NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
PN5180A0HN/C4Y	NXP Semiconductors	TELECOM CIRCUIT																				NICKEL PALLADIUM GOLD				3				e4	30	260
SL2S2102FTB,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N3	1	.5 mm	1 mm		e3	30	260	1.45 mm
PN5120A0HN/C2,518	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified	e4	30	260
SA612AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SA639DH/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm	4.4 mm	Not Qualified	e4		260	7.8 mm
PN5120A0ET/C2QL	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified			260
SA606DK,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
SA639DH/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	1.1 mm	4.4 mm		e4	30	260	7.8 mm
SA639DH,512	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified		40	260	7.8 mm
SA639DH,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified				7.8 mm
SA639DH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.01 mA	3 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24		1.1 mm	4.4 mm	Not Qualified		40	260	7.8 mm
OL2381AHN/C0B,515	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.0012 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	2A	.85 mm	5 mm	Not Qualified			260	5 mm
PN7161B1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT																								3					NOT SPECIFIED	260
QN9080CHN	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-PQCC-N48		1 mm	6 mm					6 mm
SL2S2102FUD,003	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	4	DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS					UNCASED CHIP				85 Cel	-40 Cel		UPPER		X-XUUC-N4						NOT SPECIFIED	NOT SPECIFIED
QN9021/DY	NXP Semiconductors	TELECOM CIRCUIT																								3						260
SA616BS,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N20	1	1 mm	4 mm			30	260	4 mm
TFF11145HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
PN5120A0HN/C2	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER			.5 mm				QUAD		S-PQCC-N40		1 mm	6 mm	Not Qualified				6 mm
PN5120A0HN1/C1	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN/NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified	e3/e4			5 mm
PN5180A0HN/C1E	NXP Semiconductors	TELECOM CIRCUIT																				NICKEL PALLADIUM GOLD				3				e4	30	260
SA616DK	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		40	260	6.5 mm
SA636BS,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, VERY THIN PROFILE	LCC20,.16SQ,20		.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N20	1	1 mm	4 mm			30	260	4 mm
SA636DK/02J	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm		e4	30	260	6.5 mm
TFF11139HN/N1,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24	1	1 mm	4 mm				260	4 mm
CLRC632	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE							DUAL		R-PDSO-G32
CLRC63201T/0FE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm	Not Qualified	e4	30	250	20.5 mm
HT2MOA4S20/E/3/RJ	NXP Semiconductors	TELECOM CIRCUIT						PLASTIC/EPOXY			HYBRID					MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs				SILVER							Not Qualified	e4
MFRC53101T/0FE	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G32		2.65 mm	7.5 mm	Not Qualified				20.5 mm
PN5180A0HN/C4E	NXP Semiconductors	TELECOM CIRCUIT																				NICKEL PALLADIUM GOLD				3				e4	30	260
PN7160A1EV/C100Y	NXP Semiconductors	TELECOM CIRCUIT																								3					NOT SPECIFIED	260
PN7161A1EV/C100K	NXP Semiconductors	TELECOM CIRCUIT																								3					NOT SPECIFIED	260
SA606D/01,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
SL3S1003FTB0,115	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6		.5 mm	1 mm					1.45 mm
SL3S4021FHKH	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.6	CHIP CARRIER	LCC8,.06SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N8	1			Not Qualified	e4	30	260
HTSH4801ETK,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	2	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE	LCC2(UNSPEC)	Other Telecom ICs		85 Cel	-25 Cel		DUAL		R-PDSO-N2	1			Not Qualified		30	260
MC33660EF	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-N8		1.75 mm	3.9 mm					4.9 mm
NXH3670UK/A1Z	NXP Semiconductors	TELECOM CIRCUIT																								1						260
PN5120A0ET/C2J	NXP Semiconductors		OTHER	BALL	64	FBGA	SQUARE	PLASTIC/EPOXY	YES				100 mA		3/3.3	GRID ARRAY, FINE PITCH	BGA64,8X8,25	Other Telecom ICs	.635 mm	85 Cel	-30 Cel		BOTTOM		S-PBGA-B64	1			Not Qualified			260
SA606DK	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		40	260	6.5 mm
SA606DK,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		40	260	6.5 mm
SLRC61003HNE	NXP Semiconductors	TELECOM CIRCUIT																				NICKEL PALLADIUM GOLD SILVER				2				e4	30	260
88W8987-A2-NYEE/AZ	NXP Semiconductors	TELECOM CIRCUIT																								3					NOT SPECIFIED	260
HT2MOA2S20/E/3,118	NXP Semiconductors	TELECOM CIRCUIT						PLASTIC/EPOXY			HYBRID					MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Other Telecom ICs											Not Qualified
SR040HN/B02BY	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40	2A	1 mm	6 mm				260	6 mm
MC33742PEP/R2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V	5.5/18	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		Network Interfaces	.5 mm	125 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N48	3	.9 mm	7 mm	Not Qualified	e3	40	260	7 mm
SJA1105TEL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B159	3	1.5 mm	12 mm		e1		260	12 mm
MFRX85201HD/RRFFO	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	48	QCCN	SQUARE	PLASTIC/EPOXY	YES	1						CHIP CARRIER				85 Cel	-25 Cel		QUAD		S-PQCC-N48				Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.