Microchip Technology Other Function Telecom Interface ICs 212

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
RN4678APL-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm						22 mm
MCP2140-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G18	2	2.64 mm	7.49 mm	Not Qualified		e3			11.53 mm
AT86RF215IQ-ZU	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
ATWILC1000-MR110UB-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28	3	2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps				21.72 mm
MRF24WG0MA-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
RN41N-I/RM615	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQMA-N35		2.2 mm	13.2 mm			e3			20.1 mm
RN4870-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm						22 mm
ATA8510-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.046 mA	3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm	Not Qualified		e3			5 mm
ATA8210-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
ATA8215-GHQW	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	.08 Mbps	S-XQCC-N32		.9 mm	5 mm			e3			5 mm
MGC3030-I/SS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G28	2	2 mm	5.3 mm			e3	40	260	10.2 mm
ATA8404C-6DQY-66	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	50 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-G10	2	1.1 mm	3 mm			e3	40	260	3 mm
MCP2140A-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G18	2	2.65 mm	7.5 mm	Not Qualified		e3	40	260	11.55 mm
BM71BLES1FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT		NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-X16		2.1 mm	9 mm						11.5 mm
MCP2140A-I/P	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	TS 16949		3 V		IN-LINE	DIP18,.3		2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T18		5.334 mm	7.62 mm	Not Qualified		e3			22.86 mm
SST12LF02-QXCE	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel	MATTE TIN	QUAD		S-XQCC-N16		.5 mm	3 mm			e3			3 mm
ATA8403C-6AQY66	Microchip Technology	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES				11 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.635 mm	85 Cel	-55 Cel	MATTE TIN	DUAL		R-PDSO-G8				Not Qualified		e3
ATA8403C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		.65 mm	85 Cel	-55 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8		1.05 mm	3 mm			e3	NOT SPECIFIED	NOT SPECIFIED	3 mm
AT86RF215IQ-ZUR	Microchip Technology	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC48,.28SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N48		.9 mm	7 mm			e3			7 mm
ATA8402C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.0116 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-G8		1.05 mm	3 mm	Not Qualified		e3			3 mm
ATWILC1000-MR110PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28		2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps		NOT SPECIFIED	NOT SPECIFIED	21.72 mm
AT86RF231-ZUR	Microchip Technology		INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES		CMOS				1.8,3	CHIP CARRIER	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N32				Not Qualified		e3
ATWILC1000-MR110PB-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.016 mm	85 Cel	-40 Cel		UNSPECIFIED	72.2 Mbps	R-XXMA-N28		2.113 mm	14.73 mm		Data rate max for 802.11b is 11Mbps and for 802.11g is 54Mbps		NOT SPECIFIED	NOT SPECIFIED	21.72 mm
ATSAMW25H18-MR510PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
MRF24WB0MB/RM	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	DIE	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				70 Cel	0 Cel	MATTE TIN	UPPER		R-XUUC-N36				Not Qualified		e3
ATA8352-7MQW	Microchip Technology	TELECOM CIRCUIT		BALL	33	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA33,6X6,25		.65 mm	105 Cel	-40 Cel		BOTTOM	1 Mbps	S-PBGA-B33		1.1 mm	4.5 mm						4.5 mm
SST12LP17E-QU8E	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		S-PDSO-N8	3	.6 mm	2 mm			e3			2 mm
MRF24WG0MB-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
ATA8401C-6AQY-66	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.0116 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-55 Cel	MATTE TIN	DUAL		S-PDSO-G8		1.05 mm	3 mm	Not Qualified		e3			3 mm
BM78SPPS5MC2-0004AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1				1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm			e4	40	255	22 mm
RN41N-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	QUAD		R-XQMA-N35		2.2 mm	13.2 mm			e3			20.1 mm
RN42N-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm			e4			20.5 mm
VSC8491YJU-17	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel		BOTTOM	10000 Mbps	S-PBGA-B196		1.4 mm	15 mm						15 mm
090-02789-012	Microchip Technology	TELECOM CIRCUIT		PIN/PEG	9	DMA	RECTANGULAR	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			5.1 mm	80 Cel	-40 Cel		DUAL		R-XDMA-P9		11.68 mm	35.3 mm						40.64 mm
ATSAMW25H18-MR210PB1952	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY			1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
RN42U-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm				NOT SPECIFIED	NOT SPECIFIED	25.8 mm
ATA5743P3-TKQY	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.0091 mA	5 V	5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	1	1.35 mm	4.4 mm	Not Qualified		e3			6.75 mm
BM78SPP05MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1				1.9 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N30		1.86 mm	12 mm			e4	40	255	15 mm
KSZ8695PI	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	BGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY	BGA289,17X17,40		1 mm	85 Cel	-40 Cel		BOTTOM	100 Mbps	S-PBGA-B289		2.36 mm	19 mm						19 mm
MRF24J40-I/ML	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	1 mm	6 mm	Not Qualified		e3		260	6 mm
MRF24J40MB-I/RM	Microchip Technology		INDUSTRIAL		12			PLASTIC/EPOXY							2.5/3.3		MODULE,12LEAD,.9	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
MRF24WG0MA-I/RM110	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
RN42SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
RN4678U-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL EXTENDED	NO LEAD	30		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949				MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)			70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N30		1.8 mm	12 mm						15 mm
BM70BLE01FC2-0B05BA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N30		1.66 mm	12 mm			e4			15 mm
MICRF005BM	Microchip Technology	TELECOM CIRCUIT
BM23SPKS1NB9-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1				3.7 V		MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel	-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm						29 mm
PM5980B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1						GRID ARRAY							BOTTOM		S-PBGA-B1932

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.