NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TEF7000HN/V2,518	NXP Semiconductors
5212A/BPA	NXP Semiconductors	TELECOM CIRCUIT	MILITARY	THROUGH-HOLE	8	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			5 V		IN-LINE			2.54 mm	125 Cel	-55 Cel		DUAL	R-GDIP-T8		5.08 mm	15.24 mm	Not Qualified
OL2385AHN/00100Y	NXP Semiconductors	TELECOM CIRCUIT																						3						260
SL3S1213FUD/BG	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		1.8 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N4
SL3S1203FUD/BG	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	RECTANGULAR	UNSPECIFIED	YES	1	CMOS		1.8 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N4
935299912005	NXP Semiconductors	TELECOM CIRCUIT
SL3S1202AC2,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL													DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel							Not Qualified
VES1848-2	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified				28 mm
UJA1023T/2R04	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL	R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
UAA2077CM-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	47.5 mA	3.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-30 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
TDA18250BHN/C1E	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD	S-PQCC-N32	3	.85 mm	5 mm				260	5 mm
P5DF081UA/T1AD2060	NXP Semiconductors	TELECOM CIRCUIT																											NOT SPECIFIED	NOT SPECIFIED
935272969118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-25 Cel		UPPER	X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
MWCT1011VLHST	NXP Semiconductors	TELECOM CIRCUIT
935065560112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified	e4			9.5 mm
TDA8012AM-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel	-10 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
P5DF081HN/T1AD2060,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER				85 Cel	-25 Cel		QUAD	S-PQCC-N32
TFF11094HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24		1 mm	4 mm					4 mm
UXF23480	NXP Semiconductors
TDA8050TD-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified	e0			20.5 mm
SA5753DK	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
SAA1575	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	S-PQFP-G100		1.6 mm	14 mm	Not Qualified				14 mm
SL3S1203FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		1.8 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	DUAL	R-PDSO-N6	1	.5 mm	1 mm	Not Qualified	e3			1.45 mm
PNX4902	NXP Semiconductors
SA5753K-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
SA575AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE				85 Cel	-40 Cel		DUAL	R-PDIP-T20				Not Qualified
QN9021	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N32		.8 mm	5 mm					5 mm
TZA3043U/T/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1			5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-XUUC-N13				Not Qualified
SL3S1204FTB0/1X	NXP Semiconductors	TELECOM CIRCUIT																			TIN			1				e3	30	260
SA5750D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm
TDA10026HN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD	S-PQCC-N64		1 mm	9 mm					9 mm
SA5212AD/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4			4.9 mm
OL2311AHN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			2.7 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD	S-PQCC-N32	3	.85 mm	5 mm					5 mm
TFF11142HN/N1,111	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm				260	4 mm
SL3S1203FUD/BG,005	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL								CMOS	.265 mA	1.8 V	1.8		DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel							Not Qualified
935264535557	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G208		4.1 mm	28 mm	Not Qualified				28 mm
935296148003	NXP Semiconductors	TELECOM CIRCUIT
MWCT1111CLH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK				85 Cel	-40 Cel	TIN	QUAD	S-PQFP-G64	3				e3	40	260
HTRM310	NXP Semiconductors	TELECOM CIRCUIT	OTHER					PLASTIC/EPOXY					5 V	5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs		70 Cel	-25 Cel							Not Qualified
SL3S1202AC2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	DIE	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				UNCASED CHIP				85 Cel	-40 Cel		UPPER	R-PUUC-N2				Not Qualified
TFF11086HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24	1	1 mm	4 mm				260	4 mm
SA571F	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1		4.8 mA	6 V		IN-LINE				85 Cel	-40 Cel		DUAL	R-GDIP-T16				Not Qualified
88W8987-A2-NYEI/AZ	NXP Semiconductors	TELECOM CIRCUIT																						3					NOT SPECIFIED	260
TZA3044BU/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1			3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER	S-XUUC-N29				Not Qualified
TFF11101HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N24		1 mm	4 mm					4 mm
935233940122	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	PLASTIC/EPOXY	YES	1					SPECIAL SHAPE				85 Cel	-40 Cel		UNSPECIFIED	R-PXSS-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
TDA8051TD-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL	R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified				20.5 mm
NE5225D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL	R-PDSO-G16				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.