NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TEF6659HN/V102K	NXP Semiconductors	TELECOM CIRCUIT																					NICKEL PALLADIUM GOLD				3				e4	30	260
935290278005	NXP Semiconductors	TELECOM CIRCUIT
TZA3023U	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified
SL3S1204FTB0/1	NXP Semiconductors	TELECOM CIRCUIT
WLAN3002CZ	NXP Semiconductors	TELECOM CIRCUIT
TFF11139HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
UAA1570HL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48		1.6 mm	7 mm	Not Qualified				7 mm
SA5212AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.033 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		40	260	4.9 mm
TDA18250AHN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER							QUAD		S-PQCC-N32
SL3S1013FUD/BG,003	NXP Semiconductors	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
PCD5094H	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm				QUAD		R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SL3S1204FUD2/BG1A	NXP Semiconductors	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
935240740118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		2 mm	5.3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.2 mm
SJA1105EL,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100			1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B159		1.5 mm	12 mm					12 mm
SL3S1003FTB0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N6	1	.5 mm	1 mm		e3			1.45 mm
MS140131KT/D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	44	LQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				5 V		FLATPACK			.8 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G44		1.6 mm	10 mm	Not Qualified				10 mm
HTRM800/AED,122	NXP Semiconductors	TELECOM CIRCUIT	OTHER					PLASTIC/EPOXY					-15 V	.55 mA	15 V	+-15	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs		70 Cel	-25 Cel								Not Qualified
935296173003	NXP Semiconductors	TELECOM CIRCUIT
NT2H1311G0DA8J	NXP Semiconductors	TELECOM CIRCUIT																														NOT SPECIFIED	NOT SPECIFIED
OL2385AHN/001C0Y	NXP Semiconductors	TELECOM CIRCUIT																									3						260
TZA3043BU/G	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	13	DIE	RECTANGULAR	UNSPECIFIED	YES	1					5 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N13				Not Qualified
PCD5093H-T	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						FLATPACK			.65 mm				QUAD		R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
MWCT1011VLH	NXP Semiconductors	TELECOM CIRCUIT
TEF7000HN/V2S,518	NXP Semiconductors
SL3ICS3001FW/F1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	8		RECTANGULAR	UNSPECIFIED	YES								UNCASED CHIP							UPPER		R-XUUC-N8				Not Qualified
SA5211D,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			.031 mA	5 V	5	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified		40	260	8.65 mm
WLAN8101C	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	38	HLGA	RECTANGULAR	UNSPECIFIED	YES	1					3.85 V		GRID ARRAY, HEAT SINK/SLUG	LGA38(UNSPEC)		.35 mm	85 Cel	-40 Cel		BOTTOM		R-XLGA-N38		.685 mm	3 mm					4 mm
935275263118	NXP Semiconductors	TELECOM CIRCUIT
SL3S1001FTT	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1							SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e4	30	260	3 mm
TEA1085T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		0 V		4.2 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified	e4			15.4 mm
935263530118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.1 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	5 mm
PCA1070P	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS			.0001 mA	5 V	3/5	IN-LINE	DIP24,.6	Telephone Circuits	2.54 mm	60 Cel	-10 Cel		DUAL		R-PDIP-T24				Not Qualified
TDA10026HN/C1,557	NXP Semiconductors	TELECOM CIRCUIT																									3						260
SL2ICS1101DW/V1,00	NXP Semiconductors
935054340118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
P5DF081UA/T1AR1070	NXP Semiconductors	TELECOM CIRCUIT
SA5214D,623	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				41.2 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
88W9097-B1-NYH2C000-P123	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	114	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.05 V		CHIP CARRIER, HEAT SINK/SLUG	LCC114,.04SQ,16		.4 mm	70 Cel	0 Cel		QUAD	1200 Mbps	S-XQCC-N114		.9 mm	10 mm					10 mm
935288708005	NXP Semiconductors	TELECOM CIRCUIT
SA5224D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
UAA2077BM	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			33.5 mA	4 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
OL2385AHN/001A0Y	NXP Semiconductors	TELECOM CIRCUIT																									3						260
TEA1094PN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				4.4 mA	5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL		R-PDIP-T28		5.1 mm	15.24 mm	Not Qualified				35.5 mm
935051650112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified	e0			6.5 mm
TDA18250BHN/C1K	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N32	3	.85 mm	5 mm				260	5 mm
935290999003	NXP Semiconductors	TELECOM CIRCUIT
SL3S1202AC0,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL															DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified
SL3S1202FTB1,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS						CHIP CARRIER	LCC3(UNSPEC)	Other Telecom ICs	.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3	30	260	1.45 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.