16.585 mm
MAX3971AUTP+	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.085 mA	3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N20	1	.8 mm	4 mm	Not Qualified	e3	30	260	4 mm
78P2241B-IGT/F	Maxim Integrated
MAX3971U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N20				Not Qualified	e0
MAX66100K-000AA+	Maxim Integrated	TELECOM CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					SPECIAL SHAPE				50 Cel	-25 Cel		UNSPECIFIED	X-XXSS-X				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
MAX3265CUB+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3657E/D	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	-40 Cel	TIN LEAD	UPPER	R-XUUC-N11				Not Qualified	e0
DS2172TN/T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3983UGK-D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N68	1	.9 mm	10 mm	Not Qualified	e0			10 mm
MAX3268CUB+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
78P7200L-IH/F	Maxim Integrated
DS4000KI/WBGA-W	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
PHY1090-DS+GR1	Maxim Integrated	TELECOM CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
DS2291/87-22291-000	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1			5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	R-XSMA-N30				Not Qualified	e0

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.