NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
UAA3201T/V1,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES					3.5/6	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G16				Not Qualified
CD8404BE	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		4.8 V	4.8	FLATPACK	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G48				Not Qualified
SA5750N	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE				85 Cel	-40 Cel		DUAL		R-PDIP-T24				Not Qualified
BGX7221HN	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N36		1 mm	6 mm					6 mm
SL3S1004FUD/BG1	NXP Semiconductors
NE575D	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel		DUAL		R-PDSO-G20		2.65 mm	7.5 mm	Not Qualified				12.8 mm
SA5217D/01,112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
935260674518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL		R-PDSO-G24				Not Qualified
SA5214D-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		41.2 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e4			12.8 mm
935054340112	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
935291432003	NXP Semiconductors	TELECOM CIRCUIT
QN9083CUK	NXP Semiconductors	TELECOM CIRCUIT		BALL	47	VFBGA	RECTANGULAR	UNSPECIFIED	YES	1			3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA47,6X7,16		.4 mm	85 Cel	-40 Cel		BOTTOM	2 Mbps	R-XBGA-B47		.395 mm	3.2 mm					3.28 mm
TDA18250BHN/C1	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER							QUAD		S-PQCC-N32
TDA18250BHN/C1Y	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N32	3	.85 mm	5 mm				260	5 mm
935299929005	NXP Semiconductors	TELECOM CIRCUIT
935272972118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-25 Cel		UPPER		X-XUUC-N				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
935285223557	NXP Semiconductors	TELECOM CIRCUIT																			NICKEL PALLADIUM GOLD				2				e4	30	260
SL3S1003FUD	NXP Semiconductors	TELECOM CIRCUIT
PCA1070T-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	60 Cel	-10 Cel		DUAL		R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified				15.4 mm
935263377025	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N8				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
PCA5010H/XXX	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.2 V		FLATPACK				55 Cel	-10 Cel		QUAD		S-PQFP-G48				Not Qualified
PCD3316T/2D-T	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G16		2.65 mm	7.5 mm	Not Qualified	e0			10.3 mm
BGX7221HN/1,518	NXP Semiconductors	TELECOM CIRCUIT		NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				QUAD		S-PQCC-N36	3	1 mm	6 mm				260	6 mm
935294404003	NXP Semiconductors	TELECOM CIRCUIT
TEA1093T-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		140 mA	3.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL		R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
88W8977-A1-NMVE/AZ	NXP Semiconductors	TELECOM CIRCUIT																							3						260
MWCT1012VLFR	NXP Semiconductors	TELECOM CIRCUIT
TEA1094AN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		4.4 mA	5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL		R-PDIP-T24		5.1 mm	15.24 mm	Not Qualified				31.7 mm
MWCT1013VLHST	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm					10 mm
935290996003	NXP Semiconductors	TELECOM CIRCUIT
TDA8044AHBA	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK			.65 mm	70 Cel	0 Cel		QUAD		R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SA5212AD,602	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.033 mA	5 V	5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified		40	260	4.9 mm
UAA3220TS/V1S,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G24	1	2 mm	5.3 mm				260	8.2 mm
TZA3044T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	ECL	.049 mA	3.3 V	3.3	SMALL OUTLINE	SOP16,.25	ATM/SONET/SDH ICs	1.27 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16				Not Qualified	e4
NT2H0301G0DUD,005	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1					UNCASED CHIP				70 Cel	-25 Cel		UPPER		X-XUUC-N
PCD5093H	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3/3.3,5	FLATPACK	QFP100,.7X.9	Other Telecom ICs	.65 mm				QUAD		R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
SA575K-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
TFF11092HN/N1X	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	1	1 mm	4 mm		e4	30	260	4 mm
TEA1094APN	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		4.4 mA	5 V		IN-LINE			2.54 mm	75 Cel	-25 Cel		DUAL		R-PDIP-T24		5.1 mm	15.24 mm	Not Qualified				31.7 mm
NE575AD-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE				70 Cel	0 Cel		DUAL		R-PDSO-G20				Not Qualified
SL3S1202FTB1	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	BUTT	3	BCC	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				CHIP CARRIER			.55 mm	85 Cel	-40 Cel	TIN	BOTTOM		R-PBCC-B3	1	.5 mm	1 mm	Not Qualified	e3			1.45 mm
BGX7100HN/1,115	NXP Semiconductors			NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES				5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm				QUAD		S-PQCC-N24	1			Not Qualified			260
88W8987-A2-NYE2A005-P123	NXP Semiconductors
TFF11142HN	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
PN7120A0EV/C1XXXX	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B49		1 mm	4 mm					4.3 mm
NE575K-T	NXP Semiconductors	TELECOM CIRCUIT	COMMERCIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel		DUAL		R-PDSO-G20		1.5 mm	4.4 mm	Not Qualified				6.5 mm
TZA3033TD-T	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G8		1.75 mm	3.9 mm	Not Qualified				4.9 mm
SL3S1203FUD/G/BG,0	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL								CMOS	.265 mA	1.8 V	1.8		DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel								Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.