NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TEA1081N	NXP Semiconductors	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified				9.5 mm
935272976118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP				85 Cel	-25 Cel		UPPER		X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
QN9083DUK	NXP Semiconductors	TELECOM CIRCUIT		BALL	47	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA47,6X7,16		.4 mm	85 Cel	-40 Cel		BOTTOM	2 Mbps	R-XBGA-B47		.395 mm	3.2 mm					3.28 mm
TEA1081TD-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
TZA3044BU/T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified
SA5212AD/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
PR601HL/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	-25 Cel		QUAD		S-PQFP-G100		1.6 mm	14 mm					14 mm
SL3S1014FUD/BG	NXP Semiconductors	TELECOM CIRCUIT
PCF5075T/F2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
TZA3033U/G	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N15				Not Qualified
NCF29AEMHN4/0100ZY	NXP Semiconductors	TELECOM CIRCUIT																								2A						260
SL3ICS3001FW/V4	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1						UNCASED CHIP							UPPER		X-XUUC-N
UAA2072MDK-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.8 V		SMALL OUTLINE				70 Cel	-20 Cel		DUAL		R-PDSO-G20				Not Qualified
OL2300NHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	16	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N16		1 mm	3 mm	Not Qualified				3 mm
935280537118	NXP Semiconductors	TELECOM CIRCUIT
NE575ADK	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL		R-PDSO-G20				Not Qualified
TEF7000HN/V2,557	NXP Semiconductors
935263971118	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
TDA8051T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			5 V	5	SMALL OUTLINE	SOP32,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified				20.5 mm
935030750602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
PT5010A0HN/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32		1 mm	5 mm					5 mm
935051630602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
NE570F	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			4.8 mA	6 V		IN-LINE				70 Cel	0 Cel		DUAL		R-GDIP-T16				Not Qualified
TZA3013BU	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	15	DIE	RECTANGULAR	UNSPECIFIED	YES	1	MOS		.038 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel		UPPER		R-XUUC-N15				Not Qualified
935296172003	NXP Semiconductors	TELECOM CIRCUIT
MS140131KT	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL							1				3.3 V						85 Cel	-40 Cel								Not Qualified
TZA3043U	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BICMOS			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified
SL3S1013FUD/BG	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS			1.8 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N4
TZA3023TD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
NT2H1511G0DUF	NXP Semiconductors	TELECOM CIRCUIT
935166750118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
TZA3043T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		.062 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8				Not Qualified	e4
TDA10025HN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N48		1 mm	7 mm					7 mm
NCF3320AHN/0Y	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG				85 Cel	-40 Cel		QUAD		R-XQCC-N32
XSA5223CU	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1				5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		X-XUUC-N				Not Qualified
SL3S1204FUD/BG1V	NXP Semiconductors	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
UAA3202M	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			4.7 mA	3.5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified	e4			7.2 mm
TDA18275HN/C1E	NXP Semiconductors	TELECOM CIRCUIT																								3						260
SA58646BD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Tin (Sn)	QUAD		S-PQFP-G64	1	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
TDA10026HN/C1,551	NXP Semiconductors	TELECOM CIRCUIT																								3						260
PCD3316T/2,112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0	NOT SPECIFIED	NOT SPECIFIED	10.3 mm
SL3S1213FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm	Not Qualified	e3			1.45 mm
BGU8006	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.85 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.22 mm	85 Cel	-40 Cel		BOTTOM		R-PBGA-B6		.32 mm	.44 mm					.65 mm
TFF11142HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
935201030112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
TEA1083	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR	0 V	.004 mA	3.6 V	3.6	IN-LINE	DIP8,.3	Telecom Signaling Circuits	2.54 mm	75 Cel	-25 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified				9.5 mm
NT2H1311F0DTL,125	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	4	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, VERY THIN PROFILE			.5 mm	70 Cel	-25 Cel		DUAL		R-PDSO-N4		.5 mm	1.5 mm					2 mm
88W8801-B0-NMDE/AK	NXP Semiconductors	TELECOM CIRCUIT																								3						260

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.