NXP Semiconductors Other Function Telecom Interface ICs 1,402

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

UAA2072MDK

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4.8 V

SMALL OUTLINE

70 Cel

-20 Cel

DUAL

R-PDSO-G20

Not Qualified

OL2385AHN/00100

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N48

1 mm

7 mm

7 mm

WCT-15W1CFFPD

NXP Semiconductors

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

MS140132KT

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

1

85 Cel

-40 Cel

Not Qualified

935263881112

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

28

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G28

2 mm

5.3 mm

Not Qualified

10.2 mm

QN9022

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N40

.9 mm

5 mm

5 mm

TEF6659HN/V102Y

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

SL3S1203FTB0,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.265 mA

1.8 V

1.8

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

1

.5 mm

1 mm

Not Qualified

e3

30

260

1.45 mm

SL3S1002AC0,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

Not Qualified

TFF11115HN/N1,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

SL3S1014FUD/BG1Z

NXP Semiconductors

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

UAA3515A

NXP Semiconductors

BGU8004X

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.22 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B6

1

.32 mm

.44 mm

260

.65 mm

TZA3013AU

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

15

DIE

RECTANGULAR

UNSPECIFIED

YES

1

MOS

.038 mA

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-XUUC-N15

Not Qualified

TFF1024HN

NXP Semiconductors

RF AND BASEBAND CIRCUIT

NO LEAD

16

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1X.14,20

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N16

1 mm

2.5 mm

3.5 mm

935263530112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.1 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

UAA3558HN

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

3 V

CHIP CARRIER

50 Cel

-10 Cel

TIN/NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

Not Qualified

e3/e4

SA575K

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SL3S1014FUD/BG1

NXP Semiconductors

935262696112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

9.9 mm

935285223551

NXP Semiconductors

TELECOM CIRCUIT

935266812112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

9.9 mm

TDA8003TSDB-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

Not Qualified

40

260

8.2 mm

935284368005

NXP Semiconductors

TELECOM CIRCUIT

88W8987-A2-NYEE/AK

NXP Semiconductors

TELECOM CIRCUIT

3

NOT SPECIFIED

260

SLRC61002HN/T/R

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-25 Cel

QUAD

S-PQCC-N32

1 mm

5 mm

5 mm

TZA3023T-T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

e4

4.9 mm

935275263112

NXP Semiconductors

TELECOM CIRCUIT

SA5211D,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

40

260

8.65 mm

SA3600DH

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

7.8 mm

TZA3033U/T/C3

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N8

Not Qualified

TZA3023U/T/C3

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

13

DIE

RECTANGULAR

UNSPECIFIED

YES

1

5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N13

Not Qualified

TDA8010M

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-20 Cel

TIN LEAD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e0

6.5 mm

TDA8012AM/C1

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

80 Cel

-10 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

e4

6.5 mm

TDA8730N

NXP Semiconductors

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

9 V

IN-LINE

2.54 mm

85 Cel

-25 Cel

DUAL

R-PDIP-T16

4.7 mm

7.62 mm

Not Qualified

21.6 mm

TZA3044U/T/C2

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

29

DIE

SQUARE

UNSPECIFIED

YES

1

3.3 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

S-XUUC-N29

Not Qualified

NT2H1311F0DTL

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

4

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

70 Cel

-25 Cel

DUAL

R-PDSO-N4

.5 mm

1.5 mm

2 mm

935263971112

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL EXTENDED

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3.3 V

SMALL OUTLINE

1.27 mm

75 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

17.9 mm

TZA3043BT

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

ECL

.047 mA

5 V

3.3/5

SMALL OUTLINE

SOP8,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

Not Qualified

e4

SL3S3001FTT,118

NXP Semiconductors

TDA8040TD

NXP Semiconductors

TELECOM CIRCUIT

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

5 V

SMALL OUTLINE

1.27 mm

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

9.9 mm

935269690112

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

1

e4

30

250

QN9021/EY

NXP Semiconductors

TELECOM CIRCUIT

3

260

NT2H1611F0DTL,125

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

4

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE, VERY THIN PROFILE

.5 mm

70 Cel

-25 Cel

DUAL

R-PDSO-N4

.5 mm

1.5 mm

2 mm

935262696118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

9.9 mm

TFF11086HN

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

TEA1081TD

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

4 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

TFF1007HN

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N24

1 mm

4 mm

4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.