Microchip Technology Other Function Telecom Interface ICs 212

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SY88403BLEY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G10		1.1 mm	3 mm	Not Qualified		e3			3 mm
SY88403BLMG-TR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	4250 Mbps	S-XQCC-N16	2	1 mm	3 mm	Not Qualified		e4	40	260	3 mm
MICRF009YM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE	SOP16,.25		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	.002 Mbps	R-PDSO-G16	1	1.895 mm	3.9 mm		Operates from 4.75V to 5.5V	e3	30	260	9.9 mm
MRF24J40MET-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1	TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N12		3.48 mm	22.86 mm						33.02 mm
WP3161D4NFEI-400B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B672
ATA8710-GHQW	Microchip Technology	TELECOM CIRCUIT		NO LEAD	32		SQUARE	UNSPECIFIED	YES	1			5 V			LCC32(UNSPEC)			85 Cel	-40 Cel		QUAD	.08 Mbps	S-XQCC-N32
ATSAMW25H18-MR210PB1954	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
BM23SPKA1NB9-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm						29 mm
MD0100DK6-G	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	TS 16949				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.16SQ,40		1 mm	125 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8		1 mm	4 mm			e3			4 mm
MICRF230YQS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH	SSOP16,.25		.635 mm	105 Cel	-40 Cel	MATTE TIN	DUAL	.02 Mbps	R-PDSO-G16		1.75 mm	3.91 mm			e3			4.9 mm
MRF24WG0MBT-I/RM	Microchip Technology		INDUSTRIAL		36			PLASTIC/EPOXY					3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,36LEAD,.8	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
VSC8491YJU-13	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, LOW PROFILE			1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm						15 mm
WP3160W6NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B672
WP3161W6NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B672
090-02789-001	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	65 Cel	-10 Cel		DUAL		R-XDMA-P9		11.68 mm	35.3 mm						40.64 mm
090-02789-002	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	80 Cel	-40 Cel		DUAL		R-XDMA-P9		11.68 mm	35.3 mm						40.64 mm
090-02789-011	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1			3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	65 Cel	-10 Cel		DUAL		R-XDMA-P9		11.68 mm	35.3 mm						40.64 mm
AT88RF1354-ZU	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1		.25 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.106 Mbps	S-XQCC-N36		.9 mm	6 mm	Not Qualified		e3			6 mm
ATA8202C-PXQW-1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.20SQ,25		.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.02 Mbps	S-XQCC-N24		.9 mm	5 mm			e3			5 mm
ATA8520E-GHPW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	.0006 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
ATSAMW25H18-MR210PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
ATSAMW25H18-MR210PB1944	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
ATSAMW25H18-MR210PB1961	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
ATZB-S1-256-3-0-CR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	42		RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N42		3.2 mm	20 mm						30 mm
BM23SPKA1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm						29 mm
IS1678SM-151-TRAY	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	70 Cel	-20 Cel		QUAD		S-XQCC-N40		.9 mm	6 mm						6 mm
MICRF008YM	Microchip Technology	TELECOM CIRCUIT
MRF24WG0MAT-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL		36		RECTANGULAR	UNSPECIFIED		1	TS 16949		3.3 V						85 Cel	-40 Cel						2.7 mm	21 mm						31 mm
MRF24WG0MBR-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1	TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
MRF24WG0MBRT-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1	TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
MRF24WG0MBRT-I/RM110	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1	TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
MRF24WN0MA-I/RM100	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1	TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N37		2.286 mm	17.78 mm						26.67 mm
MRF24XA-I/MQ	Microchip Technology		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES					1.2,3.3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32				Not Qualified		e3
RN42APL-I/RM550	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1	TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)		1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
WFI32E01PC-I	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	QMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,54LEAD,.7		1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N54		2.6 mm	20.5 mm						24.5 mm
WP3161F5NFEI-320B1	Microchip Technology	TELECOM CIRCUIT		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B672
ATA5291-GJQW	Microchip Technology	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm				QUAD	2 Mbps	S-XQCC-N48		.95 mm	7 mm						7 mm
ATBTLC1000-MR110CA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.6 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		.9 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N24		2.165 mm	12.7 mm						20.157 mm
BM71BLE01FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm			e4			8 mm
BM71BLE01FC2-0B02AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm				30	260	8 mm
EQCO31R20.3	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	1	.9 mm	4 mm			e4	30	260	4 mm
MRF24J40-I/MLVAO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1	AEC-Q100		3.3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N40		1 mm	6 mm						6 mm
MRF24WG0MART-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1	TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
MRF24WG0MAT-I/RM	Microchip Technology		INDUSTRIAL		36			PLASTIC/EPOXY					3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,36LEAD,.8	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
RN42HCI-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,35LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	3 Mbps	R-XXMA-N35		2.4 mm	13.4 mm				NOT SPECIFIED	NOT SPECIFIED	25.6 mm
VSC8490YJU-17	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel		BOTTOM	10000 Mbps	S-PBGA-B196		1.4 mm	15 mm						15 mm
ATA5577M3330C-DDB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	2	DIE	RECTANGULAR	UNSPECIFIED		1					UNCASED CHIP	DIE OR CHIP		.524 mm	85 Cel	-40 Cel		UPPER		R-XUUC-N2		.162 mm	1 mm						1.35 mm
PM5991B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B1932

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.