NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
NT2H1311TTDUD	NXP Semiconductors	TELECOM CIRCUIT
TDA8010AM	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	80 Cel	-20 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified					6.5 mm
PCF5075TDK-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified					6.5 mm
SA9024	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS				3.75 V	3.75	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e3			7 mm
TZA3043T-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
SL3S3001FTT	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							SMALL OUTLINE							DUAL		R-PDSO-G8
NT2H1511G0DA8J	NXP Semiconductors	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
SL3S1204FUD/BG1	NXP Semiconductors	TELECOM CIRCUIT
MWCT1200CFM	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER				85 Cel	-40 Cel	TIN	QUAD		S-XQCC-N32	3					e3	40	260
TZA3044BT	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	ECL			.049 mA	3.3 V	3.3	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16				Not Qualified		e4
TFF11101HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm					260	4 mm
NE575AD	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL		R-PDSO-G20				Not Qualified
PCF5077T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified					5.2 mm
SA5753D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified					12.8 mm
935263011112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL		R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	10.3 mm
TEA1094ATD-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.4 mA	5 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL		R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified					15.4 mm
SL3S1203AC0,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL											.265 mA	1.8 V	1.8		DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
935051630118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified		e4			12.8 mm
935263511026	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
NE575N	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				5.5 mA	5 V		IN-LINE			2.54 mm	70 Cel	0 Cel		DUAL		R-PDIP-T20		4.2 mm	7.62 mm	Not Qualified					26.73 mm
TDA8041H	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1					5 V		FLATPACK			.8 mm	70 Cel	0 Cel		QUAD		S-PQFP-G44		2.1 mm	10 mm	Not Qualified					10 mm
TDA8050T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				5 V	5	SMALL OUTLINE	SOP32,.4	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified		e0			20.5 mm
TEA1085	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BIPOLAR		0 V		4.2 V		IN-LINE			2.54 mm	75 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T24		5.1 mm	15.24 mm	Not Qualified		e3/e4			31.7 mm
SLRC61003HNY	NXP Semiconductors	TELECOM CIRCUIT																					NICKEL PALLADIUM GOLD SILVER				2					e4	30	260
PC33660BEFR2	NXP Semiconductors	TELECOM CIRCUIT
935261032118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		2 mm	5.3 mm	Not Qualified			40	260	8.2 mm
NE570D-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.8 mA	6 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified					10.3 mm
SL3S1013FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	PURE TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm						1.45 mm
935279948118	NXP Semiconductors	TELECOM CIRCUIT
935296167003	NXP Semiconductors	TELECOM CIRCUIT
TZA3023T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.05 mA	5 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		e4			4.9 mm
TDA8730	NXP Semiconductors	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					9 V		IN-LINE				85 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16				Not Qualified		e3/e4
SL3S1202AC0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	2	DIE	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-PUUC-N2				Not Qualified
P5DF081HN/T1AR1070	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD	1.5 Mbps	S-PQCC-N32	1	.85 mm	5 mm		ALSO AVAILABLE WITH 5V NOMINAL SUPPLY	e4		260	5 mm
UAA3201TD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES							3.5/6	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16				Not Qualified
BGW200EG	NXP Semiconductors		OTHER	NO LEAD	68	QCCN	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS			.12 mA		1.8,2.8	CHIP CARRIER	LCC68,.4X.6,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		QUAD		R-PQCC-N68				Not Qualified
TZA3044U/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1					3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified
SAA1575-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD		S-PQFP-G100		1.6 mm	14 mm	Not Qualified					14 mm
TZA3043U/C2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified
SA647DH,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.1 mm	4.4 mm	Not Qualified		e4			6.5 mm
TEA1094ATD	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				4.4 mA	5 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL		R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified					15.4 mm
935266810026	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	29	DIE	SQUARE	UNSPECIFIED	YES	1					3.3 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		S-XUUC-N29				Not Qualified			NOT SPECIFIED	NOT SPECIFIED
SJA1105TEL,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B159		1.5 mm	12 mm						12 mm
88W8977-A1-NMVI/AZ	NXP Semiconductors	TELECOM CIRCUIT
SA5212AD,623	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified			40	260	4.9 mm
TEA1094AM	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			4.4 mA	5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL		R-PDSO-G24		2 mm	5.3 mm	Not Qualified					8.2 mm
SA5223D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
MRFIC1505AR2	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified		e0			7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.