NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

TDA8044H/C2

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

.65 mm

70 Cel

0 Cel

QUAD

R-PQFP-G100

3.2 mm

14 mm

Not Qualified

20 mm

NE575K

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

70 Cel

0 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

TZA3033T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

5

SMALL OUTLINE

SOP8,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

Not Qualified

e4

SL3S1002FTB1

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BUTT

3

BCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

CHIP CARRIER

.55 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-PBCC-B3

1

.5 mm

1 mm

Not Qualified

e3

1.45 mm

TFF11086HN/N1,111

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1

1 mm

4 mm

260

4 mm

935059610112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

SL3S1213FUF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

4

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

1.8 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N4

Not Qualified

P5DF081X0/T1AR1070S

NXP Semiconductors

TELECOM CIRCUIT

MC71000

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BALL

100

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.35 mm

7 mm

7 mm

TDA8044H

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

.65 mm

70 Cel

0 Cel

QUAD

R-PQFP-G100

3.2 mm

14 mm

Not Qualified

20 mm

TEA1094T-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

4.4 mA

5 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

17.9 mm

935266813118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

5 mm

SA5217D/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

2.65 mm

7.5 mm

Not Qualified

e4

12.8 mm

NTP52101G0JHKZ

NXP Semiconductors

1

260

SA5211D/01,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e4

8.65 mm

NE5900DK-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

10.3 mm

SL3S1213FUD/BG,003

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

CMOS

.265 mA

1.8 V

1.8

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

Not Qualified

935272973005

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TEA1083AT-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

0 V

3.6 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

10.3 mm

MWCT1001AVLHR

NXP Semiconductors

TELECOM CIRCUIT

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

105 Cel

-40 Cel

TIN

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

e3

40

260

10 mm

935290998003

NXP Semiconductors

TELECOM CIRCUIT

PCD6003U

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

UNSPECIFIED

UNSPECIFIED

YES

1

2.5 V

UNCASED CHIP

70 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

TEA1081/C2

NXP Semiconductors

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

4 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T8

4.2 mm

7.62 mm

Not Qualified

9.5 mm

TDA18275HN/C1,518

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER

-20 Cel

QUAD

S-PQCC-N32

BTS6201U

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

.5 mm

105 Cel

-40 Cel

QUAD

S-PQCC-N16

1 mm

3 mm

3 mm

SLRC61002HN/TRAYBM

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

TEF6657HN/V101

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3.3 V

CHIP CARRIER

85 Cel

-40 Cel

QUAD

S-PQCC-N32

934066567115

NXP Semiconductors

TELECOM CIRCUIT

NCF29AEMHN4/0100IY

NXP Semiconductors

TELECOM CIRCUIT

2A

260

TFF11094HN/N1,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

88W8801-B0-NMDI/AZ

NXP Semiconductors

TELECOM CIRCUIT

3

260

SL3S1203AC2

NXP Semiconductors

TELECOM CIRCUIT

OTHER

UNSPECIFIED

2

UNSPECIFIED

PLASTIC/EPOXY

NO

1

CMOS

1.8 V

SPECIAL SHAPE

70 Cel

-40 Cel

UNSPECIFIED

X-PXSS-X2

935262794557

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

100

QFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK

.65 mm

70 Cel

0 Cel

QUAD

R-PQFP-G100

3.2 mm

14 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

20 mm

TDA8012AM

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-10 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

935260062118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

2.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X

Not Qualified

TEA1094AT

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

4.4 mA

5 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G24

2.65 mm

7.5 mm

Not Qualified

e4

15.4 mm

SL3ICS1202FUG/V7AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N8

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

P5DF081X0/T1AD2060S

NXP Semiconductors

TELECOM CIRCUIT

TFF1024HN/N1,115

NXP Semiconductors

RF AND BASEBAND CIRCUIT

NO LEAD

16

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1X.14,20

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N16

1

1 mm

2.5 mm

260

3.5 mm

935272974118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

WLAN8101CMP

NXP Semiconductors

TELECOM CIRCUIT

NICKEL GOLD

3

e4

30

260

TEA1094AM-T

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

4.4 mA

5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

8.2 mm

SL3ICS3001FW/V7

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N

935260219122

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

2.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

SA1620BE

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

90 mA

3 V

3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

7 mm

TFF11092HN/N1

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1

1 mm

4 mm

260

4 mm

935202090026

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

X-XUUC-N

Not Qualified

SL3S1002FTT,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G8

1

1.1 mm

3 mm

Not Qualified

30

260

3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.