Maxim Integrated Other Function Telecom Interface ICs 494

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3968C/D	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N20	1				Not Qualified	e0
MAX3804ETE#TG16	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N16	1	.8 mm		3 mm	Not Qualified				3 mm
DS31256	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	2.54 mm		27 mm	Not Qualified	e0			27 mm
MAX3657ETC+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N12	1	.8 mm		3 mm	Not Qualified	e3	30	260	3 mm
MAX3965C/D	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N20	1				Not Qualified	e0
DS2172TN	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm		7 mm	Not Qualified	e0			7 mm
PHY1075-01QS-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm		6 mm			30	260	6 mm
MAX3269CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.078 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified	e0	20	240	3 mm
MAX3755CCM	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.411 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G48	3	1.2 mm		7 mm	Not Qualified	e0			7 mm
DS2172T+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm		7 mm	Not Qualified	e3	30	260	7 mm
MAX3755CCM+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G48	1	1.2 mm		7 mm	Not Qualified	e3	30	255	7 mm
MAX3507EGI+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N28		1 mm		5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX3966C/D	Maxim Integrated	TELECOM CIRCUIT		NO LEAD	24	DIE	UNSPECIFIED	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP						TIN LEAD	UPPER	X-XUUC-N	1				Not Qualified	e0
DS2249PH	Maxim Integrated	TELECOM CIRCUIT		NO LEAD	30	SIMM	RECTANGULAR	UNSPECIFIED	NO	1			5 V		MICROELECTRONIC ASSEMBLY						TIN LEAD	SINGLE	R-XSMA-N30					Not Qualified	e0
MAX3755CCM-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G48	3	1.2 mm		7 mm	Not Qualified	e0			7 mm
78P2241B-IH/F	Maxim Integrated
MAX3953UGK-TD	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel		QUAD	S-XQCC-N68	1	.9 mm		10 mm	Not Qualified				10 mm
PHY1071-01QH-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm		6 mm			30	260	6 mm
MAX3269C/D	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N16	1				Not Qualified	e0
PHY2078QT-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm		5 mm		e3	30	260	5 mm
MAX3966CEG-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G24	1	1.73 mm		3.9 mm	Not Qualified	e0			8.65 mm
MAX3964AC/D	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				85 Cel	-40 Cel	TIN LEAD	UPPER	R-XUUC-N20	3				Not Qualified	e0
DS2172	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm		7 mm	Not Qualified	e0			7 mm
DS2181Q	Maxim Integrated		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-J44			CEPT PCM-30/E-1		Not Qualified	e0
MAX3971AUTP+T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.085 mA	3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N20	1	.8 mm		4 mm	Not Qualified	e3	30	255	4 mm
MAX3773CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm		3.9 mm	Not Qualified	e3	30	260	4.89 mm
MAX3262CAG	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	60 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G24	1	1.99 mm		5.29 mm	Not Qualified	e0			8.2 mm
MAX3966CEG	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G24	1	1.73 mm		3.9 mm	Not Qualified	e0			8.65 mm
MAX3725E/D	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.041 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	UPPER	R-XUUC-N10					Not Qualified	e0
DS8102+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3964ETP-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.04 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm		4 mm	Not Qualified	e0			4 mm
MAX3265CUB-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified	e0	20	240	3 mm
DS4000KIN/WBGA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm		9 mm	Not Qualified	e0			11 mm
DS4000KI/WBGA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm		9 mm	Not Qualified	e0			11 mm
MAX3775CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm		3.9 mm	Not Qualified	e0			4.89 mm
PHY1075-01QH-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm		6 mm			30	260	6 mm
DS4000GF/WBGA-W	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm		9 mm	Not Qualified	e0			11 mm
MAX3262CAG-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	60 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G24	1	1.99 mm		5.29 mm	Not Qualified	e0			8.2 mm
PHY1075-01QH-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm		6 mm			30	260	6 mm
MAX3963CSA-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified	e0			4.9 mm
PHY1095-01DS-BR	Maxim Integrated	TELECOM CIRCUIT																												NOT SPECIFIED	NOT SPECIFIED
78P7200L-IGT/F	Maxim Integrated
MAX3268CUB+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm		3 mm	Not Qualified	e3	30	260	3 mm
MAX3265EUE	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified	e0	20	240	5 mm
MAX3770CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.112 mA	3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.73 mm		3.9 mm	Not Qualified	e0			4.89 mm
DS6112	Maxim Integrated			THROUGH-HOLE	16	DIP	RECTANGULAR		NO						IN-LINE	DIP16/20(UNSPEC)	Other Telecom ICs				Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T16					Not Qualified	e0
MAX3752CCM+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN	QUAD	S-PQFP-G48	3	1.2 mm		7 mm	Not Qualified	e3			7 mm
PHY1078-01QS-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel		QUAD	S-XQCC-N32		.8 mm		5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.