Maxim Integrated Other Function Telecom Interface ICs 494

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX7031MATJ50+T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.0204 mA	2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		QUAD	S-XQCC-N32		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX2664EWS+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B4	1	.69 mm	.84 mm		e2	30	260	.84 mm
MAX19713C/D+GG3	Maxim Integrated	TELECOM CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
MAX19705ETM-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.0125 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0			7 mm
MAX1471ATJ-T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.0086 mA	3 V	2.4/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e0		245	5 mm
MAX19708ETM-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.016 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48		.8 mm	7 mm	Not Qualified	e0			7 mm
MAX2839ASEWO+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	73	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	.2 mA	2.8 V	3/3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA73(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel		BOTTOM	R-PBGA-B73	1	.7 mm	3.61 mm	Not Qualified		30	260	5.11 mm
MAX2370ETM+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	.087 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX769EEI-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.73 mm	3.9 mm	Not Qualified	e0			9.89 mm
MAX2552ETN+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	1	.8 mm	7 mm		e3	30	260	7 mm
MAX14627ETA+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	2 mm		e3	30	260	2 mm
MAX19713ETN-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.0306 mA	3 V	1.8/3.3,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Modems	.4 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N56		.8 mm	7 mm	Not Qualified	e0			7 mm
MAX24188ETK+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N68	3	.8 mm	8 mm		e3	30	260	8 mm
MAX2980CCB+T	Maxim Integrated	TELECOM CIRCUIT																			MATTE TIN			3				e3	30	260
MAX2822ETM	Maxim Integrated		INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES			185 mA		2.7/3	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQCC-N48				Not Qualified	e0
MAX7049ATI+T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.8 mm	5 mm		e3	30	260	5 mm
MAX2822ETM+T	Maxim Integrated		INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES			185 mA		2.7/3	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	S-PQCC-N48				Not Qualified	e3
MAX2240EBL	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	S-PBGA-B9		.65 mm			e0
MAX5935EAX	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G36		2.65 mm	7.5 mm			NOT SPECIFIED	NOT SPECIFIED	15.375 mm
MAX1470EUI-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	1.1 mm	4.4 mm	Not Qualified	e0		245	9.7 mm
MAX2822ETM+	Maxim Integrated		INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES			185 mA		2.7/3	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N48	1			Not Qualified	e3	30	260
MAX19712ETN+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.019 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Modems	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	1	.8 mm	7 mm	Not Qualified	e3			7 mm
MAX2117CTI+T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N28	1	.8 mm	5 mm		e3	30	260	5 mm
MAX19708ETM+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.016 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX19705ETM+TGH7	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N48	1	.8 mm	7 mm		e3	30	260	7 mm
MAX7060ATG/V+T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm		e3	30	260	4 mm
MAX2181ETE+T	Maxim Integrated	TELECOM CIRCUIT
MAX7033ETJ+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	VQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.00688 mA	3.3 V	3.3/5	CHIP CARRIER, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N32		.8 mm	5 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
MAX19710ETN+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.012 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Modems	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX7031HATJ17+T	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3			5 mm
MAX5935CAX+	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G36	1	2.65 mm	7.5 mm		e3	30	260	15.375 mm
MAX14627ETA+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	2 mm		e3	30	260	2 mm
MAX24011E/D+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BICMOS		3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		95 Cel	-40 Cel		UPPER	R-XUUC-N20				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
MAX14579AEETA+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	2 mm		e3	30	260	2 mm
MAX2240EBL+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.2 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B9	1	.67 mm			e1	30	260
MAX2402EAP-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	1	1.99 mm	5.29 mm	Not Qualified	e0			7.2 mm
MAX19996AETP+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N20	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX2105CWI	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0		245	17.9 mm
MAX19710ETN-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.012 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Modems	.4 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N56	1	.8 mm	7 mm	Not Qualified				7 mm
MAX7031MATJ50+	Maxim Integrated	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.0204 mA	2.7 V	2.5/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	1	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
MAX1385BUTM+T	Maxim Integrated	TELECOM CIRCUIT																						1
MAX5935EAX-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.8 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G36		2.65 mm	7.5 mm			20	240	15.375 mm
MAX19711ETN+	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.017 mA	3 V	1.8,3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Modems	.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	1	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
MAX19712ETN	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	.019 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	Modems	.4 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N56	1	.8 mm	7 mm	Not Qualified	e0		245	7 mm
MAX2669EWT+T10	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B6		.69 mm	.865 mm			30	260	1.27 mm
MAX19700ETM-T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.016 mA	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Modems	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-XQCC-N48	1	.8 mm	7 mm	Not Qualified	e0		245	7 mm
MAX2822EGM	Maxim Integrated		INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES			185 mA		2.7/3	CHIP CARRIER	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	QUAD	S-PQCC-N48	1			Not Qualified	e0
MAX2665EWS+T	Maxim Integrated	TELECOM CIRCUIT	INDUSTRIAL	BALL	4	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		2.7 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	S-PBGA-B4	1	.69 mm	.84 mm		e2	30	260	.84 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.