Maxim Integrated Other Function Telecom Interface ICs 494

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3971AUTP	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	.8 mm	4 mm	Not Qualified	e0		245	4 mm
MAX3772CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.195 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
MAX3765CUB+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.09 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3657ETC+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N12	1	.8 mm	3 mm	Not Qualified	e3	30	260	3 mm
MAX3751CEE+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN	DUAL	R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified	e3			4.89 mm
MAX3657ETC-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.034 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC12,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N12	1	.8 mm	3 mm	Not Qualified	e0		245	3 mm
DS2172T+T&R	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e3	30	260	7 mm
78P7200L-IGT	Maxim Integrated
MAX3797E/D+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.045 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		100 Cel	-40 Cel		UPPER	R-XUUC-N				Not Qualified
MAX3953UGK	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.45SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N68	3	.9 mm	10 mm	Not Qualified	e0			10 mm
DS4000D0N/WBGA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
MAX3752CCM	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G48	3	1.2 mm	7 mm	Not Qualified	e0			7 mm
MAX3507EGI	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N28	1	1 mm	5 mm	Not Qualified	e0			5 mm
DS1360SN	Maxim Integrated	TELECOM CIRCUIT		GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm			TIN LEAD	DUAL	R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e0			12.8 mm
MAX3970U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR	.062 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N18				Not Qualified	e0
MAX3971AU/D-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		3.3 V		UNCASED CHIP				85 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N20				Not Qualified	e0
MAX3265CUE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0			5 mm
MAX3772CEE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e3	30	260	4.89 mm
PHY1071-01QH-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
MAX3264CUE+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e3	30	260	5 mm
78P2241B-IH	Maxim Integrated
PHY1090DS-FR	Maxim Integrated	TELECOM CIRCUIT
PHY1075-01QS-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
MAX3773CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HLSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH			.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.65 mm	3.9 mm	Not Qualified	e0			4.89 mm
DS21372	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS2281-075	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	68	SIMM	RECTANGULAR	UNSPECIFIED	NO	1			5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	R-XSMA-N68				Not Qualified	e0
DS4000KIN/WBGA-W	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
DS4000N	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
DS1852B-000+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	100 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B25	3	1.5 mm	5 mm	Not Qualified	e3			5 mm
DS33M33N+W	Maxim Integrated
DS33M31N+	Maxim Integrated
MAX3971AUGP-T	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.085 mA	3.3 V	3.3	CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N20	1	1 mm	4 mm	Not Qualified	e0			4 mm
MAX3274UGE	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR	.099 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	ATM/SONET/SDH ICs	.65 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	1 mm	4 mm	Not Qualified	e0			4 mm
MAX3120CSA+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e3			4.9 mm
DS2172T/T&R	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			5 V	5	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS4000CWN/WBGA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
PHY1076-01QH-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	1 mm	6 mm			30	260	6 mm
MAX3804ETE-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		3.3 V	1.8/3.3,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified	e0		245	3 mm
MAX3964ETP	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.045 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N20		.8 mm	4 mm	Not Qualified	e0			4 mm
PHY1070-01QH-RR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm	6 mm			30	260	6 mm
MAX3264C/D	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	17	DIE	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N17	1			Not Qualified	e0
DS21372N	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, THIN PROFILE			.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	7 mm	Not Qualified	e0			7 mm
DS2249	Maxim Integrated	TELECOM CIRCUIT		NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1			5 V		MICROELECTRONIC ASSEMBLY						TIN LEAD	SINGLE	R-XSMA-N30				Not Qualified	e0
MAX3267ESA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e0			4.9 mm
DS4000EC/WBGA-W	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm
MAX3532EAX	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		90 mA	5 V		SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G36	1	2.64 mm	7.495 mm	Not Qualified	e0			15.415 mm
PHY1078-01QS-BR	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel		QUAD	S-XQCC-N32		.8 mm	5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
DS4000G0N/WBGA	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	24	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	R-PBGA-B24		3.31 mm	9 mm	Not Qualified	e0			11 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.