NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
SA3600	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified	e4			7.8 mm
NT2H1611F0DTL	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	4	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	-25 Cel		DUAL		R-PDSO-N4		.5 mm	1.5 mm					2 mm
UXF23460	NXP Semiconductors
SA571D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4.8 mA	6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
NE570N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			4.8 mA	6 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T16		4.2 mm	7.62 mm	Not Qualified				19.025 mm
935260091112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1		4 mm	Not Qualified	e4			8.75 mm
SA5217D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			13.5 mA	5 V	5	SMALL OUTLINE	SOP20,.4	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
SL3S1002AC0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	DIE	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-PUUC-N2				Not Qualified
SL3S1214FTB0/1	NXP Semiconductors	TELECOM CIRCUIT
NT2H1511G0DA8	NXP Semiconductors	TELECOM CIRCUIT
SL3S1213FUD/G/BG,0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL								CMOS		.265 mA	1.8 V	1.8		DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
NT2H1311G0DUF	NXP Semiconductors	TELECOM CIRCUIT
SL3S1214FUD/BG1	NXP Semiconductors	TELECOM CIRCUIT
SL3S1203FUF/G,005	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		.265 mA	1.8 V	1.8	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N4				Not Qualified
QN9080DHN	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		1 mm	6 mm					6 mm
PCD3316T/2D	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0			10.3 mm
BGX7100HN/1,118	NXP Semiconductors			NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES					5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm				QUAD		S-PQCC-N24	1			Not Qualified			260
NE5751N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			5 V		IN-LINE				70 Cel	0 Cel		DUAL		R-PDIP-T24				Not Qualified
935408659518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm					6 mm
SA5211D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G14	1	1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
935294405003	NXP Semiconductors	TELECOM CIRCUIT
PCF87852E	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	73	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V	1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA73,12X12,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B73		1.3 mm	7 mm	Not Qualified		40	260	7 mm
PCA5075	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE				70 Cel	-40 Cel		DUAL		R-PDSO-G20				Not Qualified
SA575ADK-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-G20				Not Qualified
PCF5078T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.1 mm	3 mm	Not Qualified				3 mm
88W8801-B0-NMDC/AZ	NXP Semiconductors	TELECOM CIRCUIT																								3						260
SA5222D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.012 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SA1620BE-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			90 mA	3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
P51XASCCB	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK							QUAD		S-PQFP-G100				Not Qualified
NE571D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4.8 mA	6 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
935266812118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
935275292112	NXP Semiconductors	TELECOM CIRCUIT
NXH3670SDKUL	NXP Semiconductors	TELECOM CIRCUIT																								1						260
HTRM800/CED	NXP Semiconductors	TELECOM CIRCUIT	OTHER					PLASTIC/EPOXY				-15 V	.55 mA	15 V	+-15	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs		70 Cel	-25 Cel								Not Qualified
AW-XM455MA	NXP Semiconductors	TELECOM CIRCUIT
UAA3558HL	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3	FLATPACK	QFP32,.28SQ,20	Other Telecom ICs	.5 mm	50 Cel	-10 Cel	TIN	QUAD		S-PQFP-G32				Not Qualified	e3
NE5900D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified				10.3 mm
SA5212AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		.033 mA	5 V	5	IN-LINE	DIP8,.3	Other Telecom ICs	2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8	1	4.2 mm	7.62 mm	Not Qualified				9.5 mm
PCD6001U	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD			UNSPECIFIED	UNSPECIFIED	YES	1				2.5 V		UNCASED CHIP				70 Cel	-25 Cel		UPPER		X-XUUC-N				Not Qualified
TZA3043T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
TZA3033T/C3	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SA5214D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
UAA2072M-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			4.8 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
935263632518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		2 mm	5.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	8.2 mm
SL3S1213FUF/G,003	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		.265 mA	1.8 V	1.8	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N4				Not Qualified
SA575ADK	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-G20				Not Qualified
TEF6657HN/V102Y	NXP Semiconductors	TELECOM CIRCUIT																				NICKEL PALLADIUM GOLD				3				e4	30	260
935201030118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.