Microchip Technology Other Function Telecom Interface ICs 212

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
RN41N-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35		RECTANGULAR	UNSPECIFIED	YES	1		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQMA-N35		2.2 mm	13.2 mm			e3			20.1 mm
BM20SPKS1NBC-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,40LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N40		2.5 mm	15 mm						29 mm
RN42N-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,35LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		QUAD	3 Mbps	R-XQMA-N35		2.4 mm	13.4 mm				NOT SPECIFIED	NOT SPECIFIED	20 mm
RN42-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,35LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	3 Mbps	R-XXMA-N35		2.4 mm	13.4 mm				NOT SPECIFIED	NOT SPECIFIED	25.6 mm
RN42HID-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)		1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
RN42XVP-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,20LEAD(UNSPEC)		2 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL	.3 Mbps	R-XDMA-T20			24.4 mm			e4			29.9 mm
MRF24WG0MB-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,36LEAD,.8	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDMA-N36		2.7 mm	21 mm	Not Qualified		e3			31 mm
RN52-I/RM	Microchip Technology	TELECOM CIRCUIT		NO LEAD	40	XMA	RECTANGULAR	UNSPECIFIED	YES	1				MICROELECTRONIC ASSEMBLY	MODULE,40LEAD(UNSPEC)						UNSPECIFIED	3 Mbps	R-XXMA-N40		2.7 mm	13.5 mm				NOT SPECIFIED	NOT SPECIFIED	26 mm
BM71BLES1FC2-0B02AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm				30	260	11.5 mm
EQCO30T5.2	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	1	.95 mm	4 mm			e4	30	260	4 mm
RN4871-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	NO	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
RN41XVC-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-T20	1	2 mm	24.4 mm						29.9 mm
RN4871-I/RM130	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
RN42-I/RM630	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)		1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
BM71BLES1FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
EQCO30R5.D	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	1	1 mm	4 mm			e4	30	260	4 mm
RN4871-I/RM140	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
RN4871-V/RM118	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
RN42XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm	24.4 mm			e4			29.9 mm
RN42-I/RM615	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
RN42-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)		1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
EQCO62R20.3	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD		S-PQCC-N16	1	1 mm	4 mm			e4	30	260	4 mm
RN4678-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V		MICROELECTRONIC ASSEMBLY			1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm						22 mm
BM77SPPS3MC2-0007AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED	.1125 Mbps	R-XXMA-N30		1.86 mm	12 mm				NOT SPECIFIED	NOT SPECIFIED	15 mm
RN41XVU-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20		RECTANGULAR	UNSPECIFIED	NO	1		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	DUAL		R-XDMA-T20		2 mm	24.4 mm			e4			29.9 mm
RN41SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm	13.2 mm			e4			25.8 mm
RN4677-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
BM70BLES1FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm						22 mm
BM78SPPS5MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm			e4	40	255	22 mm
RN4871U-V/RM118	Microchip Technology	TELECOM CIRCUIT		NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.1 mm	9 mm						11.5 mm
RN4871-V/RM140	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
RN4020-V/RM123	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel		UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		Bluetooth Module		NOT SPECIFIED	NOT SPECIFIED	19.5 mm
BM70BLES1FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
RN4020-V/RMBEC133	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		Bluetooth Module	e4			19.5 mm
BM70BLES1FC2-0B03AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
RN4871-V/RM130	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
RN4020-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm			e4			19.5 mm
EQCO62R20.3-TRAY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16		1 mm	4 mm			e4			4 mm
EQCO62T20.3	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	1	1 mm	4 mm			e4	30	260	4 mm
MRF24J40MA-I/RM	Microchip Technology		INDUSTRIAL		12			PLASTIC/EPOXY				3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,12LEAD,.7	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
MRF24WB0MA/RM	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	DIE	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	3.3	UNCASED CHIP	MODULE,36LEAD,.8	Other Telecom ICs		70 Cel	0 Cel	MATTE TIN	UPPER		R-XUUC-N36				Not Qualified		e3
BM70BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
RN4678-V/RM113	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm			e4			22 mm
RN4870-V/RM118	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm						22 mm
BM78SPPS5NC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm			e4	40	255	22 mm
ATWILC3000-MR110CA	Microchip Technology	TELECOM CIRCUIT		NO LEAD	36	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V		MICROELECTRONIC ASSEMBLY			1.204 mm	85 Cel	-40 Cel		UNSPECIFIED	65 Mbps	R-XXMA-X36	3	2.09 mm	22.428 mm					250	14.732 mm
RN4020-V/RM	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel		UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		Bluetooth Module		NOT SPECIFIED	NOT SPECIFIED	19.5 mm
RN4678APL-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm						22 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.