Microchip Technology Other Function Telecom Interface ICs 212

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Applications	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MRF24J40MD-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED		NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDMA-N12		3.3528 mm	22.86 mm			e3			33.02 mm
ATECC508A-SSHDA-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	TS 16949		3.6 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm			e4		260	4.9 mm
MRF24J40MAT-I/RM	Microchip Technology		INDUSTRIAL		12			PLASTIC/EPOXY							3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,12LEAD,.7	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
MCP2120-I/SL	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	TS 16949	.016 mA	5 V	3/5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified		e3	40	260	8.65 mm
EQCO62T20.3-TRAY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1				1.2 V		CHIP CARRIER, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	1	1 mm	4 mm			e4	30	260	4 mm
RN4678APL-V/RM122	Microchip Technology	TELECOM CIRCUIT		NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED		YES	1				1.9 V		MICROELECTRONIC ASSEMBLY			1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm						22 mm
AT86RF215-ZUR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY		YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
BM71BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED		YES	1				3 V		MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm			e4			11.5 mm
MAX24287ETK+	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED		YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-XQCC-N68		.8 mm	8 mm						8 mm
RN4678-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED		YES	1		TS 16949		1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm						22 mm
RN41-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED		YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	UNSPECIFIED		R-XXMA-N32		2.2 mm	13.2 mm			e3			25.8 mm
RN4678-V/RM122	Microchip Technology	TELECOM CIRCUIT		NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED		YES	1				1.9 V		MICROELECTRONIC ASSEMBLY			1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm						22 mm
RN4678APL-V/RM120	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED		YES	1				1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm						22 mm
MGC3130-I/MQ	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N28		1 mm	5 mm			e3			5 mm
RN4678APL-V/RM113	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED		YES	1				1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm						22 mm
MCP2120T-I/SL	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	TS 16949	.016 mA	5 V	3/5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified		e3	40	260	8.65 mm
MRF24J40ME-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED		NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N12		3.48 mm	22.86 mm						33.02 mm
MRF39RAT-I/LY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	5 mm						5 mm
ATECC508A-SSHDA-B	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	TS 16949		3.6 V		SMALL OUTLINE	SOP8,.25		1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm			e4		260	4.9 mm
BM23SPKS1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED		YES	1				3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm						29 mm
BM71BLE01FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED		YES	1		TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	85 Cel	-40 Cel		QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm						8 mm
RN4870U-V/RM118	Microchip Technology	TELECOM CIRCUIT		NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED		YES	1		TS 16949		3 V		MICROELECTRONIC ASSEMBLY				70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N30		1.6 mm	12 mm						15 mm
USB3740B-AI9-TR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	VQCCN	RECTANGULAR	PLASTIC/EPOXY		YES	1		TS 16949		5 V		CHIP CARRIER, VERY THIN PROFILE	LCC10,.06X.08,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-PQCC-N10		.6 mm	1.6 mm			e4			2.1 mm
RN4870-I/RM140	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED		YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm						22 mm
MD0101K6-G	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	18	HVSON	SQUARE	PLASTIC/EPOXY		YES	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC18,.20SQ,20		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N18		1 mm	5 mm	Not Qualified		e4			5 mm
ATWILC1000-MR110UB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED		YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28	3	2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps				21.72 mm
RN41-I/RM630	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED		YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm	13.2 mm			e4			25.8 mm
RN4870-I/RM130	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED		YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm						22 mm
MAX24287ETK+T	Microchip Technology	SUPPORT CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	SONET	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-XQCC-N68		.8 mm	8 mm				NOT SPECIFIED	NOT SPECIFIED	8 mm
AT86RF215M-ZUR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY		YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
ATA5551M-PPMY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		NO	1						SPECIAL SHAPE	MODULE(UNSPEC)			85 Cel	-40 Cel		UNSPECIFIED		X-XXSS-X							NOT SPECIFIED	NOT SPECIFIED
MD0100N8-G	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	FLAT	3	LSOF	RECTANGULAR	PLASTIC/EPOXY		YES	1		TS 16949				SMALL OUTLINE, LOW PROFILE	TO-243		1.5 mm	125 Cel	-40 Cel	MATTE TIN	SINGLE		R-PSSO-F3	1	1.6 mm	2.445 mm			e3	40	260	4.5 mm
AT86RF215-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY		YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
AT86RF215M-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY		YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
ATA8405C-6DQY-66	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	50 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-G10	2	1.1 mm	3 mm			e3	40	260	3 mm
ATPL250A-AKU-R	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G80		1.6 mm	12 mm			e3			12 mm
WLR089U0-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	QMA	RECTANGULAR	UNSPECIFIED		YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD	12 Mbps	R-XQMA-N40		2.8 mm	13.5 mm		HEAT SINK IS PRESENT				17 mm
RN41-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED		YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	UNSPECIFIED		R-XXMA-N32		2.2 mm	13.2 mm			e3			25.8 mm
MRF24WG0MA-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED		NO	1				3.3 V	3.3	MICROELECTRONIC ASSEMBLY	MODULE,36LEAD,.8	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDMA-N36		2.7 mm	21 mm	Not Qualified		e3			31 mm
PD69208MILQ-TR	Microchip Technology	TELECOM CIRCUIT
RN41-I/RM615	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED		YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	UNSPECIFIED		R-XXMA-N32		2.2 mm	13.2 mm			e3			25.8 mm
RN4870-V/RM140	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED		YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm						22 mm
WFI32E01PE-I	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	54	QMA	RECTANGULAR	UNSPECIFIED		YES	1				3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,54LEAD,.7		1.27 mm	85 Cel	-40 Cel		QUAD		R-XQMA-N54		2.6 mm	20.5 mm						24.5 mm
ATWILC3000-MR110UA	Microchip Technology	TELECOM CIRCUIT		NO LEAD	36	XMA	RECTANGULAR	UNSPECIFIED		YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.204 mm	85 Cel	-40 Cel		UNSPECIFIED	65 Mbps	R-XXMA-X36		2.09 mm	22.428 mm						14.732 mm
PD69208T4ILQ-TR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1				55 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N56	3	1 mm	8 mm				40	260	8 mm
ATA8515-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED		YES	1			.046 mA	3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm	Not Qualified		e3			5 mm
MRF24J40MDT-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED		NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-XDMA-N12		3.3528 mm	22.86 mm			e3			33.02 mm
MCP2120-I/P	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	1	CMOS	TS 16949	.016 mA	5 V	3/5	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T14		5.334 mm	7.62 mm	Not Qualified		e3			19.05 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.