Maxim Integrated Other Function Telecom Interface ICs 494

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS4000G0/WBGA-W	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
PHY1075-01QD-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD		S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
DS4000GFN/WBGA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
DS2174QN+T&R	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-J44	3	4.57 mm	16.585 mm	Not Qualified	e3			16.585 mm
MAX3120CUA-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
MAX3968CEP-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.04 mA	3.3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	ATM/SONET/SDH ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G20	1	1.75 mm	3.9 mm	Not Qualified	e0			8.65 mm
MAX3953UGK-D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68	3	.9 mm	10 mm	Not Qualified	e0			10 mm
DS1360S	Maxim Integrated	TELECOM CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL		R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e0			12.8 mm
MAX3964C/DW	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N20				Not Qualified	e0
DS2174QN	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J44	3	4.57 mm	16.585 mm	Not Qualified	e0			16.585 mm
DS4000GFN/WBGA-W	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
PHY1071-01QS-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD		S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
MAX3971AU/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N20				Not Qualified	e0
75T204-IP	Maxim Integrated
DS2291	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	SIMM	RECTANGULAR	UNSPECIFIED	NO	1	HYBRID	.05 mA	5 V	5	MICROELECTRONIC ASSEMBLY	SIM30,.2	ATM/SONET/SDH ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	SINGLE		R-XSMA-N30				Not Qualified	e0
MAX3265CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0	20	240	3 mm
MAX3968CEP+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN	DUAL		R-PDSO-G20	1	1.73 mm	3.9 mm	Not Qualified	e3			8.65 mm
DS4000	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
MAX3750CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
PHY1097-02DS-QR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			UNSPECIFIED	UNSPECIFIED		1			3.3 V			WAFER			95 Cel	-40 Cel		UPPER	2500 Mbps	X-XUUC-N						NOT SPECIFIED	NOT SPECIFIED
MAX3965C/DW	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N20				Not Qualified	e0
MAX3262C/D	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	24	DIE	RECTANGULAR	UNSPECIFIED	YES	1		60 mA	5 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N24	1			Not Qualified	e0
DS2174Q+T&R	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-J44	3	4.57 mm	16.585 mm	Not Qualified	e3			16.585 mm
DS2174Q/T&R+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1		.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-J44	3	4.57 mm	16.5862 mm	Not Qualified	e3			16.5862 mm
MAX3964CEP	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.04 mA	3.3 V	3.3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.25	ATM/SONET/SDH ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G20	1	1.73 mm	3.9 mm	Not Qualified	e0			8.65 mm
MAX3768CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0	20	240	3 mm
DS31256+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM		S-PBGA-B256	3	2.54 mm	27 mm	Not Qualified	e3			27 mm
DS21372TN+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
78P7200L-IH	Maxim Integrated
DS4000G0/WBGA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
MAX3774CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.164 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
DS4000D0/WBGA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
MAX3268C/D	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N16	1			Not Qualified	e0
MAX3120CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
DS2172T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD		S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
PHY1071-01QS-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD		S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
DS1852B-000	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	100 Cel	-40 Cel	TIN LEAD	BOTTOM		S-PBGA-B25	3	1.5 mm	5 mm	Not Qualified	e0			5 mm
MAX66100E-000AA+	Maxim Integrated	TELECOM CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					SPECIAL SHAPE				50 Cel	-25 Cel		UNSPECIFIED		X-XXSS-X				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
MAX3964C/D	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N20				Not Qualified	e0
MAX3658AETA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1		.026 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-XDSO-N8	1	.8 mm	3 mm	Not Qualified	e0			3 mm
MAX3793E/D	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.046 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel	TIN LEAD	UPPER		R-XUUC-N11				Not Qualified	e0
MAX3267CSA-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
MAX3264CUE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
MAX3657BE/D	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	-40 Cel	TIN LEAD	UPPER		R-XUUC-N11				Not Qualified	e0
DS4000ECN/WBGA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
DS4000EC/WBGA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
MAX3773CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
PHY1070-01QS-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD		S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.