OTHER Telephone Line ICs 254

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Repertory Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features Crystal Frequency (MHz) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Make-break Ratio Length

PCD3310FP

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

.2 mA

3 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T20

4.2 mm

7.62 mm

Not Qualified

1:2

26.73 mm

PCD3360PN

NXP Semiconductors

TELEPHONE RINGER CIRCUIT

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

.12 mA

5 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T16

4.7 mm

7.62 mm

Not Qualified

PCD3315PN

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T28

5.1 mm

15.24 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:2

1:1.5

PCD3347T/020

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

e4

3:2

12.8 mm

PCD3360TD

NXP Semiconductors

TELEPHONE RINGER CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.12 mA

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

10.3 mm

PCD3310ATD

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.2 mA

3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

1:1.5

17.9 mm

PCD3332-3P

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

1.8 mA

5 V

3/5

IN-LINE

DIP28,.6

Telephone Circuits

2.54 mm

70 Cel

REPERTORY

-25 Cel

DUAL

R-PDIP-T28

5.1 mm

15.24 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 3:2

3.58

2:1

35.5 mm

PCD3310PN

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

.2 mA

3 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T20

4.2 mm

7.62 mm

Not Qualified

1:2

26.73 mm

PCD3321CD

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

18

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

.4 mA

3 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-GDIP-T18

5.08 mm

7.62 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:2

1:1.5

PCD3332-2PN

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

1.8 mA

5 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T28

5.1 mm

15.24 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 3:2

2:1

35.5 mm

PCD4415ATD-T

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.9 mA

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

e4

1:1.5

12.8 mm

PCD3360T-T

NXP Semiconductors

TELEPHONE RINGER CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.14 mA

6 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

10.3 mm

PCD3344T/047

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 2:1

e4

3:2

17.9 mm

PCD3315TD-T

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:2

1:1.5

17.9 mm

PCD3322CT

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.4 mA

3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:2

1:1.5

12.8 mm

PCD3360TD-T

NXP Semiconductors

TELEPHONE RINGER CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.12 mA

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

10.3 mm

PCD3311CTD

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.9 mA

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:3

1:1

10.3 mm

PCD3344P/004

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T28

5.1 mm

15.24 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 2:1

e3/e4

3:2

35.5 mm

PCD3322CT-T

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.4 mA

3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:2

1:1.5

12.8 mm

935008900112

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

3 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T14

4.2 mm

7.62 mm

Not Qualified

40

245

19.025 mm

PCD3347P/001

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T20

4.2 mm

7.62 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 2:1

e3/e4

3:2

26.73 mm

935008910118

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G16

2.65 mm

7.5 mm

Not Qualified

40

260

10.3 mm

PCD3344P/011

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

5 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T28

5.1 mm

15.24 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 2:1

e3/e4

3:2

35.5 mm

PCD3311CPN

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

.9 mA

5 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T14

4.2 mm

7.62 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:3

1:1

19.025 mm

PCD3321CP

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

.4 mA

3 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T18

4.7 mm

7.62 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:2

1:1.5

21.6 mm

PCD3310TD

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.2 mA

3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

1:2

17.9 mm

PCD3331-1P

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T20

4.2 mm

7.62 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 2:1

3:2

26.73 mm

PCD3332-3T-T

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.8 mA

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 3:2

2:1

17.9 mm

PCD3310GP

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

.2 mA

3 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T20

4.2 mm

7.62 mm

Not Qualified

1:2

26.73 mm

PCD3325CP

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

.4 mA

3 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T18

4.7 mm

7.62 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:2

1:1.5

21.6 mm

PCD3327CT-T

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.4 mA

3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:2

1:1.5

12.8 mm

PCD3310AT-T

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.9 mA

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

1:1.5

17.9 mm

PCD3310TD-T

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.2 mA

3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

e4

1:2

17.9 mm

PCD3347T/001

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 2:1

e4

3:2

12.8 mm

PCD3315TD

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:2

1:1.5

17.9 mm

935008930112

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G8

2.65 mm

7.5 mm

Not Qualified

40

260

7.55 mm

PCD4415TD-T

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.9 mA

5 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

e4

1:2

12.8 mm

PCD3311PN

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

1.2 mA

5 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T14

4.7 mm

7.62 mm

Not Qualified

PCD3332-2TD-T

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

17.9 mm

PCD3327CU

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

NO LEAD

18

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

70 Cel

-25 Cel

UPPER

R-XUUC-N18

Not Qualified

SELECTABLE MAKE/BREAK RATIO 2:1

3:2

PCD3332-1T

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 2:1

3:2

17.9 mm

PCD3312CTD

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.9 mA

3 V

3/5

SMALL OUTLINE

SOP8,.25

Telephone Circuits

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G8

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:3

3.58

1:1

7.55 mm

PCD3310FT

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.2 mA

3 V

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

1:2

17.9 mm

PCD3324CP

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

.4 mA

3 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T18

4.7 mm

7.62 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 1:2

1:1.5

21.6 mm

PCD3360P

NXP Semiconductors

TELEPHONE RINGER CIRCUIT

OTHER

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

.14 mA

6 V

6

IN-LINE

DIP16,.3

Telephone Circuits

2.54 mm

70 Cel

-25 Cel

DUAL

R-PDIP-T16

4.2 mm

7.62 mm

Not Qualified

19.025 mm

PCD4415PN

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

.9 mA

5 V

IN-LINE

2.54 mm

70 Cel

-25 Cel

TIN/NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T18

4.7 mm

7.62 mm

Not Qualified

e3/e4

1:2

PCD3315T

NXP Semiconductors

TELEPHONE DIALER CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

1.27 mm

70 Cel

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 2:1

3:2

17.9 mm

PCD3332-2T

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT

OTHER

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.8 mA

5 V

3/5

SMALL OUTLINE

SOP28,.4

Telephone Circuits

1.27 mm

70 Cel

REPERTORY

-25 Cel

DUAL

R-PDSO-G28

2.65 mm

7.5 mm

Not Qualified

SELECTABLE MAKE/BREAK RATIO 3:2

3.58

2:1

17.9 mm

Telephone Line ICs

Telephone Line ICs are electronic components used in telephone systems to interface with the telephone line and provide necessary functionality for telephone communication. These ICs are designed to provide reliable and efficient operation of the telephone line, allowing for clear and uninterrupted communication between two devices.

Telephone Line ICs use various techniques to interface with the telephone line, including pulse dialing, dual-tone multi-frequency (DTMF) signaling, and loop current sensing. Pulse dialing is used to send a series of electrical pulses over the telephone line to dial a phone number. DTMF signaling is used to send a sequence of tones to control various telephone functions, such as call forwarding and call waiting. Loop current sensing is used to detect the presence of a telephone off-hook condition, allowing the telephone system to provide appropriate signaling and call management.

Some common features of Telephone Line ICs include:

1. Telephone line interface: Telephone Line ICs provide the necessary interface with the telephone line to enable telephone communication.

2. Signal processing: Telephone Line ICs are designed to process signals quickly and efficiently, ensuring clear and uninterrupted communication.

3. Tone generation and detection: Telephone Line ICs can generate and detect various tones used for telephone communication, such as dial tones and busy signals.

4. Call management: Telephone Line ICs can provide call management functions, such as call waiting and call forwarding.

Telephone Line ICs are used in a variety of telephone systems, including traditional landline phones, cordless phones, and PBX (Private Branch Exchange) systems. They are also used in other communication systems that require telephone line interface, such as alarm systems and security systems.