NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CLRC66302HN,157	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel		QUAD	1 Mbps	S-PQCC-N32	1	1 mm	5 mm				30	260	5 mm
PN5120A0HN1/C1,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		260	5 mm
PN7161A1HN/C100E	NXP Semiconductors	TELECOM CIRCUIT																								3						NOT SPECIFIED	260
SA612AN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified			40	250	9.5 mm
SA612AN,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified			40	250	9.5 mm
CLRC66301HN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32		1 mm	5 mm				NOT SPECIFIED	NOT SPECIFIED	5 mm
PN7160B1HN/C100E	NXP Semiconductors	TELECOM CIRCUIT																								3						NOT SPECIFIED	260
SA616DK/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified		e4		260	6.5 mm
HTSH5601ETK,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	2	SON	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE	LCC2(UNSPEC)	Other Telecom ICs		85 Cel	-25 Cel		DUAL		R-PDSO-N2	1			Not Qualified			30	260
PN5120A0HN1/C1,157	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified		e4		260	5 mm
SA636DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP20,.25		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified		e4	30	260	6.5 mm
SJA1105EL	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B159	3	1.5 mm	12 mm			e1	30	260	12 mm
MFRC63002HN,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm				30	260	5 mm
PN5180A0HN/C3E	NXP Semiconductors	TELECOM CIRCUIT																				NICKEL PALLADIUM GOLD				3					e4	30	260
SA602AD	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	4.9 mm
PN5120A0HN1/C2	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER			.5 mm				QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified					5 mm
MFRC52302HN1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm			e4	30	260	5 mm
SA606DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G20	1	1.5 mm	4.4 mm			e4	30	260	6.5 mm
PN5190B1HN/C121E	NXP Semiconductors	TELECOM CIRCUIT																								3							260
PN5190B1HN/C121Y	NXP Semiconductors	TELECOM CIRCUIT																								3							260
CLRC63201T/0FE,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G32	1	2.65 mm	7.5 mm					250	20.5 mm
PN7160B1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.23SQ,20		.5 mm	85 Cel	-25 Cel		QUAD	.848 Mbps	S-PQCC-N40	3	1 mm	6 mm		ALSO AVAILABLE WTH 3.3 SUPPLY			260	6 mm
SA602AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified					4.9 mm
SA612AN/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	8	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1				6 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T8		4.2 mm	7.62 mm	Not Qualified		e4			9.5 mm
PN5120A0HN/C2,551	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified		e4	30	260
PN7160A1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT																								3						NOT SPECIFIED	260
SA616DK/01	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified					6.5 mm
SL2S2002FTB	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	3	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					SMALL OUTLINE, VERY THIN PROFILE			.55 mm	85 Cel	-40 Cel	TIN	DUAL		R-PDSO-N3	1	.5 mm	1 mm	Not Qualified		e3	30	260	1.45 mm
UJA1023T/2R04/C,512	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm						9.9 mm
PN5190B1EV/C121E	NXP Semiconductors	TELECOM CIRCUIT																								3							260
PN5190B1EV/C121Y	NXP Semiconductors	TELECOM CIRCUIT																								3							260
PN7161B1HN/C100E	NXP Semiconductors	TELECOM CIRCUIT																								3						NOT SPECIFIED	260
PN5120A0HN/C2,557	NXP Semiconductors		OTHER	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES						1.8/3.3,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N40	3			Not Qualified		e4	30	260
PN7160B1EV/C100K	NXP Semiconductors	TELECOM CIRCUIT																								3						NOT SPECIFIED	260
SA602AD-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			6 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm						4.9 mm
NTP52101G0JTZ	NXP Semiconductors																									1							260
QN9020/DY	NXP Semiconductors	TELECOM CIRCUIT																								3							260
MC33660BEFR2	NXP Semiconductors	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	125 Cel	-40 Cel	TIN	DUAL		R-PDSO-G8	3	1.75 mm	3.9 mm			e3	40	260	4.9 mm
PN5180A0HN/C3Y	NXP Semiconductors	TELECOM CIRCUIT																				NICKEL PALLADIUM GOLD				3					e4	30	260
MFRC63002HN,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm				30	260	5 mm
PN7161A1HN/C100Y	NXP Semiconductors	TELECOM CIRCUIT																								3						NOT SPECIFIED	260
SA5224D	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.035 mA	5 V	5	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified					9.9 mm
HT2DC20S20/F/RSP	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	PLASTIC/EPOXY	YES	1	HYBRID					SPECIAL SHAPE	MODULE(UNSPEC)	Other Telecom ICs		85 Cel	-40 Cel	SILVER	UNSPECIFIED		R-PXSS-N				Not Qualified		e4
MC12311CHN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	60	LGA	SQUARE	PLASTIC/EPOXY	YES						2/3.3	GRID ARRAY	LGA60,16X16,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL GOLD	BOTTOM		S-PBGA-N60	3			Not Qualified		e4	40	260
MFRC63002HN	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm						5 mm
MFRC63002HN,157	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm				30	260	5 mm
MFRC63003HNY	NXP Semiconductors	TELECOM CIRCUIT																				NICKEL PALLADIUM GOLD SILVER				2					e4	30	260
PN5180A0HN/C2Y	NXP Semiconductors	TELECOM CIRCUIT																								3							260

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.