Microchip Technology Other Function Telecom Interface ICs 212

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
RN4020BCN-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		e4			19.5 mm
RN4677-V/RM112	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel	-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm		e4			22 mm
ATA5749C-6DQY-64	Microchip Technology	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	125 Cel	-40 Cel	MATTE TIN	DUAL	.04 Mbps	S-PDSO-G10	2	1.1 mm	3 mm		e3	40	260	3 mm
ATSAMB11-XR2100A	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	49	HLGA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.6 V		GRID ARRAY, HEAT SINK/SLUG				85 Cel	-40 Cel		BOTTOM		R-XBGA-N49		1.4 mm	4.5 mm					5.5 mm
MRF24J40T-I/ML	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N40	1	1 mm	6 mm	Not Qualified	e3	40	260	6 mm
PM5990B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B1932
MAX24188ETK2	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		.4 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N68		.8 mm	8 mm		e3			8 mm
T5761-TGS	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20		2.6 mm	7.4 mm	Not Qualified	e0			12.825 mm
T5761-TGQ	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G20	2	2.6 mm	7.4 mm	Not Qualified	e3			12.825 mm
ATZB-RF-233-1-CR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	42		RECTANGULAR	UNSPECIFIED	YES	1			3 V		MICROELECTRONIC ASSEMBLY			1 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N42		3.2 mm	20 mm					25 mm
PM5440B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1894	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B1894
ATBTLC1000A-MU-T	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1 Mbps	S-XQCC-N32		1 mm	4 mm		e3			4 mm
BM70BLE01FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3 V		MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N30		.66 mm	12 mm					15 mm
KSZ8695X	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD		S-PQFP-G208		4.1 mm	28 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	28 mm
MCP2150-I/SO	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	TS 16949	3.3 V		SMALL OUTLINE	SOP18,.4		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G18	2	2.64 mm	7.49 mm	Not Qualified	e3	40	260	17.87 mm
PM5981B-FEI	Microchip Technology	TELECOM CIRCUIT		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	1					GRID ARRAY							BOTTOM		S-PBGA-B1932
SY88053CLMG-TR	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1250 Mbps	S-XQCC-N16	2	.9 mm	3 mm		e4	40	260	3 mm
VSC8484YJP	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		GRID ARRAY			1 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B324		2.74 mm	18.6 mm					18.6 mm
ZL30100QDG1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		FLATPACK, THIN PROFILE, FINE PITCH	PQFP64,.40SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G64	1	1.2 mm	10 mm		e3		260	10 mm
ZL30102QDG1	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		FLATPACK, THIN PROFILE, FINE PITCH	PQFP64,.40SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G64		1.2 mm	10 mm		e3			10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.